• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.48-53
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• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar laserm, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment wpecimen was loaded in parallel with a loadcell. The specimen was the cold rolled sdteel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.7
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• pp.149-154
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• 2001

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for a deformation measurement of structure. Phase shifting method and unwrapping method have used to make deformation quantitative widely. In this paper, a previous numerical formula for phase shifting method is reconstructed in addition to least square fitting method to improve sensitivity and phase unwrapping based on vertical-horizontal scanning method is applied to analyze in-plane and out-of-plane deformation quantitatively.

• Journal of Mechanical Science and Technology
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• v.19 no.3
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• pp.820-825
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• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Structural Engineering and Mechanics
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• v.15 no.3
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• pp.367-378
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• 2003

The magnitude of the plastic zone around the crack tip of DENT (Double Edge Notched Tension) specimen and the crack growth length under cyclic loading were measured by ESPI (Electronic Speckle Pattern Interferometry) system. The measured magnitude of plastic zone was compared with the proposed by Irwin and calculated by a nonlinear static method of MSC/NASTRAN. The measured crack growth length by ESPI system was also compared with the obtained data by the image analysis system. From the study, it is confirmed that the plastic zone and crack growth length can be measured accurately with the high-tech equipment (ESPI System).

• Journal of the Korean Society for Precision Engineering
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• v.24 no.7 s.196
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• pp.69-74
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• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.78-83
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.40-49
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• 1995

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interferometry (ESPI) method, in measuring two - dimensional in-plane displacement. The anyalysis result of measurement by ESPE is quite comparable to that tof measurement by strain gauge method. This implies that the method of ESPE is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversal point, measurment error. This error is discussed to be affected not by ESPE method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. In this case, it is turned out that the more errors would be occurred in the large interval of fringe. And so this paper describes a computer method for drawing when the height is available only for some arbitrary collection of points. The method is based on a distance-weighted, last- squares approximation technique with the weight varying with the distance of the data points.

• Proceedings of the KWS Conference
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• 2001.10a
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• pp.162-164
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• 2001

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.2
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• pp.182-188
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• 2001

This paper presents the vibration characteristics of a rectangular plate with $45^{\circ}$ oblique crack subjected to a uniaxial tension. The experiment is adopted by the time-average Electronic Speckle Pattern Interferometry(ESPI) method. The natural frequency and mode shape are considered accurately according to the increase of tensile load. When tensile load is zero, the vibration modes we agreed with the smooth and the $45^{\circ}$ obliquely cracked plate. But according to the increasement of load it is shown that vibration modes are extremely varied. The effects of the crack under the vibration are discussed in detail. It is indicated that the increase of load makes the variation of the frequencies and modes complicate in the range of even a small load. The results are agreed with the FEM analysis within 5%.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.630-633
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• 2001

This paper propose electronic speckle pattern interferometry(ESPI) for reliability evaluation of electronic device. Especially, vibration problem in a fan of air conditioner, motor of washing machine and etc. is important factor to design the devices. But, it is difficult to apply previous method, accelerometer to the devices with complex geometry. ESPI, non-contact measurement technique applies a commercial fan of air conditioner to vibration analysis. Vibration mode shapes, natural frequency and the range of the frequency are decided and compared with that of FEM analysis. In mechanical deign of new product, ESPI adds weak point of previous method to supply effective design information.