• Title/Summary/Keyword: Electronic components

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Analysis of a Process Sequence in Precision Press Forming of Electronic Components (정밀전자부품 성형을 위한 소성가공 공정해석)

  • 변상규;허병우;강범수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1995.10a
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    • pp.119-127
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    • 1995
  • A process sequence in precison press forming of electronic components is investigated by the finite element method. Aperture, a key component of electronic gun, is formed through a wequence of about 15 operations, among which the beading & bending, the first coining, and the second coining operations are expected to be most critical in view of industrial experts' opinions. Thus, the analysis performed by a commercial code MARC focuses on the three operations, and comparisons are made between the results of the analysis and the measurement of experimental forming of the component, and it appears a sound agreement.

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Accessibility Automatic Inspector Library for EPUB and its Components (전자책 장애인 접근성 자동 검증도구용 라이브러리 연구)

  • Kim, Hyun-Young;Lim, Soon-Bum
    • Journal of Korea Multimedia Society
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    • v.20 no.2
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    • pp.330-335
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    • 2017
  • We have heard about several keywords of the fourth industrial revolution such as automation, artificial intelligence and connectivity. And electronic publishing systems and ebooks will enable us to experience a new industrial revolution without discrimination. On that level, it is necessary to study a method of automatic accessibility tool for electronic publishing. There are some studies on accessibility standard specifications, accessibility guidelines, and accessibility certificate criteria. but there is little research about automatic inspection tools in electronic publishing area. This paper proposed a library for accessibility inspector of EPUB and its components based on IDPF EPUB accessiblity guidelines and TTA accessibility certificate criteria for reading disabled people. After implementing the library that can be connected to SIGIL, which is the most widely used in Korea, we verified its functionality and its coverage with Korean commercial EPUB files.

Development of a Flat-Plate Cooling Device for Electronic Packaging

  • Moon, Seok-Hwan;Hwang, Gunn;Lim, Hyun-Taeck
    • ETRI Journal
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    • v.33 no.4
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    • pp.645-647
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    • 2011
  • In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.

A STUDY ON HEAT TRANSFER THROUGH THE FIN-WICK STRUCTURE MOUNTED IN THE EVAPORATOR FOR A PLATE LOOP HEAT PIPE SYSTEM

  • Nguyen, Xuan Hung;Sung, Byung-Ho;Choi, Jee-Hoon;Yoo, Jung-Hyung;Seo, Min-Whan;Kim, Chul-Ju
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2137-2143
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    • 2008
  • This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

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Effect of pH on electroless nickel plating (무전해 니켈 도금에서 pH에 따른 영향)

  • 정승준;김병춘;박종은;이흥기;박수길
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.625-628
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    • 1999
  • Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

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Hierarchical Colored Petri Nets Based Components for Workflow Systems

  • Zhou Feng;Bo Rui-Feng;Huang Hong-Zhong;Ling Dan;Miao Qiang
    • Journal of Mechanical Science and Technology
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    • v.20 no.10
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    • pp.1527-1533
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    • 2006
  • Workflow systems have benefited the enterprise and customer in many aspects. But with the increasing complexity of the system, workflow design becomes a complicated and time-consuming process. In this paper, we model the system based on the Hierarchical Colored Petri Nets (HCPN) to avoid the complexity of the system, and the super nets of the model are abstracted as independent components to increase the flexibility, acceptability and maintainability of the system. Another important characteristic of this model is its convenience for reuse and workflow mining. The development process of the overhead traveling crane was given to demonstrate the proposed method.

Life Assessment of Automotive Electronic Part using Virtual Qualification (Virtual Qualification을 통한 자동차용 전장부품의 수명 평가)

  • Lee, Hae-Jin;Lee, Jung-Youn;Oh, Jae-Eung
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.11a
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    • pp.143-146
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    • 2005
  • In modern automotive control modules, mechanical failures of surface mounted electronic components such as microprocessors, crystals, capacitors, transformers, inductors, and ball grid array packages, etc., are mai or roadblocks to design cycle time and product reliability. This paper presents a general methodology of failure analysis and fatigue prediction of these electronic components under automotive vibration environments. Mechanical performance of these packages is studied through finite element modeling approach fur given vibration environments in automotive application. Using the results of vibration simulation, fatigue lift is predicted based on cumulative damage analysis and material durability information. Detailed model of solder/lead joints is built to correlate the system level model and obtain solder strains/stresses. The primary focus in this paper is on surface-mount interconnect fatigue failures and the critical component selected for this analysis is 80 pin plastic leaded microprocessor.

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Saudi Universities Electronic Portals: A Case Study of Northern Border University

  • Al Sawy, Yaser Mohammad Mohammad
    • International Journal of Computer Science & Network Security
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    • v.21 no.2
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    • pp.103-109
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    • 2021
  • The study aimed to analyze the current situation of the electronic portal of the Northern Border University, in terms of content and components, the extent of quality of use, service assurance and integrity, linguistic coverage of objective content, in addition to assessing the efficiency of the Blackboard e-learning platform and measuring the degree of safety of the portal, in addition to measuring the extent of satisfaction, through a sample that included 135 faculty members, as the researcher was keen to apply the case study methodology with the use of the questionnaire as the main tool for measurement, and the study found that there is an average trend among faculty members in the degree of content for the components of the portal and electronic security While it rose to good use, and very good at using the Blackboard platform.

Evaluation of Cooling System Suitability for Large Scale Antenna (대형 안테나 냉각시스템의 적합성 평가)

  • Shin, Geon-Ho;Hur, Jang-Wook
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.11
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    • pp.60-66
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    • 2021
  • The antenna transmits and receives signals has a number of electronics that generate heat. For cooling, four fans and airways circulate air inside the antenna-equipped housing to exchange heat from the cooling plate assembly. In this study, fluid analysis was conducted to assess the suitability of the cooling system. The electronic components of the antenna exhibited temperature values lower than the maximum operating temperature of the components, which showed that the cooling system for the antenna had sufficient performance.

Simulation and Design of Optimized Three-Layer Radiation Shielding to Protect Electronic Boards of Satellite Revolving in Geostationary Earth Orbit (GEO) Orbit against Proton Beams

  • Ali Alizadeh;Gohar Rastegarzadeh
    • Journal of Astronomy and Space Sciences
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    • v.41 no.1
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    • pp.17-23
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    • 2024
  • The safety of electronic components used in aerospace systems against cosmic rays is one of the most important requirements in their design and construction (especially satellites). In this work, by calculating the dose caused by proton beams in geostationary Earth orbit (GEO) orbit using the MCNPX Monte Carlo code and the MULLASSIS code, the effect of different structures in the protection of cosmic rays has been evaluated. A multi-layer radiation shield composed of aluminum, water and polyethylene was designed and its performance was compared with shielding made of aluminum alone. The results show that the absorbed dose by the simulated protective layers has increased by 35.3% and 44.1% for two-layer (aluminum, polyethylene) and three-layer (aluminum, water, polyethylene) protection respectively, and it is effective in the protection of electronic components. In addition to that, by replacing the multi-layer shield instead of the conventional aluminum shield, the mass reduction percentage will be 38.88 and 39.69, respectively, for the two-layer and three-layer shield compared to the aluminum shield.