• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
• /
• pp.173.1-173.1
• /
• 2011

The high fuel flexibility of gas turbine power system has boosted their use in a wide variety of applications. Recently, the demand for biogas generated from the digestion of organic wastes and sewage waste water as a fuel for gas turbines has increased. We investigated the performance of high pressure biogas compression system and operating conditions for supplying biogas. The total flow per minute of biogas from food waste water digestion tank is $54Nm^3$. The main type of biogas compression system is the reciprocating system and screw type system. The target of biogas mechanical data is the as belows; inlet pressure 0.045bar, supplying biogas temperature is $30{\sim}60^{\circ}C$, and final pressure is above the 25 bar. Also, inlet conditions of biogas consist of CH4 48.5%~83%, $H_2S$ Max. 500ppm, $NH_3$ Max. 1,500ppm and Siloxane 2.7~4.6ppm. The boosting Blower system raises a pressure from 0.045bar to 1bar before main compressor. The main system lay out of reciprocating consisits of compressor driver, filter, cooling system, blowdown vessel, control system and ESD(Emergency Shut Down) system. And an enclosure package needs to be installed for reducing noise up to 75dB. The system driver is the electronic motor of explosion proof type. Forthe compressor system reliable operation, the cleaning system something like particulate filter needs to be set up in the inlet of compressor and Coalescing Filter in the outlet of compressor. Particulate Filter has to be removed above $10{\mu}m$ size of the particles in biogas. The coalescing filter(Micofine Borosilicate Glass Fibers Filter treated phenol acid) also removes moisture and oil of above $0.3{\mu}m$ to be involved in high pressure biogas up to 90%~98%.

• 한국자동차공학회논문집
• /
• 제21권3호
• /
• pp.134-141
• /
• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 한국기록관리학회지
• /
• 제16권4호
• /
• pp.79-120
• /
• 2016

변화하는 컴퓨팅 환경에 따라 공문서 생산 환경이 G-클라우드 및 클라우드 온-나라 시스템으로 전환하고 있다. 더불어 공문서 포맷도 독자 포맷인 HWP을 대신하여 개방형 규격인 ODF가 정착할 것으로 전망된다. 이에 본 연구는 현행 공문서 장기보존 전략을 재검토 하고, ODF 생산 문서 보존에 적합한 문서보존포맷과 장기보존포맷 설계 방향을 제시하고자 한다. 생산 포맷이 ODF인 기록은 문서보존포맷으로의 변환 없이 기록관리 메타데이터를 추가한 확장 ODF 포맷을 제안하고자 하며 독자포맷의 보존에도 ODF를 검토하였다. 장기보존 포맷, 즉 NEO 포맷 변환 현황을 알아보고 BagIt 규격 패키지를 ISO21320으로 제정된 ZIP을 적용하여 장기보존포맷을 설계하였다.

• Journal of Welding and Joining
• /
• 제33권3호
• /
• pp.25-31
• /
• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• 마이크로전자및패키징학회지
• /
• 제22권1호
• /
• pp.43-49
• /
• 2015

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 반도체 칩뿐만 아니라 유기 기판도 고집적화가 요구되고 있다. 본 연구는 인쇄회로기판의 미세 피치 회로에 대한 고온고습 전압인가 시험을 실시하여 불량 메커니즘을 연구하였다. $130^{\circ}C/85%RH/3.3V$와 $135^{\circ}C/90%RH/3.3V$ 시험조건에서 고온고습 전압시험(Biased HAST)의 가속 계수는 2.079로 계산되었다. 불량 메커니즘 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. (+)전극에서는 콜로이드 형태의 $Cu_xO$와 $Cu(OH)_2$가 형성되었으며, (-)전극에서는 수지형태의 Cu가 관찰되었다. 이를 통해 $Cu^{2+}$ 이온과 전자($e^-$)가 결합한 수지상 Cu에 의해 절연파괴가 일어난다는 것을 확인하였다.

• 한국응용과학기술학회지
• /
• 제32권1호
• /
• pp.85-92
• /
• 2015

생분해성 고분자인 셀룰로오스 아세테이트(CA)를 매트릭스로 용액 중합된 HCl이 50% 정도 도핑된 PAni를 첨가하여 도전성 PCA 복합 필름을 제조하여 기계적, 전기적 특성 및 표면 morphology를 고찰하였다. PCA 복합 필름의 인장강도는 PAni 함유량 5 wt% 인 경우 순수 CA 필름($377.1kg_f/cm^2$)에 비해 27% 정도 감소된 $275.2kg_f/cm^2$를 나타내었으며, 신율도 7.65%에서 4.35% 정도로 감소하였다. 표면저항은 PAni의 함량에 따라 감소하였으며, PAni 함유량이 5 wt%인 PCA05의 경우 $7.0{\times}10^9{\Omega}/sq$로 정전기 방지용 필름으로 사용이 가능할 정도였다. 표면 정전기량의 소멸 속도도 PAni 함량에 따라 비례하여 빨라짐을 확인하였다. PCA 복합 필름의 열적 안정성은 PAni 함량이 늘어남에 따라 분해온도가 낮아졌으며, 최종 재(char)의 함량은 PAni의 함량에 비례하였다. 최종 재의 함량을 이용하여 미지의 PCA 복합 필름 중의 PAni의 분율을 계산할 수 있을 것으로 판단된다.

• 한국재료학회지
• /
• 제9권5호
• /
• pp.509-514
• /
• 1999

Interest in the integrated capacitors, which make it possible to reduce the size of and to obtain improved electrical performance of an electronic system, is expanding. In this study, $Ta_2$O\ulcorner thin film capacitors for MCM integrated capacitors were fabricated on a Upilex-S polymer film by DC magnetron reactive sputtering and the effects of low temperature annealing at various atmospheres and substrate surface morphology on the capacitor characteristics were discussed. The low temperature($150^{\circ}C$) annealing produced improved capacitor yield irrespective of the annealing at mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably mosphere. But the leakage current of the $O_2$-annealed film was larger than that of any other films. This is presumably due to the change of the $Ta_2$O\ulcorner film surface by oxygen, which was explained by conduction mechanism study. Leakage current and breakdown field strength of the capacitors fabricated on the Upilex-S film were 7.27$\times$10\ulcornerA/$\textrm{cm}^2$ and 1.0 MV/cm respectively. These capacitor characteristics were inferior to those of the capacitors fabricated on the Si substrate but enough to be used for decoupling capacitors in multilayer package. Roughness Analysis of each layer by AFM demonstrated that the properties of the capacitors fabricated on the polymer film were affected by the surface morphology of the substrate. This substrate effect could be classified into two factors. One is the surface morphology of the polymer film and the other is the surface morphology of the metal bottom electrode determined by the deposition process. Therefore, the control of the two factors is important to obtain improved electrical of capacitors deposited on a polymer film.

• 한국자기학회지
• /
• 제25권4호
• /
• pp.101-105
• /
• 2015

희토류 금속이나 4d/5d 전이금속을 포함하지 않은 3d 전이금속 Fe와 Ni 원소만을 적절하게 배열해도 강한 수직 자기이방성을 가질 수 있음을 예측한 이론 계산 결과가 최근 보고된 바 있다. 그 계산에서는 Fe 층을 표면으로 하는 계만을 고려하였는데 본 논문에서는 Ni가 표면일 때의 자기이방성 에너지를 제일원리계산 방법으로 계산하여 자기이방성을 조절할 수 있는 방안이 있을 수 있는지를 알아 보았다. Fe(001) 표면에 Ni 원소 한 층이 덮였을 때[Ni/Fe(001)]의 자성과 자기이방성을 제일원리계산 방법으로 VASP과 FLAPW 방법을 상호 보완적으로 사용하면서 계산 결과를 비교해 보았다. VASP에 의한 결과는 FLAPW 방법으로 얻은 결과와 큰 차이가 없었고, Fe와 Ni의 강한 띠 혼합으로 Fe와 Ni의 자기모멘트가 모두 증가하였으며 Ni/Fe(001)은 수평 자기이방성을 가지는 것으로 계산되었다. 원자 별 자기이방성 기여도 계산에 의하면 자기이방성에 결정적인 역할을 하는 것은 Ni표면 층임을 알 수 있었다.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
• /
• 한국우주과학회 2004년도 한국우주과학회보 제13권2호
• /
• pp.347-350
• /
• 2004

A space radiation analysis has been used to evaluate an ability of electronic equipment boxes or spacecrafts to endure various radiation effects, so it helps design thicknesses of structure and allocate components to meet the radiation requirements. A comparison study of space radiation dose analysis programs SPENVIS Sectoring Tool (SST) and SIGMA II is conducted through some structure cases, simple sphere shell, box and representative satellite configurations. The results and a discussion of comparison will be given. A general comparison will be shown for understanding those programs. The both programs use the same strategy, solid angle sectoring with ray-tracing method to produce an approximate dose at points in representative simple and complex models of spacecraft structures. Also the particle environment data corresponding to mission specification and radiation transport data are used as input data. But there are distinctions between them. The specification of geometry model and its input scheme, the assignment of dose point and the numbers, the prerequisite programs and ways of representing results will be discussed. SST is a web-based interactive program for sectoring analysis of complex geometries. It may be useful for a preliminary dose assessment with user-friendly interfaces and a package approach. SIGMA II is able to obtain from RSICC (Radiation Safety Information Computational Center) as a FOR-TRAN 77 source code. It may be suitable for either parametric preliminary design or detailed final design, e.g. a manned flight or radiation-sensitive component configuration design. It needs some debugs, recompiling and a tedious work to make geometrical quadric surfaces for actual spacecraft configuration, and has poor documentation. It is recommend to vist RSICC homepage and GEANT4/SSAT homepage.

• Bulletin of the Korean Chemical Society
• /
• 제31권4호
• /
• pp.881-886
• /
• 2010

A novel Schiff base N-(2,4-dinitro-phenyl)-N'-(1-phenyl-ethylidene)-hydrazine has been synthesized and structurally characterized by X-ray single crystal diffraction, elemental analysis, IR spectra and UV-vis spectrum. The crystal belongs to monoclinic with space group P21/n. The molecules are connected via intermolecular O-$H{\cdots}O$ hydrogen bonds into 1D infinite chains. The crystal structure is consolidated by the intramolecular N-$H{\cdots}O$ hydrogen bonds. weak intermolecular C-$H{\cdots}O$ hydrogen bonds link the molecules into intriguing 3D framework. Furthermore, Density functional theory (DFT) calculations of the structure, stabilities, orbital energies, composition characteristics of some frontier molecular orbitals and Mulliken charge distributions of the title compound were performed by means of Gaussian 03W package and taking B3LYP/6-31G(d) basis set. The time-dependent DFT calculations have been employed to calculate the electronic spectrum of the title compound, and the UV-vis spectra has been discussed on this basis. The results show that DFT method at B3LYP/6-31G(d) level can well reproduce the structure of the title compound.