• Title/Summary/Keyword: Electronic package

검색결과 388건 처리시간 0.024초

IC Package 봉착용 결정화 유리의 제조와 특성에 관한 연구 (Preparation and Characterization of Solder Glass for Electronic IC Package)

  • 손명모;감직상;박희찬;이서우;문종수
    • 한국세라믹학회지
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    • 제26권6호
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    • pp.829-835
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    • 1989
  • Devitrifing solder glasses in a specific group of glass ceramic materials are extensively used in hermetically sealing alumina electronics packages. Preferred frit glass compositions of this study consist of 37~40wt% PbO, 35~40wt% ZnO, 18~20wt% B2O3, 1~3wt% SiO2, 0~6wt% TiO2. The coated frit glasses crystallize during firing and form a strong hermetic seal. DTA and X-ray diffraction were used to characterize crystallization of the glass frit. Frit seal containing 2wt% TiO2 has crystallization temperature of 550~57$0^{\circ}C$ with surface nucleation. Frit seal containing 6wt% TiO2 has crystallization temperature of 515~5$25^{\circ}C$ with bulk nucleation, and the main crystalline phase was perovskite lead titanate having minus expansion coefficient. The average activation energy for the crystallization calculated from Ozawa equation was 65$\pm$10kcal/mol.

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BLP 패키지의 솔더 조인트의 신뢰성 연구 (Solder Joint Reliability of Bottom-leaded Plastic Package)

  • 박주혁
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.79-84
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    • 2002
  • The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

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Y이 도핑된 ZnO의 전자상태 계산 (Calculation on Electronic State of Y-doped ZnO)

  • 이동윤;이원재;송재성;구보근;김현주
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.172-173
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    • 2005
  • The electronic state of ZnO doped with Y was calculated using the density functional theory. In this study, the program used for the calculation on theoretical structures of ZnO and doped ZnO was Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The detail of electronic structure was obtained by the descrite variational $X\alpha$ (DV-$X\alpha$) method, which is a sort of molecular orbital full potential method. The optimized crystal structures obtained by calculations were compared to the measured structure. The density of state and energy levels of dopant elements was shown and discussed in association with optical properties.

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MCM-D 공정기술을 이용한 V-BAND FILTER 구현에 관한 연구 (V-Band filter using Multilayer MCM-D Technology)

  • 유찬세;송생섭;박종철;강남기;차종범;서광석
    • 대한전자공학회논문지SD
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    • 제43권9호
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    • pp.64-68
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    • 2006
  • 본 연구에서는 Si bump를 이용해 기판의 기계적, 열적 특성을 개선한 MCM-D 기판공정을 개발하였고, 이를 system-on-package(SOP)-D개념의 system 구현에 적용하고자 하였다. 이 과정에서 밀리미터파 대역에 적용될 수 있는 필터를 설계하고 구현하여 그 특성을 관찰하였다. 두 가지 형태의 필터를 구현하였는데 첫 번째는 공진기간의 커플링을 이용한 구조로서 2층의 금속층과 3층의 유전체(BCB)를 이용하였다. 구현된 필터 특성은 중심주파수 55 GHz에서의 삽입손실이 2.6 dB이고 군지연이 0.06 ns정도로 우수한 특성을 나타내었다. 또한 일반적으로 알려진coupled line 형태의 필터를 구현하였는데 삽입손실이 3 dB, 군지연이 0.1 ns정도의 특성을 나타내었다. 이렇게 내장형 필터를 포함한 MCM-D 기판은 MMIC를 flip-chip 방법으로 실장 할 수 있어서 집적화된 밀리미터파 대역 초소형 system 구현에 적용되어 우수한 특성을 나타낼 것으로 기대된다.

8빔 압저항형 가속도센서의 자기진단 기능을 위한 IC칩 제조 (Fabrication of IC Chip for Self-Diagnostic Function of a Eight-Beam Piezoresistive Accelerometer.)

  • 박창현;전찬봉;강희석;김종집;이원태;심준환;김동권;이종현
    • 센서학회지
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    • 제8권1호
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    • pp.38-44
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    • 1999
  • 본 논문에서는 8빔 압저항형 가속도센서에서 하나 이상의 빔이 파손되는 대부분의 경우에 대하여 에러신호를 검출할 수 있는 자기진단회로를 구현하고, 이를 PSPICE를 사용하여 시뮬레이션으로 그 기능을 확인하였다. 또한 현재 상용으로 나오는 KA 324 증폭기의 레이아웃을 사용하여 자기진단회로를 표준 바이폴라(bipolar)공정을 이용하여 IC칩으로 제조하고, 24핀 플라스틱 패키지 한 후 자기진단 특성을 조사하였다. 이때, 측정된 회로의 자기진단 특성을 시뮬레이션 결과와 비교하였다.

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Unsub를 활용한 전자저널 구독방식 개선 연구 (A Study on the Improvement of Electronic Journal Subscription Method using Unsub)

  • 김이기;김신영
    • 한국비블리아학회지
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    • 제35권3호
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    • pp.137-159
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    • 2024
  • 본 연구는 대학도서관의 전자저널 구독종수, 구독료, 이용 현황, 비용-효과 등을 분석하여 한계와 문제점을 도출하였다. 이를 바탕으로 사례도서관을 선정하여 시뮬레이션 도구인 Unsub를 활용하여 패키지 구독과 개별 구독의 효율성을 비교하고 개선 방안을 제시하였다. C대학도서관의 경우, SAGE와 Emerald는 기존과 같이 패키지 구독이 비용 효과적인 것으로 나타났고, ScienceDirect와 OUP는 개별 구독을 고려할 수 있는 것으로 나타났다. 특히 OUP의 경우는 개별 구독 시에 연 £6,063을 절감할 수 있고, 접근·이용 가능한 논문 비율이 85.8%에 달했다. 그리고 ScienceDirect는 개별 구독 및 종량제를 병행하는 모델이 예산 절감과 이용 편이성을 감안하면 가장 효과적인 것으로 나타났다. 본 사례 연구의 결과를 바탕으로 Unsub의 적용 한계와 함께 한국 실정에 맞는 'K-Unsub' 버전 개발을 위한 정책적 과제를 제언하였다.

자세 제어 장치와 능동 후륜 조향을 이용한 최적 요 모멘트 분배 (Optimum Yaw Moment Distribution with Electronic Stability Control and Active Rear Steering)

  • 임성진
    • 제어로봇시스템학회논문지
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    • 제20권12호
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    • pp.1246-1251
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    • 2014
  • This article presents an optimum yaw moment distribution scheme for a vehicle with electronic stability control (ESC) and active rear steering (ARS). After computing the control yaw moment in the yaw moment controller, it should be distributed into tire forces, generated by ESC and ARS. In this paper, yaw moment distribution is formulated as an optimization problem. New objective function is proposed to tune the relative magnitudes of the tire forces. Weighed pseudo-inverse control allocation (WPCA) is adopted to solve the problem. To check the effectiveness of the proposed scheme, simulation is performed on a vehicle simulation package, CarSim. From the simulation, the proposed optimum yaw moment distribution scheme is shown to effective for vehicle stability control.

Fe-Ni 합금 클래드 리드 프레임을 이용한 전자 재료 접합부의 품질향상과 그 신뢰성 (Quality improvement on joints of electronic materials and its reliability by Fe-Ni alloy clad lead frame)

  • 신영의;최인수;안승호
    • Journal of Welding and Joining
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    • 제13권2호
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    • pp.82-95
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    • 1995
  • This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

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트랙터의 전자 유압식 히치 제어 시스템에 관한 연구 (III) -컴퓨터 시뮬레이션- (Electronic-Hydraulic Hitch Control System for Agricultural Tractors (III) -Computer Simulation-)

  • 김기영;류관희;유수남
    • Journal of Biosystems Engineering
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    • 제15권4호
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    • pp.290-297
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    • 1990
  • The purposes of this study were to perform theoretical analysis of an electronic-hydraulic hitch control system for position and draft control of tractor implements and to investigate the performance of the control system through computer simulation. Computer simulation models which could predict the responses of the system to the step and sinusoidal inputs in position and draft controls were developed using the simulation package "TUTSIM". The effects of control mode, hydraulic flow rate, deadband, and proportional constant on control performance of the system were investigated. The simulated results were compard with the experimental ones to verify the simulation models. The simulation models appeared to be a useful means for the analysis and the design of the electronic-hydraulic hitch control system.

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전극형상을 고려한 수정진동자 해석 기법 연구 (FEM analysis of Quartz oscillator considering dimensions of electrode)

  • 박승배;김종정;이덕훈;김태성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.543-546
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    • 2001
  • So far, the design methods of quartz crystal resonator have been developed. Recently, as the electronic package and semiconductor modules become smaller, the need to minimize the sizes of crystal components grows larger. but Minimizing crystal plate sizes has limitations because its temperature-frequency characteristics is worse and unwanted resonances occur. so appropriate design of electrode size and crystal plates is necessary. In this palter, Two-dimensional governing equations for electroded piezoelectric crystal plates with general symmetry have been solved from deduced equations from three-dimensional equations of linear piezoelectricity in most cases. In practice, electroded piezoelectric crystal plates have three-dimensional geometry, so simplified 2-dimensional equations and 2-D modeling are insufficient for explaining its resonance modes and characteristics. So, three-dimensional FEM(finite element method) analysis is done and its effectiveness is verified from analyzing practical crystal resonator model.

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