• Title/Summary/Keyword: Embossing Pattern

Search Result 49, Processing Time 0.028 seconds

Characteristics of Hot Embossing using DVD/Blu-ray Stamper (DVD/Blu-ray 스템퍼를 이용한 핫엠보싱 특성)

  • Kim B. H.;Ban J. H.;Shin J. K.;Kim H. Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2004.10a
    • /
    • pp.305-310
    • /
    • 2004
  • The Hot Embossing Lithography(HEL) as a method for the fabrication of nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this study, we investigated the characteristics of hot embossing lithography as a nanoreplication technique. To grasp characteristics of nano patterning rheology by process parameters(embossing temperature, pressure and time), we have carried out various experiments by using the DVD(400nm pattern width) and Blu-ray nickel stamps(150nm pattern width). During the hot embossing process, we have observed the characteristics of the size effect. The quality of products made by hot embossing is affected by its cooling shrinkage. The demolding process at the glass transition temperature results in low quality because of the shrinkage of the polymer. Therefore, the quantification of the temperature condition is essential for the replication of high quality.

  • PDF

Effect of polymer substrates on nano scale hot embossing (나노 사이즈 hot embossing 공정시 폴리머의 영향)

  • Lee, Jin-Hyung;Kim, Yang-sun;Park, Jin-goo
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2003.11a
    • /
    • pp.71-71
    • /
    • 2003
  • Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

  • PDF

A study on PDMS mold fabrication using thermal embossing method (Thermal embossing 공정을 이용한 PDMS mold 제작에 관한 연구)

  • 김동학;유홍진;김창교;장석원;김태완
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.5 no.3
    • /
    • pp.223-226
    • /
    • 2004
  • Injection molding using plastic materials was expected to mass production of structure with nano pattern for low cost phase. The PDMS mold was produced easily and uniformly by using thermal embossing. Quartz master for embossing method was made using electron beam lithography it had 100-500 nm size of line and dot type. The PDMS mold was produced after a brief hardening process and the master removal. The results show that various patterns are successfully fabricated the nano scale.. The replicated mold would be useful a stamper fabrication for injection molding.

  • PDF

4 Inch Wafer-Scale Replicability Enhancement in Hot Embossing by using PDMS-Cushioned Si Mold (PDMS 쿠션을 갖는 Si 몰드에 의한 핫엠보싱 공정에서의 4 인치 웨이퍼 스케일 전사성 향상)

  • Kim Heung-Kyu;Ko Young-Bae;Kang Jeong-Jin;Heo Young-Moo
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.23 no.8 s.185
    • /
    • pp.178-184
    • /
    • 2006
  • Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

A Study on the Improvement of Formability of Embossing Structure (엠보싱 구조재의 성형성 향상에 관한 연구)

  • Kim H.J.;Jung D.W.;Choi D.S.;Jae T.J.;Park J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2005.06a
    • /
    • pp.1269-1272
    • /
    • 2005
  • Sandwich structures, which are composed of thick core between two thin faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. In this research, we have investigated the embossing configuration at the sheet metal shape through research with regard to the construction that the hardness and stiffness are excellent, and formability is advantage as inner structure. Through the FLD analysis according to the pattern changes, we have confirmed the forming possibility and variation of the aspect thickness. Also, we have fabricated the embossing press mold according to the pattern changes, and obtained the embossing inner structure the forming experiments.

  • PDF

A Study on the Fabrication of Nano Pattern using a Nickel Stamper Replicated from Anodic Aluminum Oxide (Anodic Aluminum Oxide 기반 니켈 스탬퍼를 이용한 나노패턴 성형에 관한 연구)

  • Kim, S.;Kim, J.S.;Hong, S.K.;Kim, H.J.;Yoon, K.H.;Kang, J.J.
    • Transactions of Materials Processing
    • /
    • v.20 no.1
    • /
    • pp.23-28
    • /
    • 2011
  • For the fabrication of nano patterned products manufacturing a nano patterned mold is needed in advance. The nano patterned stamper was fabricated by electroforming the AAO master with nickel. The surface of nickel-plated stamper had nano-patterned holes with the diameter of 73 nm and the depth of 83 nm. Hot embossing was used for forming P3HT sheet and the process factors of hot embossing were closer as pressure, temperature and time. In the present paper hot embossing experiments were performed to find the main process conditions to affect the replication ratio of nano patterns on surface of P3HT sheet. As a result, main contributing factors for the replication ratio of hot embossed pattern could be sequentially enumerated as pressure, temperature and time.

Nano Molding Technology for Optical Storage Media with Large-area Nano-pattern (대면적 광 정보저장매체의 나노성형에 대한 기술 개발)

  • Shin Hong-Gue;Ban Jun-Ho;Cho Ki-Chul;Kim Heon-Yong;Kim Byeong-Hee
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.23 no.4 s.181
    • /
    • pp.162-167
    • /
    • 2006
  • Hot embossing lithography(HEL) has the production advantage of comparatively few process step, simple operation, a relatively low cost for embossing tools(Si), and high replication accuracy for small features. In this paper, we considered the nano-molding characteristic according to molding parameters(temperature, pressure, times, etc) and induced a optimal molding condition using HEL. High precision nano-patter master with various shapes were designed and manufactured using the DRIE(Deep Reactive ion Etching), LPCVD(Low Pressure Chemical Vapor Deposition) and thermal oxidation process, and we investigated the molding characteristic of DVD and Blu-ray nickel stamp. We induced flow behaviors of polymer, rheology by shapes and sizes of the pattern through various molding experiments. Finally, with achieving nano-structure molding with high aspect ratio, we will secure a basic technology about the molding of large-area nano-pattern media.

Fabrication Method Of Micro Embossing Patterned Metallic Thin Foil Using CIP Process and It's Mechanical Property (냉간 등방압 성형공정을 이용한 마이크로 엠보싱 패턴 성형 및 기계적 물성 측정)

  • Lee, H.J.;Lee, N.K.;Lee, G.A.;Lee, H.W.;Choi, S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2006.05a
    • /
    • pp.243-246
    • /
    • 2006
  • In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

  • PDF