• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.1
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• pp.131-138
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• 2001

The performance analysis of an electronic equipment test is very complicate due to the variety o vehicles. In this study, automatic design system for the electronic equipment test has been carried out using the standard load patterns. For the test, standard signal patterns for each item are modeled. The test items can be decided by the user by means of these patterns. Also, engineering software modules are developed and proved to be very efficient for analyzing the test results statistically. Experiments are performed for the test system in the vehicle assembly line. By analyzing the test results, it is found that bad samples can be detected without failure. Also, the engineering software modules provide an analytical tool for the automation of the test process.

• Journal of Power Electronics
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• v.14 no.6
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• pp.1345-1356
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• 2014

The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.2
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• pp.141-145
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• 2017

This paper presents a method to improve Li-ion battery charging speed for portable electronic devices maintaining stable operating temperature. The proposed method uses multiple chargers which consist of a master module and slave modules designed with single wire communication signal for parallel current path in order to simplify the additional hardware needs. A single wire communication signal control between a master module and slave modules makes the number of pins of parts lowered and the required area small, furthermore leading to lower cost. Therefore the proposed charging method can be practically used for implementing battery charging modules requiring high speed Li-ion battery charging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.28-29
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• 2006

When photovoltaic module is used for a long time, its performance decreases due to several reasons. In this paper, we focus on the possibilities mainly contributing to the degraded efficiency of the polycrystalline silicon photovoltaic modules. The analysis is based on the modules that have been used for 15 years. These are two main reasons that cause the efficiency degradation, the corrosion and thermal decomposition. The former phenomenon of electrode is mainly due to the moisture from damaged back sheet in some module. However the other reason of the degraded efficiency comes from the thermal decomposition, which can not be observed from the outside but only by experiment. In this study, the comparison between the efficiency of normal modules and degradation modules is presented. Module having degraded cell was seen to cause increase of series resistance by about 80%, in comparison to normal samples efficiency which reduce by about 20%. This study shows that the effects of series resistances on module performance are critical. These effects must be understood and taken into consideration when analyzing performance degradation.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2420-2425
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• 2007

Heat transfer from three-dimensional heat-generating modules was investigated. A simulated electronic module in an array configured with dummy module elements was used to measure the average heat transfer coefficients. Various module arrangements were tested using module spacings of 0.85 and 1.15 cm for six Reynolds numbers ranging from 500 to 975. The results show that a module placed in-line with and upstream of a heated module results in the heat transfer enhancement due to a high level in turbulence prompted by upstream modules. The highest enhancement occurs when the separation distance between modules is close to the module length in the flow direction. Flow visualization reveals laminar flow on the front of the first module, slow recirculation regions on the sides parallel to the air stream, and turbulence on the back side. It appears that the first module serves to trip the air stream and produce a high level of turbulence, which enhances the heat transfer rate downstream.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.6
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• pp.407-412
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• 2008

Heat transfer from three-dimensional heat-generating modules was investigated. Simulated electronic module in an array configured with dummy module elements were used to measure the average heat transfer coefficients. Various module arrangements were tested using module spacings of 0.85 and 1.15 cm for six Reynolds numbers ranging from 500 to 975. The results show that a module placed in-line with and upstream of a heated module results in the heat transfer enhancement due to high turbulence intensity prompted by upstream modules. The highest enhancement occurs when the separation distance between modules is close to the module length in the flow direction. The laminar flow was observed on the front of the first module, slow recirculation regions on the sides parallel to the airstream, and turbulent flow on the back side. It appears that the first module serves to trip the air stream and produce a high level of turbulence, which enhances the heat transfer rate downstream.

• Journal of the Korean Solar Energy Society
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• v.33 no.4
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• pp.89-93
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• 2013

In recent years, many investigations about photovoltaic power systems have been significantly carried out in the fields of renewable power energy. Such research area generally includes developments of highly efficient solar cells, advanced power conversion systems, and smart monitoring systems. A generic objective of fault detection and diagnosis techniques is to timely recognize unexpected faulty of dynamic systems so that economic demage occurred by such faulty is decreased by means of engineering techniques. This paper presents a novel fault detection approach for photovoltaic power arrays which are electrically connected in series and parallels. In the proposed fault detection scheme, we first measure all of photovoltaic modules located in each array by using electronic sense systems and then compare each measurement in turn to detect location of fault module through statistic computation algorithm. We accomplish real-time experiments to demonstrate our proposed fault detection methodology by using a test-bed system including two 20 watt photovoltaic modules.

• Journal of IKEEE
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• v.19 no.4
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• pp.610-616
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• 2015

In this paper, an electronic ID system satisfying security requirements of authentication certificate was designed using fingerprint recognition. The proposed electronic ID system generates a digital signature with forgery prevention, confidentiality, content integrity, and personal identification (=non-repudiation) using fingerprint information, and also encrypts, sends, and verify it. The proposed electronic ID system exploits fingerprint instead of user password, so it avoids leakage and hijacking. And it provides same legal force as conventional authentication certificate. The proposed electronic ID consists of 4 modules, i.e. HSM device, verification server, CA server, and RA client. Prototypes of all modules are designed and verified to have correct operation.

• Honam Mathematical Journal
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• v.38 no.2
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• pp.259-267
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• 2016

A module M over an associative ring R with unity is a QTAG-module if every finitely generated submodule of any homomorphic image of M is a direct sum of uniserial modules. Recently, the authors introduced the classes of QTAG-modules namely as socle-regular and strongly socle-regular QTAG-modules which properly contain the classes of transitive and fully transitive QTAG-modules respectively. Here we define strongly and quasi transitivities and study the inter relations between various type of transitivities.

• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1739-1745
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• 2014

Prediction of fault-prone modules continues to attract researcher's interest due to its significant impact on software development cost. The most important goal of such techniques is to correctly identify the modules where faults are most likely to present in early phases of software development lifecycle. Various software metrics related to modules level fault data have been successfully used for prediction of fault-prone modules. Goal of this research is to predict the faulty modules at design phase using design metrics of modules and faults related to modules. We have analyzed the effect of pre-processing and different machine learning schemes on eleven projects from NASA Metrics Data Program which offers design metrics and its related faults. Using seven machine learning and four preprocessing techniques we confirmed that models built from design metrics are surprisingly good at fault proneness prediction. The result shows that we should choose Naïve Bayes or Voting feature intervals with discretization for different data sets as they outperformed out of 28 schemes. Naive Bayes and Voting feature intervals has performed AUC > 0.7 on average of eleven projects. Our proposed framework is effective and can predict an acceptable level of fault at design phases.