ETRI Journal

Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Development of a Flat-Plate Cooling Device for Electronic Packaging

  • Moon, Seok-Hwan (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Hwang, Gunn (Convergence Components & Materials Research Laboratory, ETRI) ;
  • Lim, Hyun-Taeck (Department of Mechatronics, Gwangju Institute of Science and Technology)
  • Received : 2010.08.25
  • Accepted : 2011.01.27
  • Published : 2011.08.30
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Abstract

In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.

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References

  1. S.H. Moon and G. Hwang, "Development of the Micro Capillary Pumped Loop for Electronic Cooling," THERMINIC, 2007, pp. 72-76.
  2. J. Kirshberg et al., "Cooling Effect of a MEMS Based Micro Capillary Pumped Loop for Chip-Level Temperature Control," ASME, MEMS, vol. 2, 2000, pp. 143-150.
  3. C. Ding et al., "A Titanium-Based Flat Heat Pipe," IMECE, IMECE2008-68967, 2008.
  4. H.S. Hong, M.S. Kong, and H.K. Kang, "Development of Heat Treatment Furnace with Maximum Uniform Zone using Gas- Phase Condensing Heat Exchange," J. Korean Soc. Heat Treatment, vol. 22, no. 3, 2009, pp. 162-168.

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