• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.581-585
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• 2001

This paper describes novel high voltage capacitor(HVC) embedded high frequency transformer and novel inverter power supply topology for driving magnetron in microwave oven. This transformer is used to achieve down­sizing, low-cost and efficiency improvement. Proposed transformer has HVC in its secondary winding. Therefore, this transformer does not need external high voltage capacitor which used in conventional power supply. As use of this transformer, output voltage is shifted from ground to above 2000[V] and efficiency of microwave oven can be improved. The weight of proposed transformer is about one sixth of conventional one and efficiency is improved by seven percent compared to the efficiency of the conventional system.

• Proceedings of the KIPE Conference
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• 2016.11a
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• pp.220-221
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• 2016

This paper proposes an active switched-capacitor embedded quasi-Z-source inverter (ASC-EqZSI) topology. In order to improve boost ability, One diode and one switch device are added in the qZSI impedance network, and a single dc source is shifted in series with the inductor in the impedance network. The performances of the proposed topology are verified with simulation and experimental results.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.71-76
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• 2004

A compact embedded tapped-line combline filter with interdigital capacitors using low temperature co-fired ceramic (LTCC) technology for wireless application is proposed. Also, in-situ measurement using T-pattern microstrip resonator was performed to acquire exact knowledge of electrical properties of the LTCC substrate. The proposed filter makes it possible to realize a relatively small size, 2.7mm${\times}$2.03mm. by employing interdigital and combline structure. It shows 1.8 ㏈ insertion loss, 37.6㏈ return loss, and 280 MHz bandwidth at the center frequency of 5.09 GHz. Its small size and simple structure make it a good candidate as an integrated filter for various LTCC substrates.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.222-228
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• 2012

This paper presents a design and simulation of bi-directional DC/DC boost converter for a fuel cell system. In this paper, we analyze the equivalent model of both a boost converter and a buck converter. Also we propose the controller of bi-directional DC-DC converter, which has buck mode of charging a capacitor and boost mode of discharging a capacitor. In order to design a controller, we draw bode plots of the control-to-output transfer function using specific parameters and incorporate 3pole-2zero compensator in a closed loop. As a result, it has increased PM(Phase Margin) for better dynamic performance. The proposed bi-directional DC-DC converter's 3pole-2zero compensation method has been verified with computer simulation and simulation results obtained demonstrates the validity of the proposed control scheme.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.9 s.112
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• pp.860-865
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• 2006

In this paper, a novel tunable inter-digital capacitor using dielectric tunable $Bi_2O_3-ZnO-Nb_2O_5(BZN)$ pyrochlore thin films is proposed. In order to improve the tunability and reduce DC bias voltage using the fringing electric field, the electrodes of the inter-digital capacitor are embedded in the thin film. Designed results using a 2.5 D simulator show that the tunability of the proposed inter-digital capacitor improves by 10 %, compared to the conventional inter-digital capacitor. The proposed IDC, which is based on the simulation results, was fabricated, using the BZN thin film deposited by a reactive RF magnetron sputtering on the on the silicon substrate. The fabricated inter-digital capacitor shows the maximum tunability of 50 % at 5.8 GHz and 18 V DC applied.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• ETRI Journal
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• v.30 no.6
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• pp.826-832
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• 2008

The metal-ferroelectric-metal (MFM) capacitor in the ferroelectric random access memory (FeRAM) embedded RFID chip is used in both the memory cell region and the peripheral analog and digital circuit area for capacitance parameter control. The capacitance value of the MFM capacitor is about 30 times larger than that of conventional capacitors, such as the poly-insulator-poly (PIP) capacitor and the metal-insulator-metal (MIM) capacitor. An MFM capacitor directly stacked over the analog and memory circuit region can share the layout area with the circuit region; thus, the chip size can be reduced by about 60%. The energy transformation efficiency using the MFM scheme is higher than that of the PIP scheme in RFID chips. The radio frequency operational signal properties using circuits with MFM capacitors are almost the same as or better than with PIP, MIM, and MOS capacitors. For the default value specification requirement, the default set cell is designed with an additional dummy cell.