• 제목/요약/키워드: Electronic assembly

검색결과 310건 처리시간 0.029초

국회 기록관리 체제정비에 관한 연구 (A Study on the System Improvement of the National Assembly Record Management)

  • 서연주;양승민
    • 정보관리학회지
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    • 제22권3호
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    • pp.201-211
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    • 2005
  • 국회 기록관리는 입법정보화담당관실의 기록업무 이용제공과 국회기록보존소의 기록보존업무가 분산 추진되어 기록관리의 조직과 업무에 대한 명확한 분석이 필요하다. 또 올 하반기에 입법조사처의 신설이 예정되고 장기적으로 국회통합전산센터의 운영방안이 도출되어 국회 정보화의 정책이 크게 수정되고 있다. 국회는 국회 정보화와 관련하여 국회 전산센터 운영 및 향후 발전방향을 한국전자정부연구원에 연구용역을 의뢰하였고 연구결과 네 가지 전산센터 운영방안을 제시받았다. 한국전자정부연구원이 제시한 네가지 전산센터 운영방안을 토대로 국회 기록관리 체제방안에 대해 바람직한 방향을 모색하였다. 국회기록 관리체제정비 방안은 국회기록보존소 위상과 관련하여 고려하였다.

로봇 손을 이용한 조립 작업의 컴플라이언스 특성 설정에 관한 연구:2차원 모델 (A Study on Specifying Compliance Characteristics for Assembly Tasks Using Robot Hands: Two Dimensional Model)

  • 김병호;오상록;이병주;서일홍
    • 제어로봇시스템학회논문지
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    • 제7권1호
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    • pp.1171-1177
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    • 2001
  • This paper provides a guideline for specifying the operational compliance characteristics considering the location of compliance center and the grasp points in assembly tasks using robot hands. Through various assembly tasks, we analyze the conditions of the achievable operational stiffness matrix with respect to the location of compliance center and the grasp points. Also, we show that some of coupling stiffness elements in the operational space cannot be planned arbitrarily. As a result it is concluded that the location of compliance center on the grasped object and the grasp points play important roles for successful assembly tasks and also the operational stiffness matrix should be carefully specified by considering those conditions.

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확률 페트리 네트를 이용한 객체기향 기반의 칩마운터 시뮬레이터 구현 (Object-Oriented Programming Based Chip-Mounter Simulator Using Stochastic Petri Nets)

  • 박기범;박태형
    • 제어로봇시스템학회논문지
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    • 제7권6호
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    • pp.540-549
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    • 2001
  • An implementation method for chip-mounter simulator is proposed to improve the productivity and utility of electronic assembly lines. The simulator emulates the assembly sequence graphically to verify the chip mounter program in offline. It also presents functions of time estimation and productivity analysis considering the error probability. To increase the flexibility of simulator, stochastic petri nets are applied to modeling of the assembly sequence. The sequence model is then implemented as extendable classes by an object oriented language. The simulator is applied to a commercial chip mounter to verify the usefulness of the method proposed.

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자기력과 Random Fluidic Self-assembly에 의한 신규 바이오칩의 개발 (Development of New Biochip using Magnetic Interaction and Random Fluidic Self-assembly)

  • 최용성;권영수;박대희
    • 한국전기전자재료학회논문지
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    • 제17권6호
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    • pp.615-621
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    • 2004
  • This paper describes a new constructing method of multifunctional biosensor using many kinds of biomaterials. A metal particle and an array was fabricated by photolithographic. Biomaterials were immobilized on the metal particle. The array and the particles were mixed in a buffer solution, and were arranged by magnetic force interaction and random fluidic self-assembly. A quarter of total Ni dots were covered by the particles. The binding direction of the particles was controllable, and condition of particles was almost with Au surface on top. The particles were successfully arranged on the array. The biomaterial activities were detected by chemiluminescence and electrochemical methods.

Jisso Technology Roadmap 2001 in Japan

  • Haruta, Ryo
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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    • pp.51-69
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    • 2001
  • Japan Jisso Technology Roadmap 2001 (JJTR2001) was published by JEITA in April 2001. Future electronic products request further higher assembly technology (ex. Finer pitch packages & components, 3D assembly, etc.) to reduce size and improve performance of the electric products. For LSI Packages, finer ball pitch technology and finer chip connection technology will be developed. For electric components, further size reduction will be developed. For Jisso (assembly) machine, finer pitch assembly and short tact time technology will be developed. Mr. Utsunomiya will present PCB roadmap next.

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수정진동자를 이용한 Viologen Self-Assembly 단분자막의 전기화학적 특성 (Electrochemical Properties of Viologen Self-Assembly Monolayer Using QCM)

  • 옥진영;송성훈;신훈규;박재철;장정수;장상목;권영수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.403-406
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    • 2002
  • Molecular self-assembled of surfactant viologen are of recent interest because they can from functional electroeds as well as micellar assemblies. which can be profitably utilized for display devices. photoelectrochemical studies and electrocatalysis as electron acceptor or electron mediator[1-3]. Fromherz et al studied the se1f-assembly of thiol and disulfide derivatives of viologens bearing long n-alkyl chains on Au electrode surface[4]. In this study, the electrochemical behavior of self-assembled viologen monolayer has been investigated with QCM, which has been known as nano-gram order mass detector. The self-assembly process of viologen was monitored using resonant frequency$({\Delta}F)$ and resonant resistance(R). The redox process of viologen was observed with resonant frequency$({\Delta}F)$.

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전자부품의 인쇄회로기판 부착시 적외선 Reflow Soldering과정 열전달 해석 (Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards)

  • 손영석
    • Journal of Welding and Joining
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    • 제15권6호
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    • pp.105-115
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    • 1997
  • A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

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단일 글로벌 전자상거래 시장을 만들기 위한 컴포넌트와 컨텍스트 기탄의 전자문서 설계 및 구현 (Design and Implementation of a Component and Context based Business Message for Creating a Single Global Electronic Market)

  • 김완평
    • Journal of Information Technology Applications and Management
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    • 제9권3호
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    • pp.13-30
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    • 2002
  • ebXML (Electronic Business using extensible Markup language), sponsored by UN/CEFACT and OASIS, is a modular suite of specifications that enables enterprises of any size and in any geographical location to conduct business over the Internet. Using ebXML, companies now have a standard method to exchange business messages, conduct trading relationships, communicate data In common terms and define and resistor business processes. It is the mission of ebXML that provides an open XML-based infrastructure enabling the global use of electronic business information in an interoperable, secure and consistent manner by all parties for creating a single e1ectronic electronic market. This paper briefly overviews the concept of core component, context, assembly rule and context rule. Then, It designs by standard specifications of ebXML core component commonly used in an industry and among industries, and assembles business messages by using XML schema. Therefore, it suggests the mechanism which effectively exchanges business messages among the trading partners. This paper designs core component by using only three business messages of retail industry : orders, dispatch report, sales report.

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적외선 리플로 솔더링시 전자부품의 열적반응 민감도 분석 (Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering)

  • 손영석;신지영
    • 설비공학논문집
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    • 제14권1호
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    • pp.1-9
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    • 2002
  • The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

수정진동자를 이용한 Viologen Self-Assembly 단분자막의 전기화학적 특성 (The electrochemical study on Viologen SA monolayer using QCM)

  • 김정명;윤희찬;송성훈;권영수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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    • pp.21-23
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    • 2002
  • In this paper, the electrochemical behavior of Viologen self assembly monolayer has been investigated with QCM, which has been known as nano-gram order mass detector. The self assemvly process of Viologen was monitored using resonant frequency $({\Delta}F)$ and resonant resistance(R). QCM measurements indicated a mass adsorption for Viologen assembling on the gold sufrace with a frequency change about 135[Hz] and calculated its surface coverage($\Gamma$) to be $3.5273{\times}10^{-9}[mol/cm^{2}]$. Also reversible redox process was observed and analyzed with ionic interaction at the Viologen/solution interface using ${\Delta}F$.

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