• 제목/요약/키워드: Electronics cooling

검색결과 323건 처리시간 0.023초

연주 설비용 몰드 오실레이터의 강건 설계 (Robust Design of the Mold Oscillator of continuous Casting Machine)

  • 박용태;이창수;황운봉;강기판;신건
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.782-785
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    • 2002
  • The goal of this research is to deduce the robust design of mold oscillator of the continuous casting machine. In the case of the system operated in the high temperature condition, the structural problems caused by the heat are dominant. Therefore, the thermal stress is considered with the connection of the thermal and structural analyses. The cooling ability of the water jacket was estimated and the robustness of mold oscillator was judged with the displacement and stress distributions obtained by the finite element method. The analytic results were compared with the real values of the iron mill.

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연료전지차용 100kW 전기구동시스템 냉각설계기술 개발 (Development of Cooling System for 100kW Electric Power Train Applied to Fuelcell Vehicle)

  • 김유한;이현동;유기호
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2008년도 하계학술대회 논문집
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    • pp.428-430
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    • 2008
  • 연료전지차 및 하이브리드차용 전기구동시스템의 냉각성능은 차량의 동력성능을 보장하기 위한 중요한 요소이다. 각 단품의 성능 확보를 위해 냉각수를 허용 온도 이하로 관리해야 하며 이때 라디에이터 방열량과 냉각수 유량이 중요 변수가 된다. 본 논문에서는 현대자동차 연료전지차량의 모터, 인버터를 포함한 100kW 전기구동시스템의 최적 냉각 설계를 위하여 차량주행모드에 따른 전기동력부품의 발열량을 이론적으로 산출하고, 시험을 통하여 냉각시스템의 성능을 검증하였다.

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하이브리드 전기자동차 구동용 전력변환장치 (Power Conversion Unit for Hybrid Electric Vehicles)

  • 이지명;이재용;박래관;장서건;최경수
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2008년도 하계학술대회 논문집
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    • pp.7-11
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    • 2008
  • This paper describes design procedure and control strategy of HDC(High side DC/DC Converter) and MCU(Motor Control Unit) for diesel hybrid electric vehicle. In designing HDC and MCU for HEV high power density and reliability is strongly needed to meet the demand of automotive industry. In order to achieve the high performance of a controller, MPC5554 based control board is developed. An optimized film capacitor and inductor are also developed for high efficiency driving. Skim 63 IGBT module of SEMIKRON for automotive is used for power switching device. The most efficient cooling model for optimal size and reliability were verified by simulation. These procedures are verified by bench or driving test and the results are present in this paper.

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Effect of the size of active device and heatsink of power MOSFETs on its the junction to ambient transient thermal behavior

  • Koh, Jeong-Wook;An, Chul
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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    • pp.241-244
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    • 2000
  • To investigate the compact effect of the different area of an active layer and the different type of heatsink on the junction to ambient transient thermal impedance, we have characterized the thermal behavior of power MOSFETs that have three different areas of an active layer and two types of heatsink. To do so, the "cooling curve method" has been used in order to measure the junction-to-ambient transient thermal impedance Zthja that represents the thermal behavior of the devices. The measured data depiets that the larger area of an active layer gives the better-in other words. smaller-thermal impedance, and that the larger size of a heatsink improves the thermal impedance.

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CALCULATION OF FLOW FIFLD IN A CHANNEL SUBJECTED TO PRESSURE-BASED BOUNDARY CONDITION

  • 박종흥;이재헌
    • ETRI Journal
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    • 제10권4호
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    • pp.118-126
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    • 1988
  • A numerical analysis was performed for the flow field in the vertical channels consist of dummy cards and active cards to define the hydrodynamic role of dummy card which is often installed in electronic equipment between active cards to control the cooling air distribution. For a given velocity profile at the inlet and a pressure-based boundary condition at the outlet of the computation domain, the percentage of the flow rate distribution through active channel and dummy channel formed by an active card and dummy card, respectively, were investigated. As a result of present analysis, the pecentage of flow rate through active channel increases quadraticaly with the increase of the ratio of the height of barrier to the width of the dummy channel.

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국한 충돌공기제트에 의한 발포 알루미늄 방열기의 열전달 특성 (Thermal Transport from an Aluminum Foam Heat Sink in a Confined Impinging Air Jet)

  • 황준;김서영;강병하
    • 대한기계학회논문집B
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    • 제27권4호
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    • pp.496-503
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    • 2003
  • An experimental study has been performed on thermal transport from an aluminum foam heat sink under a confined impinging air jet. Three kinds of aluminum foam heat sinks with 10, 20 and 40 PPI and a conventional pin-fin heat sink are tested in the present study. The jet Reynolds number is varied in the range of Re=667~5672 The effect of the confinement disk diameter and the distance between the confinement disk and the heater surface on the averaged Nusselt number is investigated in detail. The results are also compared with those of the unconfined impinging air jet. The critical distance, at which thermal performance shows a minimum compared to the unconfined jet impinging, will be described in terms of the Reynolds number and the pore density of the aluminum foam.

실험계획법과 수치해석을 연계한 정밀 전자부품 사출성형 공정의 최적설계 (Application of Design of Experiments and Numerical Analysis to Optimal Design for Injection Molding Processes of Electrical Parts)

  • 안종호;최상련;박근
    • 대한기계학회논문집A
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    • 제26권7호
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    • pp.1348-1356
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    • 2002
  • The present work concerns the optimal design for injection molding processes by using the design of experiments (DOE) and numerical analysis. The DOE approaches is planned to be able to consider two-way interaction, and have been applied progressively for both mold design and process design. Numerical analyses have been carried out as a design of experiments for mold parameters such as runner specifications and cooling channel configurations. In order to determine optimal process parameters, experiments have been performed for various process conditions with the DOE scheduling. As a result, the quality and productivity of the product have been improved, and the proposed approach can be successfully reflected on the industrial injection molding process of precision electronics parts.

홴 설계 및 소음 해석 소프트웨어 (Design and Noise Analysis Software of Fans)

  • 전완호;백승조;김창준
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2001년도 추계학술대회논문집 I
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    • pp.270-274
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    • 2001
  • Fans are widely used in household electrical appliances due to their easy usage and high performance for cooling capacity. However, the noise generated by these fans causes one of serious problems. LG electronics makes the intranet software for design and analysis of fan. Axial, sirocco and centrifugal fan can be designed and analyzed by using the IFD(Intranet Based Fans Design) software. In order to calculate the aeroacoustic noise of a fan, the numerical method, which can calculate the acoustic pressure at the blade passing frequency and its higher harmonic frequencies, has been developed. To calculate the unsteady resultant force of the blade, vortex method is used. This paper shows the overview of the software and validates the accuracy of predicted noise of fan.

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진도-제주 HVDC 변환설비 소음특성 분석 (Analysis of Acoustic Noise Characteristics of Jindo-Cheju HVDC)

  • 김재한;김찬기;이성두;김진영
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2010년도 하계학술대회 논문집
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    • pp.574-576
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    • 2010
  • HVDC converter station consists of a number of noise sources such as converter transformer, ac filter, cooling system and so on. In this paper, we analyzed the simulation results of the outdoor acoustic noise characteristics for HVDC converter station. It shows that maximum noise level in boundary of HVDC converter station exceeds regulation value. The main factors in generating maximum noise level are ac filter and converter transformer. Then we applied some soundproof countermeasure in HVDC converter station. Shielding wall is enough to reduce transformer noise level but not enough to reduce ac filter noise level. In case of ac filter, soundproof building is effective in satisfying noise level regulation in boundary of HVDC converter station. In addition, we also studied effects of season, soundproof woods, ground.

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전자부품의 인쇄회로기판 부착시 적외선 Reflow Soldering과정 열전달 해석 (Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards)

  • 손영석
    • Journal of Welding and Joining
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    • 제15권6호
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    • pp.105-115
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    • 1997
  • A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

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