• 한국결정성장학회지
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• 제20권5호
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• pp.216-220
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• 2010

Si(100) wafer와 $SiO_2$/Si(100) 웨이퍼에 증착된 NiFe 합금 박막의 결정상과 자기적 특성을 비교하고자 동시 스퍼터링법을 이용하여 두 기판 위에 150 nm의 박막을 제조하여 그의 상변화와 자기적 특성을 XRD, FE-SEM, VSM으로 비교하였다. 두 기판 위에 증착된 NiFe 박막은 BCC상으로 증착되었으나 $400^{\circ}C$에서 2시간 열처리를 한 결과 BCC에서 FCC로의 상전이가 일어나는 것을 관찰 할 수 있었으며 Si(100) wafer위에 증착된 박막에서는 $500^{\circ}C$에서 열처리 후에도 BCC와 FCC가 혼재하여 나타나는 것을 알 수 있었다. $450^{\circ}C$에서 열처리 하였을 때 각형비가 가장 높았으며 포화자화는 0.0118 emu로 나타나고 있었다. $500^{\circ}C$ 이상의 온도에서는 상전이로 인해 포화자화가 급격히 감소하는 것을 볼 수 있었다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2001년도 전력전자학술대회 논문집
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• pp.467-470
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• 2001

Power electronic converters generate the harmonic voltage and current, and these harmonics have the harmful effects on the various components. For example, passive components such as capacitor and inductor, transformer, motor and other components are mainly affected in the power electronic system. Thus, the design and manufacturing of the power converters, which have the harmonic-free or mitigation strategies, are required. In particular, the lifetime and durability of these components are main requirement for enhancing the overall stability of the system. So, in this paper, the harmonics-related problems to the neighbouring components and mitigation research trends are presented.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.171-172
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• 2005

PSNZT계 압전 세라믹스는 압전 특성을 개량하고, 여러 가지 응용 분야의 요구를 만족할 특성을 얻기 위해 Mn을 포함하는 첨가물에 관한 연구를 하였다. Mn을 포함하는 산화물은 기계적 품질계수($Q_m$)를 높이는 강화제로 널리 활용되고 있으며, $Mn^{4+}$를 갖는 $MnO_2$가 가장 많이 사용되고 있다. 산화물에서 Mn 전자가는 여러 상태 인데, 이런 전자가의 변화가 압전 특성에 미치는 영향을 조사하였다. Mn 전자가에 따라서 소결체의 미세구조는 $MnCO_3$와 $Mn_3O_4$경우 입자크기가 10${\mu}m$정도였으며, $Mn_2O_3$와 $MnO_2$의 입자크기는 $1\sim5{\mu}m$정도로 불규칙하였다. 전반적으로 소결체는 밀도가 $7.75g/cm^2$이상이었고, 치밀하였다. $MnCO_3$경우 전기기계 결합계수는 56%이고, $MnO_2$경우 기계적 품질계수는 2000이상이었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1749-1753
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• 2007

The reliability, that is Long-Term Quality, require an approaching different from Short-Term Quality which is used before. As the electronic components are able to be easily normalized on the reliability testing, various testing standards are used. In this study, we proposed two reliability simulator that is PoF(Physics of Failure)-based and failure rate models-based. PoF-based simulator is introduced based on CalceEP program that is created by University of Maryland. This simulator can be modified by user interface of properties and PoF models and operated on stand alone system. Failure rate models-based simulator introduced according to analyzing reliability prediction documents. Also, unified database including failure data models is built from existing MIL-HDBK-217F N2, PRISM, and Bellcore, and web-based simulator is developed. The developed reliability simulator will service of the PoF model, properties, failure rate model accumulated and its data by web and internet.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.1-9
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• 2011

Rare metals, called as vitamins of industry, are defined as the elements which are very few in the earth and are difficult to extract from ores. The requirements for total amounts of rare metals have increased as the global economics grows and the function of electronic components varies considerably. The rare metals have been maldistributed to America, CIS(Commonwealth of Independent States), China, Australia, Canada as about 80% of total natural resources, which also lead to unequal materials flow or distribution. Therefore, it was needed to investigate the feature of rare metals in terms of industry as well as technology. We could identify the industrial issues associated with the supply of critical rare elements in electronic components.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.157-161
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• 2007

There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

• Transactions on Electrical and Electronic Materials
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• 제8권5호
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• pp.211-214
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• 2007

Chemical and morphological changes of phenol formaldehyde-based photoresist after $O_2$ radiofrequency(RF) plasma treatment depending on exposure time and source power were investigated. It was found that etch rate of photoresist sharply increased after discharge turn on and reached a limit with increase in plasma exposure time. Contact angle measurements and X-ray photoelectron spectroscopy(XPS) analysis showed that the surface chemical structure become nearly constant after 15 sec of the treatment. Atomic force microprobe(AFM) measurements were shown that surface roughness was increased with plasma exposure time.

• 한국품질경영학회:학술대회논문집
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• 한국품질경영학회 2009년도 추계학술대회
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• pp.241-244
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• 2009

In this paper, it was performed to grasp the latest tendency of remanufacturing industry of domestic electronic components for development of remanufacturing technology and economical support of government. The merits of remanufacturing are to reuse old products to perform like a new product and to save energy, natural resources, landfill space and to reduce air pollution by less re-smelting. This paper proposes a systemic approach for activating the domestic remanufacturing industry. The approach is based on inside and outside regulations to apply remanufacturing companies. And, we analyzed the state and problems of remanufacturing industry for electronic components.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1724-1729
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature/humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the Electrochemical migration