An Experimental Study of Heat Transfer Characteristics on the Electronic Module Arrangement |
Lee, Dae-Hee
(인제대학교 기계자동차공학부, 고안전 차량 핵심기술 연구소)
Lee, Dae-Keun (인제대학교 대학원 기계공학과) Cha, Yoon-Seok (인제대학교 대학원 기계공학과) Lee, Jun-Sik (인제대학교 대학원 기계공학과) |
1 | Sara, O. N., Pekdemir, T., Yapici, S., Yilmaz, M., 2001, “Enhancement of Heat Transfer From a Flat Surface in a Channel Flow by Attachment of Rectangular Blocks,” International Journal of Energy Research, Vol. 25, No. 7, pp. 563-576 DOI ScienceOn |
2 | Moffat, R. J., Arvizu, D. E. and Ortega, A., 1985, "Cooling Electronic Components : Forced Convection Experiments with an Air-Cooled Array," Heat Transfer in Electronic Equipment, HTD, Vol.48 |
3 | Kang, S. S., 1994, "The Thermal Wake Function for Rectangular Electronic Modules," Journal of Electronic Packaging, Vol. 116, pp. 55-59 DOI ScienceOn |
4 | Nakayama, W. and Park, S.H., 1996, "Conjugate Heat Transfer From a Single Surface-Mounted Block to Forced Convective Air Flow in a Channel," Journal of Heat Transfer, Vol. 118, pp. 301-309 DOI ScienceOn |
5 | Kang, B. H., Jaluria, Y. and Tewari, S. S., 1990, "Mixed Convection Transport From an Isolated Heat Source Module on a Horizontal Plate," Journal of Heat Transfer, Vol. 112, pp. 653-661 DOI |
6 | Najam, M., Amahmid, A., Hasnaoui, M. and El Alami, M., 2003, “Unsteady Mixed Convection in a Horizontal Channel with Rectangular Blocks Periodically Distributed on its Lower Wall,” The International Journal of Heat and Fluid flow, Vol. 24 No. 5, pp.726-735 DOI ScienceOn |
7 | Ortolano, D. J. and Hines, F. F., 1983, "A Simplified Approach to Heat Flow Measurement," Proceedings of the ISA International Conference and Exhibit, Advances in Instrumentation, Vol. 38, October 10-13 |
8 | Chomdee, S. and Kiatsiriroat, T., 2006, “Enhancement of Air Cooling in Staggered Array of Electronic Modules by Integrating Delta Winglet Vortex Generators,” International Communications in Heat and Mass Transfer, Vol. 3, No. 5, pp.618-626 DOI ScienceOn |
9 | Buller, M. L. and Kilburen, R. F., 1981, "Evaluation of Surface Heat Transfer Coefficients for Electronic Module Packages," Heat Transfer in Electronic Equipment, HTD, Vol. 20, ASME Winter Annual Meeting, Nov. 15-20 |
10 | Roeller, P. T., Stevens, J. and Webb, B. W., 1991, "Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels." |
11 | Wirtz, R. A. and Colban, D. M., 1996, "Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages," Journal of Electronic Packaging, Vol. 118, pp. 27-30 DOI |
12 | Young, T. J. and Vafai, K., 1999, "Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles," Journal of Heat Transfer, Vol. 121, pp. 34-42 DOI ScienceOn |