• 제목/요약/키워드: Electronic cooling

검색결과 461건 처리시간 0.029초

고온 초전도 자속흐름 트랜지스터에 적용된 전자냉각 특성 시뮬레이션 (Characteristics Simulation of Electronics Cooling for a High-Temperature Superconducting Flux Flow Transistor Circuit)

  • 고석철;강형곤;임성훈;두호익;이종화;한병성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.1063-1066
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    • 2002
  • An equivalent circuit for the superconductor flux flow transistor(SFFT) was combined with high temperature cooling device, based on the analogy between thermal and electrical variables using the high-temperature superconductor(HTS), is proposed. The device is composed of parallel weak links with a nearby magnetic control line. A model has been developed that is based on solving the equation of motion of Abrikosov vortices subject to Lorentz viscous and pinning forces as well as magnetic surface barriers. The use of thermal models the global performance of thermal cooling circuit and signal system to be checked by using electrical circuit analysis programs such as SPICE.

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진동 세관형 히트파이프를 이용한 통신 기기용 마이크로 냉각시스템의 개발 (Development of Micro Cooling System for Telecommunication System using Oscillating Heat Pipe)

  • 하수정;배내수;박철민;김종수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1499-1505
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    • 2003
  • Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. So, in this paper, characteristics on oscillating heat pipe according to operating conditions(environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated. From the experimental results, $25^{\circ}C$environment temperature), R-141b(working fluid)40%(charging ratio) was best performace at others of inclination angle and The top heating mode of OCHP performed 80% efficiency of the bottom heating mode.

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전자 장비 냉각에 있어서의 분리형 써모사이펀의 적용 (The application of separate type thermosyphon for cooling of electronic equipments)

  • 김지훈;박신보;윤정호;김시범;전철호
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2002년도 학술대회지
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    • pp.725-728
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    • 2002
  • A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

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Radiator cooling fan용 스위치드 릴럭턴스 전동기 및 토폴로지에 관한 연구 (A Study on Switched Reluctance Motor and Converter topology for Radiator Cooling Fan)

  • 정동효;윤용호;한대희;이태원;원충연
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2003년도 춘계전력전자학술대회 논문집(2)
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    • pp.866-871
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    • 2003
  • In automobile, the introduction of electronically commutated motors has been accompanied by a proliferation of electronic devices. With this proliferation of electronic devices, an emphasis has been placed on EMC issues. This paper is proposed to use SRM as a radiator cooling fan in automotive applications. To drive SRM, Energy efficient C-dump converter is applied. It is verified more efficient than other converters through simulation and experiments. And also SRM is valid automotive applications that have strict EMC standards. It is compared SRM with BLDC and DC motor by experiments.

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밀폐 형 전장 박스 온도 제어를 위한 히트 펌프 설계 (Design of Heat Pump for Temperature Control of Sealed Electric Box)

  • 이영태
    • 반도체디스플레이기술학회지
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    • 제19권2호
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    • pp.110-114
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    • 2020
  • In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

Numerical Analysis of Micro-jet Array Cooling Device with Various Configurations

  • Jung, Yang-Ki;Lee, In-Chan;Ma, Tae-Young
    • Transactions on Electrical and Electronic Materials
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    • 제6권2호
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    • pp.39-45
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    • 2005
  • Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.

복합재료에 의한 열전변환 냉각소자의 개발에 관한 연구 (Experimental fabrication and analysis of thermoelectric devices)

  • 성만영;송대식;배원일
    • E2M - 전기 전자와 첨단 소재
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    • 제9권1호
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    • pp.67-75
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    • 1996
  • This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

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흡습된 수냉각 발전기 고정자 권선의 전기적 특성 (Electrical Properties of Wet Bars in Water-cooled Generator Stator Windings)

  • 김병래;김희동
    • 한국전기전자재료학회논문지
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    • 제25권10호
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    • pp.817-823
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    • 2012
  • Insulation breakdown of water-cooled generator stator windings occurs frequently due to leakage of cooling water and absorption into the insulation material. Leakage and absorption problems of water-cooled stator windings are often found during regular preventive maintenance. To evaluate cooling water leakage and absorption, diagnostic tests were performed on two water-cooled turbine generators, which have been in service for 13 and 17 years, respectively. The test results of the measured electrical properties such as dissipation factor($tan{\delta}$), capacitance and AC leakage current for water-cooled generator stator windings with wet bars are reported in this paper.

열전냉각소자와 열전발전소자의 발전특성 (Characteristics of electric power for thermoelectric cooling & generating module)

  • 우병철;이희웅;이동윤
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.448-451
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    • 2000
  • The purpose of this study is to manufacture and test a thermoelectric generator which converts unused energy from close-at-hand sources, such as garbage incineration heat and industrial exhaust, to electricity. A manufacturing process and the properties of a thermoelectric generator are discussed before simulating the thermal stress and thermal properties of a thermoelectric module located between an aluminum tube and alumina plate. We can design the thermoelectric modules having the good properties of thermoelectric generation. Resistivity of thermoelectric module for thermoelectric generation consisting of 62 cells was 0.15-0.4$\Omega$ Developed thermoelectric modules can be expected th have better properties than thermoelectric cooling modules above $70^{\circ}C$ in temperature difference between hot and cold ends.

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모세구동 소형 냉각시스템의 실험적 연구 (An Experimental Study on Small Capillary Pumped Cooling System)

  • 양재경;이규정;이정현
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집B
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    • pp.234-239
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    • 2000
  • The capillary pumped cooling system (CPCS) is a cooling system which controls temperature of the small electronic devices, such as IC device systems, notebook computers, etc. An important feature of CPCS is that a working fluid circulates in a system by capillary force in tubes instead of mechanical input power. The cooling effect of CPCS is investigated with respect to heat flux, condensation temperature under different working fluids (water, ethanol, methanol). Capillary pumped flows are visualized under various conditions and mass flow rate and temperature are experimentally measured. It is shown that the increasing tendency of mass flux for each working fluid is observed as the temperature of evaporator increases, and that the cooling possibility of CPCS depends on the performance of evaparator and condenser which sustains the steady state temperature continuously.

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