• 광학세계
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• 통권135호
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• pp.73-73
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• 2011

한국 광학산업을 상징하는 글로벌 산업단체 한국광학기기협회(www.koia.or.kr)가 2012년 4월11일부터 13일까지 서울 코엑스에서 제1회 광전자 산업전시회를 개최한다. 한국광학기기협회와 케이훼어스(주)가 공동 주최하는 'Photonics Seoul 2012'는 광부품 소재, 레이저 및 레이저응용장비, 광학측정 및 시험분석장비, 정밀영상시스템, IT정보기기, 소프트웨어 및 녹색광산업 분야의 광학장비 및 부품소재 등 광산업 제품을 총 망라하는 대규모 전시회라는 점에서 기대를 모으고 있다. 특히 이 전시회는 국내 광산업체의 비즈니스 활성화를 위해 'SMT/PCB & NEPCON KOREA', 'Printed Electronic & Electronics Materials Show', 'LED Packaging EXPO', 'Film Technology Show' 전시회와 동시 개최되어 전시기간 동안 한자리에서 최신 기술 및 제품 동향은 물론, 다양한 국내외 바이어를 만날 수 있는 기회가 될 것으로 기대된다. 동 전시회에 대한 자세한 사항은 한국광학기기협회 사업추진팀(02-3481-8931)으로 연락하면 된다.

• 광학세계
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• 통권139호
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• pp.56-57
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• 2012

인쇄회로기판과 표면실장기술, LED, 인쇄전자, 기능성 필름, 광학 및 레이저기기 등 전자 제조산업 전반에 걸친 기술들을 총집결한 국내 최대 산업전문전시회인 'Electronics Manufacturing Korea 2012(이하 EMK2012)'가 지난 4월 11일부터 13일까지 코엑스 Hall C, D에서 펼쳐졌다. EMK2012는 SMT/PCB & NEPCON KOREA, LED Packaging EXPO, Film Technology Show와 함께 올해부터 Printed Electronics & Electronic Materials Show과 Photonics Seoul(포토닉스 서울)이 추가돼 총 5개의 전시회가 동시에 열렸다. 약 25개국 300업체가 1000부스 규모로 참가한 이번 전시회는 기존의 SMT, PCB, 전자부품, FPD 생산기자재와 더불어 LED 생산기자재, 광학기기, 레이저 산업 등 전자산업 관련 각종 생산기자재와 제품 등을 선보이며 최신 기술을 교류하는 기회였다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.844-845
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• 2006

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.

• 비파괴검사학회지
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• 제37권2호
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• pp.106-114
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• 2017

This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.

• Journal of Advanced Marine Engineering and Technology
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• 제36권1호
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• pp.64-71
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• 2012

An efficient cooling system is an essential part of the electronic packaging such as a high-luminance LED lighting. A special technology, Pulsating Heat Pipe (PHP), can be applied to improve cooling of a sealed, explosion-proof LED light fixture. In this paper, the characteristics of the pulsating heat pipes in the imposed thermal boundary conditions of LED lightings were experimentally investigated and a PHP device that works free of alignment angle was investigated for cooling of explosion-proof LED lights. Five working fluids of ethanol, FC-72, R-123, water, and acetone were chosen for comparison. The experimental pulsating heat pipe was made of copper tubes of internal diameter of 2.1 mm, 26 turns. A variable heat source of electric heater and an array of cooling fins were attached to the pulsating heat pipe. For the alignment of the heating part at bottom, an optimum charging ratio (liquid fluid volume to total volume) was about 50% for most of the fluids and water showed the highest heat transfer performance. For the alignment of the heating part on top, however, only R-123 worked in an un-looped construction. This unique advantage of R-123 is attributed to its high vapor pressure gradient. Applying these findings, a cooling device for an explosion-proof type of LED light rated 30 W was constructed and tested successfully.

• 마이크로전자및패키징학회지
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• 제30권3호
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• pp.20-34
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• 2023

수 나노미터의 두께의 단일 또는 여러 층으로 구성된 2차원 소재는 전기전도성, 유연성, 광학적 투명성 등의 고유한 특성으로 많은 연구 분야에서 활용되고 있다. 이 중 Electronic skin (E-Skin)이나 Smart Textile 과 같은 반복적인 기계적 동작이 수반될 수 있다. 또한, 온도, 습도, 압력과 같은 외부적 요인에 노출이 되는 경우가 빈번하다. 이 때, 소자의 내구성과 수명 저하를 유발하기 때문에 자가 치유 특성이 내포된 소자를 제작하기 위한 연구가 많이 이루어지고 있다. 최근 다양한 2차원 소재 중 자가 치유 기능을 구현할 수 있는 Ti₃Ci₂Ti_x MXene 기반 전극의 복합 소재의 연구 결과가 학계의 주목을 받고 있다. 본 논문에서는 Ti₃Ci₂Ti_x MXene의 다양한 합성 방법 및 특성에 대해 소개한 후, Ti₃Ci₂Ti_x MXene 전극 기반의 자가 치유 적용 기술 사례에 대해 알아보고자 한다.

• Corrosion Science and Technology
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• 제6권2호
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• 한국정밀공학회지
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• 제27권1호
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• 한국생산제조학회지
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• 제21권3호
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.65-70
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• 2021

본 연구에서는 레이저 접합 공정을 이용하여 flame retardant-4 (FR-4) 인쇄회로기판 (printed circuit board, PCB)의 organic solderability preservative (OSP) 표면처리 된 Cu pad와 전자부품을 Sn-57Bi-1Ag 저온 솔더 페이스트로 접합을 한 후 접합부의 계면 특성과 기계적 특성에 대하여 보고 하였다. 레이저 접합 공정은 레이저 파워 및 시간 등을 다르게 진행하여 접합 공정 조건이 접합부의 계면 및 기계적 특성에 미치는 영향을 살펴보았다. 레이저 접합 공정의 산업적 적용을 위하여 산업적으로 많이 이용되고 있는 리플로우 접합 공정을 이용한 접합부의 특성과도 비교 하였다. 레이저 접합 공정 적용 결과 2, 3 s의 짧은 공정 시간에도 계면에 Cu₆Sn₅ 금속간화합물 (intermetallic compound, IMC)를 생성하여 접합부를 안정적으로 형성함을 확인 하였다. 또한, 리플로우 공정과 비교해 보았을 때 레이저 접합 공정을 적용할 경우 접합부의 보이드 형성이 억제됨을 확인할 수 있었으며 접합부의 전단강도도 리플로우 공정 접합부보다 높은 기계적 강도를 나타냈다. 따라서, 레이저 접합 공정을 적용할 경우 짧은 접합 공정 시간에도 불구하고 안정적인 접합부 형성 및 높은 기계적 강도를 확보할 수 있는 것으로 기대된다.