• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Journal of the Korean Solar Energy Society
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• v.39 no.5
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• pp.65-78
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• 2019

In this study, we investigated the paraffin encapsulation using double-walled encapsulation technique. The first encapsulation used methyl methacrylic acid as the main component in acrylic polymer and the second encapsulation used melamine polymer. Particles size and distribution of the capsules were analyzed using scanning electron microscopy. In the first encapsulation, the stable capsules were obtained at 67% of phase change material ratio to methyl methacrylic acid monomer and the size of the capsule was from 0.2 to $0.3{\mu}m$. In the second encapsulation, the size of the capsules was almost the same with those capsules prepared in the first encapsulation. The particle size of single wall and double wall was about $0.3{\mu}m$. As a result of the encapsulation of paraffin using double-walled encapsulation technique, it was confirmed that the particle size was determined in the process of encapsulating using the acrylic polymer at the first wall material, and the physical and thermal stability of the capsules were imparted using melamine at the secondary wall material.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.317-320
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• 2006

In this paper we describe a new process for thin film encapsulation of OLED displays which is suitable for mass manufacturing.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.274-274
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• 2013

We fabricate encapsulation-layer of OLED panel from organic-inorganic hybrid thin film by atomic layer deposition (ALD) molecular layer deposition (MLD) using Al2O3 as ALD process and Adipoyl Chloride (AC) and 1,4-Butanediamine as MLD process. Ellipsometry was employed to verify self-limiting reaction of MLD. Linear relationship between number of cycle and thickness was obtained. By such investigation, we found that desirable organic thin film fabrication is possible by MLD surface reaction in monolayer scale. Purging was carried out after dosing of each precursor to eliminate physically adsorbed precursor with surface. We also confirmed roughness of the organic thin film by atomic force microscopy (AFM). We deposit AC and 1,4-Butanediamine at $70^{\circ}C$ and investigated surface roughness as a function of increasing thickness of organic thin film. We confirmed precursor's functional group by IR spectrum. We calculated WVTR of organic-inorganic hybrid super-lattice epitaxial layer using Ca test. WVTR indicates super-lattice film can be possibly use as encapsulation in flexible devices.

• Korea-Australia Rheology Journal
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• v.12 no.3_4
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• pp.165-173
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• 2000

Three-dimensional numerical simulation of isothermal/nonisothermal coextrusion process of two immiscible polymers through a rectangular channel has been done using the finite element method. The encapsulation phenomenon with the less viscous layer encapsulating the more viscous layer was investigated with the generalized Newtonian fluids. The interface position around the symmetric plane obtained by numerical simulation nearly coincided with the one observed in experiments, but the degree of encapsulation was less than the one observed experimentally. Open boundary condition method was found to be applied to the simulation of nonisothermal coextrusion process, however, the results are not far from those using the fully developed boundary condition, because the temperature development along the downstream direction is very slow in the case of convection dominated flow. When the inlet velocity is increased, the interface profile does not change in isothermal flow, while it moves upward in nonisothermal situation. The degree of encapsulation decreases along the downstream direction in nonisothermal flow. When the inlet temperature increases compared to the wall temperature, the outlet interface moves downward and the degree of encapsulation increases. The difference of degree of encapsulation between the simulation and the experiments seems to arise from the viscoelastic effect of the materials. It was concluded that the nonisothermal effect alone does not explain the complex coextrusion process and the viscoelastic effect needs to be considered.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.270-270
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• 2016

We fabricated an organic-inorganic nano laminated encapsulation layer using molecular layer deposition (MLD) combined with atomic layer deposition (ALD). The $Al_2O_3$ inorganic layers as an effective single encapsulation layer were deposited at 80 degree C using ALD with alternating surface-saturation reactions of TMA and $H_2O$. A self-assembled organic layers (SAOLs) were fabricated at the same temperature using MLD. MLD and ALD deposition process were performed in the same reaction chamber. The prepared SAOL-$Al_2O_3$ organic-inorganic nano laminate films exhibited good mechanical stability and excellent encapsulation property. The measurement of water vapor transmission rate (WVTR) was performed with Ca test. We controlled thickness-ratio of organic and inorganic layer, and specific ratio showed a lowest WVTR value. Also this encapsulation layer contained very few pin-holes or defects which were linked in whole area by defect test. To apply into real OLEDs panels, we controlled a film stress from tensile to compressive and flexibility defined as an elastic modulus with organic-inorganic ratio. It has shown that OLEDs panel encapsulated with nano laminate layer exhibits better properties than single layer encapsulated in acceleration conditions. These results indicate that the organic-inorganic nano laminate thin films have high potential for flexible display applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.282-283
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• 2009

In the research, we have proposed a novel encapsulation with simple process and steady film for external environment in comparison with conventional encapsulation method. This was designed to cover the emitting organic material from air. Silicon 야oxide was used for thin film of encapsulation and the deposition thickness of the organic film was 220 nm. Operating voltage of green OLED with encapsulation was 5.5 V and luminance was 7.370 cd/$m^2$ at the applied voltage of 14.5 V. Luminance was measured in 10 hour intervals at the air-exposed condition. After 110 hours and 300 hours, luminances of green OLED were 7,368 and 7,367 cd/$m^2$, respectively. Luminance of green JLED doesn't decrease until 300 hours. As a results, proposed encapsulation can increase the life time of green OLED.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.1
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• pp.98-103
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• 2001

Machining is the commonly used process in the manufacturing of prototypes. This process offers several advantages, such as rigidity of the machine, precision of the machine, precision of the operation and specially a quick delivery. The weight and immobility of the machine support and immobilize the part during the operation. However, despite these advantages it shows, machining still presents several limitations. The immobilization, location and support of the part are referred to as fixturing or workholding and present the biggest challenge for time efficient machining. So it is important to select and design the appropriate fixturing assembly. This assembly depends on the complexity of the part and the tool paths and may require the construction of dedicated fixtures. With traditional techniques, the range of fixturable shapes is limited and the identification of suitable fixtures in a given setup involves complex reasoning. To solve this limitation and to apply the automation, this paper presents the Reference Free Part Encapsulation(RFPE) and implementation of the encapsulation system. The feature-based modeling system and the encapsulation system are implemented. The small part of which it is difficult to find out the appropriate fixturing assembly is made by this system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.588-592
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• 1996

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• Korean Journal of Materials Research
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• v.12 no.5
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• pp.391-397
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• 2002

Synthesis and process development of nano-size Ti powder by SFE(Sodium/halide Flame Encapsulation) method were investigated. Four concentric coflow burner was used and its flame configuration was $TiCl_4/Ar/Na/Ar$ in order from the center. Flame has been controlled by the various processing parameters such as temperature of burner and flow rates of both $TiCl_4$(g) precursor and Na(g). It was found that yellow-colored flame was shown in the flow rates of 70cc/min of $TiCl_4$(g) precursor and 2 $\ell$ /min of Na(g) which were regarded as optimum flame condition. The powders encapsuled by NaCl were produced having the average powder size of 250nm. The results of X-ray diffraction showed that powders from the optimized condition consisted of pure Ti and NaCl. TEM analysis confirmed that the several Ti powders of 20-100nm were encapsulated with NaCl. After removing sodium chloride by heat treatment, the spherical Ti powders with the size range of 80 to 150nm were obtained.