• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.2
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• pp.297-308
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• 2007

The types of industrial software are classified into package, embedded and system type. The Package type software means industrial ERP, the embedded software is built in industrial devices and the system type software controls the manufacturing and production system, In this paper, we described about the development of evaluation modules which can implement quality test and evaluation fur industrial embedded software. If you are planning to enhance the objectivity and the validity of evaluation modules, it is necessary to construct the system based on international standard. There are two international standard, ISO/IEC 12119 and ISO/IEC 9126 related to quality evaluation of software. Also ISO/IEC 14598-6 is the standard that defines the construction form of the evaluation modules. Based on these standards, We extracted the quality requirements of industrial embedded software and constructed the evaluation modules that can evaluate the content level of the quality requirements.

• IEMEK Journal of Embedded Systems and Applications
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• v.6 no.4
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• pp.223-229
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• 2011

A novel ecosystem surrounding developing, publishing and using of smartphone applications is driving a new paradigm in software industry. Thousands of applications are newly published on appstores everyday. However more than 97% of them happen to be downloaded less than 1,000 times and resultingly disappeared out of user's interesting. It means that so many efforts and time of developers are vanished. In this paper, we proposed a new architecture to increase code reusability of Android applications so that the time and efforts to develop new applications can be shortened. The proposed architecture, an extended Intent mechanism, supports sharing of Android components among the applications registered in different servers as well as in the same Android device. We designed a new Intent mechanism by extending the PackageManager service and by adopting a new class for ServerPackageManager service.

• IEMEK Journal of Embedded Systems and Applications
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• v.16 no.6
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• pp.293-297
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• 2021

This paper presents how to create a 3D map and solve problems related to generating a global path planning for navigation. Map creation and localization were performed using the RTAB-Map package to create a 3D map of the environment. In addition, when the target point is within the obstacle space, the problem of not generating a global path was solved using the asr_navfn package. The performance of the proposed system is validated through experiments with a wheelchair-type robot.

• Current Optics and Photonics
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• v.5 no.2
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• pp.121-128
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• 2021

We propose a novel, tiny optical receiver engine utilizing an all-in-one package based on embedded optics technology. The package's best transmission S21 and reflection S22 opto-electric (OE) bandwidths are 49.8 GHz and 34.9 GHz, respectively, and the reflectance of the optical engine is below -31.7 dB for all channels. The engine satisfies the MIL-STD-883G standard for reliability tests, such as mechanical and thermal shock, and vibration resistance. The sensitivity after 10 km single-mode fiber (SMF) transmission is below -8 dBm. The optical receiver engine is cost-competitive and applicable for 400G coarse wavelength division multiplexing 4 (CWDM4) 10 km optical transceivers.

• IEMEK Journal of Embedded Systems and Applications
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• v.19 no.1
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• pp.33-38
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• 2024

In this paper, we propose the implementation of a drone delivery system using artificial intelligence in a situation where the use of drones is rapidly increasing and human errors are occurring. This system requires the implementation of an accurate control algorithm, assuming that last-mile delivery is delivered to the apartment veranda. To recognize the delivery location, a recognition system using the YOLO algorithm was implemented, and a delivery system was installed on the drone to measure the distance to the object and increase the delivery distance to ensure stable delivery even at long distances. As a result of the experiment, it was confirmed that the recognition system recognized the marker with a match rate of more than 60% at a distance of less than 10m while the drone hovered stably. In addition, the drone carrying a 500g package was able to withstand the torque applied as the rail lengthened, extending to 1.5m and then stably placing the package down on the veranda at the end of the rail.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• Journal of Korea Society of Digital Industry and Information Management
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• v.17 no.3
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• pp.9-15
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• 2021

In this paper, the Embedded MEMS system to the power apparatus used Edge Impulse machine learning tools and therefore an improved predictive system design is implemented. The proposed MEMS embedded system is developed based on nRF52840 system and the sensor with 3-Axis Digital Magnetometer, I2C interface and magnetic measurable range ±120 uT, BM1422AGMV which incorporates magneto impedance elements to detect magnetic field and the ARM M4 32-bit processor controller circuit in a small package. The MEMS embedded platform is consisted with Edge Impulse Machine Learning and system driver implementation between hardware and software drivers using SensorQ which is special queue including user application temporary sensor data. In this paper by experimenting, TensorFlow machine learning training output is applied to the power apparatus for analyzing the status such as "Normal, Warning, Hazard" and predicting the performance at level of 99.6% accuracy and 0.01 loss.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.