• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.69-74
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,00$0^{\circ}C$ . Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 80$0^{\circ}C$ . There needs to measure the data up to 80$0^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000'E In previous studies related to thermal strain analysis, the quantitative results have not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,00$0^{\circ}C$ and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1% blow $600^{\circ}C$ however, there is some difference up to $600^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 80$0^{\circ}C$ . The reason is the phase transformation of STS430 probably begins at 80$0^{\circ}C$

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.303-305
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• 2005

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.25-30
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• 2003

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.1
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• pp.18-22
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• 2014

Residual stresses that occur during the welding process, are the main cause of failure and defects in welded structures. This paper, presents the use of an electronic processing laser speckle interferometer to measure the residual stress of a welded pipe for a nuclear power plant. A tensile testing machine was used to evaluate a welded pipe that failed in compression. The inform plane deformation and modulus of elasticity of the base metal and welds were measured using an interferometer. Varying the load on the welded pipe had a larger effect on the deformation of the base metal the other properties of the base metal and welds. The elastic moduli of the base metal and weld of the welded pipe were 202.46 and 212.14 GPa, respectively, the residual stress was measured to be 6.29 MPa.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.330-333
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• 2002

This study Presents improvement of Precision in the non-contacted laser application measuring techniques. The phase map of deformation obtained by phase shifting method in Electronic Speckle Pattern Interferometry displays the wrapped image by the arctangent function, which is a characteristic of 4-step phase shifting method. To obtain deformation distribution from the results, the wrapped phase map is processed by an unwrapping method. But a previous method cannot apply discontinuous object as like plate with a circular hole to obtain precious deformation distribution To solve this problem, new algorithm is developed and the result is compared with previous method.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.4
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• pp.106-111
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• 1999

This study discusses a non-contact optical technique electronic, electronic speckle pattern interferometry(ESPI) that is well suited for in-plane and out-of-plane deformation measurement Used as specimen which has the boundary condition of two clamped parallel edges composite material AS4/PEEK[30/-30/90]s was analyzed by ESPI to determined the characteristics of tensile and vibration. These are quantitativly compared with the result of FEM analysis. Finally the results of this study are briefly summarized as follows : (1) In the in-plane strain analysis by comparison of theoretical results with experimental results qualitatively we confirmed that measurement errors are within 3 % in case of accuracy (2) From comparison of experimental vibration modes with numerical vibration mode shapes by the FEM analysis quantitatively we confirmed that vibration mode measurement by the ESPI has high accuacy.

• Journal of Applied Reliability
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• v.5 no.4
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• pp.439-450
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• 2005

Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Journal of the Korean Society for Precision Engineering
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• v.13 no.2
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• pp.84-93
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• 1996

Non-destructive inspection techniques using laser have been broading their application areas as well as growing their measurement skills together with the rapid development of circumferential technology like fiber optics, computer and image processing. The ESPI technique is already on the stage of on-line testing with commercial products in developed country nations. Especially, this technique is expected to be applied to the nuclear industry, automobile and aerospace because it is proper for the vibration measurement and it can be applied to objects of a high temperature. This paper describes the use of the ESPI system for measuring vibration patterns on the reflecting objects. Using this system, high-quality Jo fringes for identifying mode shapes are displayed. A bias vibration is introduced into the reference beam to shift the Jo fringes so that fringe shift algorithms can be used to determine vibration amplitude. Using this method, amplitude fields for vibrating objects were obtained directly from the time-average interferograms recorded by the ESPI system.