• Journal of Institute of Control, Robotics and Systems
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• v.16 no.6
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• pp.546-552
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• 2010

As the demands for the safety and convenience applications of the vehicles increase, the data load for the In-vehicle Network has increased significantly. As a result, a deterministic and fault-tolerant communication system is required to implement the safety critical applications such as X-by-wire systems. FlexRay communication system is a new standard of network communication system which provides the high speed serial communication, time triggered bus and fault tolerant communication between electronic devices. In addition to time-triggered communication, as providing of the event-triggered communication such as CAN, FlexRay protocol is able to manage the restricted communication resource more effectively. This paper presents the development of FlexRay driver which will be applied to the future ECU's communication system. To develop the FlexRay driver, the FlexRay requirement specification and FlexRay specification is analyzed. The developed FlexRay driver is implemented by using MPC5567 microprocessor of the Freescale semiconductor. To verify the developed FlexRay driver, the waveform of the FlexRay driver was measured and compared with the CAN communication system. As a result, the bus load is reduced about 13% compared with the CAN communication system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.3 s.333
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• pp.17-24
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• 2005

We fabricated PIN-Photodiodes with a single mode fiber for analog communications and analyzed characteristics of the devices. The fabricated PIN-Photodiode shows a bandwidth of 1.5 GHz, a dark current of 20 p4 a capacitance of 0.48 pF, and the responsivity of 0.9 V/W, a second order distortion of -72 dBc. In this paper, we developed a new optical Packaging technology that is aligning in real-time monitoring of both responsivity and IM2 characteristics. As a result responsivity has been improved by 0.03 V/W, and also U has been improved by $3\~5\;dBc$. On the other hand, failure ratio has been reduced by $3.5\%$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.155-165
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• 2001

By suggesting a mixed-mode transient simulation method utilizing a 2-dimensional device simulator, we have analyzed CDM ESD Phenomena in CMOS chips, which utilize NMOS transistors as ESD protection devices. By analyzing the simulation results, the mechanisms leading to device failures in CDM discharge and the differences in discharge characteristics with different polarities of stored charges have been explained in detail. The effects of changes in interconnection resistance values on the gate-oxide failure at input buffers, which is the most serious problem in CDM discharge, have been examined. Also improvements in discharge characteristics with addition of the NMOS transistor for input-buffer protection have been examined.

• Journal of the Korean Magnetics Society
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• v.17 no.5
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• pp.210-214
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• 2007

Recent years have seen a rapid development of spintronics. One of the major achievements of this field is the understanding of spin dependent process in various physical systems, for example, metallic multilayers showing the giant magnetoresistance (GMR). Today devices based on the GMR are revolutionizing electronic data storage. In this paper, we review recent developments in the research on GMR of low dimensional structures. We describe the magnetoresistance properties of magnetic multilayers, multilayered nanowires and nonopillars, etc.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.48 no.3
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• pp.53-59
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• 2011

Charge transfer through DNA oligonucleotides has been investigated for potential applications of DNA into molecular electrooptic switching devices. Electrons were injected using gold electrode probes where DNA oligomers were adsorbed that are separated in medium. The results show that increased adsorption of DNA reduces the ionization current due to the combined effect of charge transfer through DNA and surface-limited charge transport. The probe-based charge injection was extended to examine the capability of extinguishing fluorescence of Cy3 dye molecules attached to DNA. It is expected that the results may be employed to implementing a novel electrooptic switching device based on DNA molecules.

• Journal of IKEEE
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• v.18 no.1
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• pp.64-76
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• 2014

In the image acquisition tests of image sensors and modules, how to compare pixel values, how to digitize "defect", and how to determine "fault" are extremely varied from test equipments. Therefore, setup of test equipments for image acquisition characteristics should be customized for target devices under test. In general, test procedures are delivered as technical documents in not standardized but arbitrary formats. So test equipment should be manually programmed fitting individual setup condition. This costs huge time and effort and has high risk of human error. In this paper, the standardized description method is proposed to apply to almost all existing tests where various tests are described in a single framework.

• Journal of IKEEE
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• v.18 no.1
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• pp.77-95
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• 2014

In general, image acquisition characteristics tests of image sensors and modules vary widely according to the characteristics of image sensors and modules under test, the application purpose of target devices where image sensors and modules are mounted, and the functions of test equipments. However, some de facto standard tests are frequently used in industry fields. They differ only in several parameters e.g. thresholds for fault detection, and they can be applied to most image sensors and modules. In this paper, 11 typical tests are explained in detail, and they are described in a simple and clear form under single framework, which significantly reduces errors and saves efforts.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.10
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.118-121
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• 2004

Manufacturing process for milli components has recently gained researcher's focus with the increasing tendency toward highly integrated and micro-scaled parts for electronic devices. The milli-components cannot be formed by the conventional manufacturing process since the parts require higher dimensional accuracy than the conventional ones. In order to enhance the forming accuracy and productivity, various forming procedures proposed and studied by many researchers. In this paper, forming analysis of milli-components has been studied with a new micro-former. In modeling of progressive dies, multi-stage forming sequence has been analyzed with finite element analysis by LS-DYNA3D. The analysis proposes the sequential die and part shapes with the corresponding punch force and dimensional accuracy. The analysis also considers the effect of elastic dies on the dimensional accuracy of the formed parts. The analysis result demonstrates that the elastic analysis in the milli-forming process is indispensable fur accurate forming analysis. The analysis procedure in the paper will provide good information in design of a new micro-former and milli-component.

• Journal of the Korean Ceramic Society
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• v.54 no.4
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• pp.272-277
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• 2017

Organic-inorganic hybrid thermoelectric materials have obtained increasing attention because it opens the possibility of enhancing thermoelectric performance by utilizing the low thermal conductivity of organic thermoelectric materials and the high Seebeck coefficient of inorganic thermoelectric materials. Moreover, the organic-inorganic hybrid thermoelectric materials possess numerous advantages, including functional aspects such as flexibility or transparency, low cost raw materials, and simplified fabrication processes, thus, allowing for a wide range of potential applications. In this study, the types and synthesis methods of organic-inorganic thermoelectric hybrid materials were discussed along with the methods used to enhance their thermoelectric properties. As a key factor to maximize the thermoelectric performances of hybrid thermoelectric materials, the nanoengineering to control the nanostructure of the inorganic materials as well as the modification of the organic material structure and doping level are considered, respectively. Meanwhile, the interface between the inorganic and organic phase is also important to develop the hybrid thermoelectric module with excellent reliability and high thermoelectric efficiency in addition to its performance in various electronic devices.