• Electronics and Telecommunications Trends
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• v.20 no.2 s.92
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• pp.103-114
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• 2005

EU가 채택한 "전자통신 규제 패키지"는 종래의 정보통신 산업구조가 수직통합형에서 인터넷 기술발전에 따라 물리적인 네트워크, 전송서비스, 콘텐츠로 층별로 세분화되어 가고 있는 현실을 반영한 새로운 규제체계로 평가할 수 있다. EU는 가맹 국가에대해 이 법령을 2003년 7월까지 국내법에 적용하도록 권고하였으나, 15개 회원국 가운데 이 기한까지 국내법화를 실시한 나라는 5개국에 불과한 실정으로, 여기에 대한유럽 위원회의 대응이 주목된다. 우리나라도 이 법령의 문제점을 감안하면서 현실에맞는 통신. 방송 융합을 위한 규제 법령을 조속히 정비해야 할 것으로 기대한다.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• Journal of the Korean Vacuum Society
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• v.12 no.S1
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• pp.60-62
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• 2003

In this study we report the results of ab initio first-principles calculations to investigate the possibility of metamagnetic behavior in Fe$_3$Al alloy. We used the WIEN2k package of full-potential linearized-augmented- plane-wave method within the local-spin-density approximation to the density-functional theory. The exchange-correlation functional is the generalized-gradient approximation of Perdew-Burke-Ernzerhof. The theoretical lattice constant, which is about 0.5% smaller than the experimental one, is obtained by minimizing the total energy. If the volume decreases about 9 % from the equilibrium, the total magnetic moment decreases abruptly from 4.6 $\mu_{B}$/f.u. to 4.0 $\mu_{B}$/f.u. Since this change is considerably large (∼14%), it is possible to measure by a simple high-pressure experiment at about 180 kbar.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Proceedings of the KIEE Conference
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• summer
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• pp.363-365
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• 2004

This paper proposes a hardware implementation of intelligent electronic device for power transformer protection. And proposes an advanced main protection algorithm by voltage-current trend and flux-differential current slope characteristics. The secondary protection functions include UR, OCGR, OVR, and W etc. The main board of IED is based on the DSP chip TMS32C32 processor The IED was tested with relaying signals obtained for EMTP simulation package.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1714-1719
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• 2003

Antilock Brake System (ABS) is indispensable safety equipment for vehicles today. In order to develop new ABS ECU suitable for pneumatic brake system of a bus, a Hardware In-the-Loop Simulation (HILS) System was developed. In this HILS, the pneumatic brake system of a bus and antilock brake component were used as hardware. For the computer simulation, the 14-Degree of Freedom (DOF) bus dynamic model was constructed using the Matlab/Simulink software package. This model was compiled and downloaded in the simulation board, where the Power PC processor was used for real-time simulation. Additional commercial package, the ControlDesk was used to monitor the dynamic simulation results and physical signal values. This paper will focus on the procedure and results of evaluating the ECU in the HILS simulation. Two representative cases, wet basalt road and $split-{\mu}$ road, were used to simulate real road conditions. At each simulated road, the vehicle was driven and stopped under the help of the developed ECU. In each simulation, the dynamical behavior of the vehicle was monitored. After enough tests in the laboratory using HILS, the parameter-tuned ECU was equipped in a real bus, which was driven and stopped in the real test field in Korea. And finally, the experiment results of ABS equipped vehicle's dynamic behavior both in HILS test and in test fields were compared.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of Advanced Navigation Technology
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• v.5 no.2
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• pp.141-148
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• 2001

This paper describe the development of narrow-band passband filter with small package and low loss, high selectivity performance. This filter is placed between power amplifier and frequency mixer of IMT-2000 mobile equipment. The elliptic-function narrow-band passband filter is designed with new architecture using the microstrip line. This package is very small by $3.2cm{\times}1.25cm$ and have the 3 % 3 dB bandwidth. Also in the passband the insertion loss is about 2.5 dB and is better than older RF SAW filter(insertion loss: 3.2 dB). In the stop-band it has the two deep notch under the -56 dB.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.