• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.4
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• pp.353-362
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• 2007

Unlike large satellites, small satellites, such as nanosatellite and microsatellite, can provide a limited interior space for components mounting. In order to mitigate this issue, the compact Bus Electronic Unit(BEU) that integrates satellite electronic modules, combining most of bus subsystems and payload electronic modules into one unit, has been developed for HAUSAT-2 nanosatellite. This paper addresses the design and environmental test result analyses of BEU. The vibration and thermal vacuum tests were conducted at qualification level for the verification of design margin of newly developed BEU. The performance of individual electronic subsystem modules has been verified through performance tests before and after the qualification tests. It was confirmed that the natural frequency of BEU satisfies the design stiffness requirement without structural damage in the vibration test. Thermal analysis results were also almost consistent with test results through modified thermal analysis modeling.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.119-123
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• 2002

A new modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for reconstruction of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host (computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.580-583
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• 2009

This paper introduces a gate drive IC for power modules with shoot-through immunity. A new approach uses a bootstrap diode as a high-side voltage bias and a level shift function at the same time. Therefore, the gate drive circuit becomes a simple and low-cost without conventional level shift functions such as HVIC(High-Voltage IC), optocoupler and transformer. The proposed gate drive IC is designed and fabricated using the Dongbu-Hitek's 0.35um BD350BA process. It has been tested and verified with IGBT modules.

• Proceedings of the KIPE Conference
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• 2009.11a
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• pp.123-125
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• 2009

Mismatch of electrical characteristics of modules in PV string invokes mismatch power loss. The mismatch occurs due to various causes such as shadow, aging, contamination, and module exchange. The concept of mismatch compensation converter(MCC) is presented in this paper to remedy the mismatch loss problem. MCC is connected to irregular modules only. MCC is composed of dc-dc converter and MPPT controller. It is noted that MPPT algorithm is employed to control MCC and is effective for maximum power available from irregular modules. The selection guide of MPPT control period is given based on the period of MPPT in PCU. The effectiveness of the MCC is verified by a prototype experiment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.54-57
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• 2008

A new modular Lateral Information Propagation Networks can be implemented in a IC chip with the circuit VLSI technology for detection of bad materials. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. For detecting of Faulty Insulator, $4\;{\times}\;4$ neural network modules has been designed and simulation of interpolation with the designed networks has been done.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.81-82
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• 2009

This paper introduces a gate drive IC for power modules with shoot-through immunity. A new approach uses a bootstrap diode as a high-side voltage bias and a level shift function at the same time. Therefore, the gate drive circuit becomes a simple and low-cost without conventional level shift functions such as HVIC(High-Voltage IC), optocoupler and transformer. The proposed gate drive IC is designed and fabricated using the Dongbu-Hitek's 0.35um BD350BA process. It has been tested and verified with IGBT modules.

• Journal of Power Electronics
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• v.11 no.4
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• pp.561-567
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• 2011

This paper presents a high-efficiency power conditioning system (PCS) for grid-connected photovoltaic (PV) modules. The proposed PCS consists of a step-up DC-DC converter and a single-phase DC-AC inverter for the grid-connected PV modules. A soft-switching step-up DC-DC converter is proposed to generate a high DC-link voltage from the low PV module voltage with a high-efficiency. A DC-link voltage controller is presented for constant DC-link voltage regulation. A half-bridge inverter is used for the single-phase DC-AC inverter for grid connection. A grid current controller is suggested to supply PV electrical power to the power grid with a unity power factor. Experimental results are obtained from a 180 W grid-connected PV module system using the proposed PCS. The proposed PCS achieves a high power efficiency of 93.0 % with an unity power factor for a 60 Hz / 120 Vrms AC power grid.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.448-451
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• 2000

The purpose of this study is to manufacture and test a thermoelectric generator which converts unused energy from close-at-hand sources, such as garbage incineration heat and industrial exhaust, to electricity. A manufacturing process and the properties of a thermoelectric generator are discussed before simulating the thermal stress and thermal properties of a thermoelectric module located between an aluminum tube and alumina plate. We can design the thermoelectric modules having the good properties of thermoelectric generation. Resistivity of thermoelectric module for thermoelectric generation consisting of 62 cells was 0.15-0.4$\Omega$ Developed thermoelectric modules can be expected th have better properties than thermoelectric cooling modules above $70^{\circ}C$ in temperature difference between hot and cold ends.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.4
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.