• Composites Research
• /
• v.35 no.2
• /
• pp.69-74
• /
• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Journal of Sensor Science and Technology
• /
• v.14 no.2
• /
• pp.69-77
• /
• 2005

The electronic nose (e-nose) has been used in food industry and quality controls in plastic packaging. Recently it finds its applications in medical diagnosis, specifically on detection of diabetes, pulmonary or gastrointestinal problem, or infections by examining odors in the breath or tissues with its odor characterizing ability. Moreover, the use of portable e-nose enables the on-site measurements and analysis of vapors without extra gas-sampling units. This is expected to widen the application of the e-nose in various fields including point-of-care-test or e-health. In this study, a PDA-based portable e-nose was developed using micro-machined gas sensor array and miniaturized electronic interfaces. The rich capacities of the PDA in its computing power and various interfaces are expected to provide the rapid and application specific development of the diagnostic devices, and easy connection to other facilities through information technology (IT) infra. For performance verification of the developed portable e-nose system, Six different vapors were measured using the system. Seven different carbon-black polymer composites were used for the sensor array. The results showed the reproducibility of the measured data and the distinguishable patterns between the vapor species. Additionally, the application of two typical pattern recognition algorithms verified the possibility of the automatic vapor recognition from the portable measurements. These validated the portable e-nose based on PDA developed in this study.

• 제어로봇시스템학회:학술대회논문집
• /
• 2003.10a
• /
• pp.2182-2186
• /
• 2003

This paper presents the differential type resonant accelerometer (DRXL) and its performance test results. The DRXL is the INS grade, surface micro-machined sensor. The proposed DRXL device produces a differential digital output upon an applied acceleration, and the principle is a gap-dependent electrical stiffness variation of the electrostatic resonator with torsion beam structures. Using this new operating concept, we designed, fabricated and tested the proposed device. The final device was fabricated by using the wafer level vacuum packaging process. To test the performance of the DRXL, a nonlinear self-oscillation loop is designed using describing function technique. The oscillation loop is implemented using discrete electronic elements. The performance test of the DRXL shows that the sensitivity of the accelerometer is 12 Hz/g and its long term bias stability is about $2mg(1{\sigma})$. The turn on repeatability, bandwidth, and dynamic range are 4.38 mg, 100 Hz, and ${\pm}\;70g$, respectively.

• Journal of Sensor Science and Technology
• /
• v.6 no.3
• /
• pp.194-199
• /
• 1997

When voltage or current gets out of the magnetic sensor as it is, we have often faced the problems such as introduction of noise and loss of voltage. In order to reduce these problems, a 2 drain MAGFET operating in the saturation region and fabricated by CMOS process, the system of I/V converter, VCO with operational amplifier, and V/F conversion circuits with Schmitt Trigger are designed and fabricated in one package. The absolute sensitivity of magnetic sensor shows 1.9 V/T and the product sensitivity is $3.2{\times}10^{4}\;V/A{\cdot}T$. The characteristic of V/F conversion is very stabilized and has the value of 190 kHz/T.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.1
• /
• pp.91-98
• /
• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Transactions of Materials Processing
• /
• v.29 no.1
• /
• pp.44-48
• /
• 2020

Aluminum nitride (AlN), as a substrate material in electronic packaging, has attracted considerable attention over the last few decades because of its excellent properties, which include high thermal conductivity, a coefficient of thermal expansion that matches well with that of silicon, and a moderately low dielectric constant. AlN films with c-axis orientation and thermal conductivity characteristics were deposited by using Pulsed Laser Deposition (PLD). The epitaxial AlN films were grown on sapphire (c-Al₂O₃) single crystals by PLD with AlN target and Y₂O₃ doped AlN target. A comparison of different targets associated with AlN films deposited by PLD was presented with particular emphasis on thermal conductivity properties. The quality of AlN films was found to strongly depend on the growth temperature that was exerted during deposition. AlN thin films deposited using Y₂O₃-AlN targets doped with sintering additives showed relatively higher thermal conductivity than while using pure AlN targets. AlN thin films deposited at 600℃ were confirmed to have highly c-axis orientation and thermal conductivity of 39.413 W/mK.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.37 no.2
• /
• pp.106-114
• /
• 2017

This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.

• Journal of Advanced Marine Engineering and Technology
• /
• v.36 no.1
• /
• pp.64-71
• /
• 2012

An efficient cooling system is an essential part of the electronic packaging such as a high-luminance LED lighting. A special technology, Pulsating Heat Pipe (PHP), can be applied to improve cooling of a sealed, explosion-proof LED light fixture. In this paper, the characteristics of the pulsating heat pipes in the imposed thermal boundary conditions of LED lightings were experimentally investigated and a PHP device that works free of alignment angle was investigated for cooling of explosion-proof LED lights. Five working fluids of ethanol, FC-72, R-123, water, and acetone were chosen for comparison. The experimental pulsating heat pipe was made of copper tubes of internal diameter of 2.1 mm, 26 turns. A variable heat source of electric heater and an array of cooling fins were attached to the pulsating heat pipe. For the alignment of the heating part at bottom, an optimum charging ratio (liquid fluid volume to total volume) was about 50% for most of the fluids and water showed the highest heat transfer performance. For the alignment of the heating part on top, however, only R-123 worked in an un-looped construction. This unique advantage of R-123 is attributed to its high vapor pressure gradient. Applying these findings, a cooling device for an explosion-proof type of LED light rated 30 W was constructed and tested successfully.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.25 no.2
• /
• pp.81-86
• /
• 2005

This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

• Proceedings of the KSME Conference
• /
• 2001.06a
• /
• pp.90-95
• /
• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.