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http://dx.doi.org/10.4218/etrij.11.0210.0322

Development of a Flat-Plate Cooling Device for Electronic Packaging  

Moon, Seok-Hwan (Convergence Components & Materials Research Laboratory, ETRI)
Hwang, Gunn (Convergence Components & Materials Research Laboratory, ETRI)
Lim, Hyun-Taeck (Department of Mechatronics, Gwangju Institute of Science and Technology)
Publication Information
ETRI Journal / v.33, no.4, 2011 , pp. 645-647 More about this Journal
Abstract
In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.
Keywords
Electronic cooling; thermal packaging; thermal resistance; phase change; condensed droplet;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By Web Of Science : 0
Times Cited By SCOPUS : 0
연도 인용수 순위
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