• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.11
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• pp.1004-1008
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• 2007

The ice coats are built on 25 kV overhead contact wire when the temperature is lower than $0^{\circ}C$. It generates shockwaves at the mechanical interface of the collecting strips of the pantograph and the contact wire. The de-icing processes should be performed to avoid shockwaves which are generated by a pulsed high-voltage arc discharge. This paper presents temperature analysis of the de-icing effects which could be applied to the overhead contact wire of railways using Joule heat. The results show that 350 A is the proper current for $0^{\circ}C$ conductor according to environmental condition such as velocity of air stream, ambient temperature and moisture.

• Corrosion Science and Technology
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• v.20 no.5
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• pp.289-294
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• 2021

In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H₂SO₄ and 1 wt% HCl electrolytes at 25 ℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (E_CORR) values in sulfuric acid solution, ACA wire had more than six times higher E_CORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the E_CORR value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.297-301
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• 2016

The effects of ambient temperature and diameter on the insulation lifetime of winding coils prepared with polyamideimide (PAI), flexural PAI (nanosilica 5 wt%) and anti-corona PAI (nanosilica 15 wt%) wires were investigated. The winding coils were made of enameled wire with enamel thickness of 30~50 μm. The thickness and width of the rectangular copper wires were 0.77~0.83 mm and 1.17~1.23 mm, respectively. The insulation breakdown lifetime decreased with increasing ambient temperature regardless of wire type and winding coil diameter under an inverter surge of 1.5 kV/20 kHz. The insulation breakdown lifetimes of φ5 mm winding coils at 150, 200, and 250℃ were 11.38, 5.19, and 4.22 min respectively, and those of φ10 mm winding coils at 150, 200, and 250℃ were 11.32, 5.79, and 4.57min respectively. The winding coil diameter had little effect on the insulation lifetime.

• Transactions on Electrical and Electronic Materials
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• v.16 no.4
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• pp.190-193
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• 2015

Insulation breakdown characteristics of an inverter surge resistant enameled wire were investigated in a twisted pair prepared with organic/inorganic hybrid nanocomposite. Organic polymer was polyesterimide-polyamideimide (EI/AI) and inorganic material was a nano-sized silica. The enamel thickness was 50 μm and the diameters of enameled copper wires were 0.75, 1.024, and 1.09 mm, respectively. There were many air gaps in a twisted pair. Therefore, when the voltage was applied to the twisted pair, enamel erosion took place in the air gap area because of partial discharge according to Paschen’s law. The insulation lifetime of the hybrid wire (HW) was 41,750 sec, which was 515.4 times more than the 81 sec of EI/AIW. In addition, the shape parameter of HW was 2.58, which was 3.4 times higher than 0.75 of EI/AIW.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.554-555
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• 2005

In this paper, we analyzed a metallurgical structure and arc properties of copper wire when the over-current flows on electric wire. From the results, The fusing current was related to the fusing time(current rising rate per second). In case of the shorter the fusing time, the fusing current was high, and the fusing time of ac type was larger than that of dc type. The copper wire was bent by the increase of current and heated, the beads were scattered around wire with a flash. We could observed the dendrite structure in 'molten wire at ac and dc current type. According as the current rising rate per second is short, the dendrite structure is distributed in surface of wire.

• Journal of Drive and Control
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• v.20 no.4
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• pp.140-149
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• 2023

Wire harness is a component for efficient control when electronic parts are required such as construction machinery and electric vehicles. With emerging issues such as autonomous driving and automation in construction, a wire harness composed of multiple cables has become an essential part because more electronic parts are required. However, when a wire harness failure occurs, systems can be stopped, accidents can occur, and economic damage can be significant. Therefore, in this paper, we developed a digital fault screening system that could easily and quickly diagnose faults in the wire harness. The principle of the developed system was to sequentially send pulse signals to the wire harness and use returned signals to perform fault detection. As a result of diagnosing faults using the developed failure detection system, a detection accuracy of 99.9 % was confirmed through the experiments.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.632-637
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• 2010

The measurement of contact wire wear in electric railways is one of the key test parameters to increase speed and maintain safety in electric railways. Wear caused by continuous interaction between pantographs and contact wires has a negative effect on current collection quality and severely damaged contact wires might cause hazardous accidents. This paper introduces a non-contact optical-based contact wire wear measuring system that will replace conventional wear detecting methods conducted by maintenance vehicles or workers. The system is implemented by high-speed cameras that can collect images of contact wires during vehicle operation, a laser used to create images profile of the contact wire surface, and a computer used to process the collected images. The proposed system is designed to assist maintenance of overhead contact lines by creating geometrically plotted images of contact wires to detect contact wire wear during operation on conventional lines or high-speed lines.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.66-69
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• 2002

This paper presents deposition and characterizations of microcrystalline silicon$({\mu}c-Si:H)$ films prepared by hot wire chemical vapor deposition at substrate temperature below $300^{\circ}C$. The $SiH_{4}$ concentration$[F(SiH_{4})/F(SiH_{4})+F(H_{2})]$ is critical parameter for the formation of Si films with microcrystalline phase. At 6% of silane concentration, deposited intrinsic ${\mu}c-Si:H$ films shows sufficiently low dark conductivity and high photo sensitivity for solar cell applications. P-type ${\mu}c-Si:H$ films deposited by Hot-Wire CVD also shows good electrical properties by varying the rate of $B_{2}H_{6}$ to $SiH_{4}$ gas. The solar cells with structure of Al/nip ${\mu}c-Si:H$/TCO/glass was fabricated with single chamber Hot-Wire CVD. About 3% solar efficiency was obtained and applicability of HWCVD for thin film solar cells was proven in this research.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.11
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• pp.1022-1026
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• 1998

The mutifilamentary $Nb_3$Sn wire containing 135 Nb filaments was manufactured by the internal tin method. The critical current density ($J_C$) in magnetic fields for the wires heat-treated at $660^{/circ}C$ and $700^{/circ}C$ were investigated. The Non-Cu $J_C$ and n-value of 0.82 mm$\phi$ $Nb_3$Sn wire heat-treated at $700^{/circ}C$ for 240 hours was approximately 450 A/$mm^2$ at 12T, 4.2K and 14, respectively. Also the $B_{C2}$ of $Nb_3$Sn wire extrapolated by Kramer plot was 27.2T. The wire heat-treated at $700^{/circ}C$ for 240 hours showed smaller residual tin concentration in the matrix and the larger area of $Nb_3$Sn layer as comparison with the wire heat-treated at $660^{/circ}C$.