• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1997년도 춘계학술대회 논문집
• /
• pp.48-53
• /
• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar laserm, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment wpecimen was loaded in parallel with a loadcell. The specimen was the cold rolled sdteel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• 한국정밀공학회지
• /
• 제18권7호
• /
• pp.149-154
• /
• 2001

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for a deformation measurement of structure. Phase shifting method and unwrapping method have used to make deformation quantitative widely. In this paper, a previous numerical formula for phase shifting method is reconstructed in addition to least square fitting method to improve sensitivity and phase unwrapping based on vertical-horizontal scanning method is applied to analyze in-plane and out-of-plane deformation quantitatively.

• Journal of Mechanical Science and Technology
• /
• 제19권3호
• /
• pp.820-825
• /
• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Structural Engineering and Mechanics
• /
• 제15권3호
• /
• pp.367-378
• /
• 2003

The magnitude of the plastic zone around the crack tip of DENT (Double Edge Notched Tension) specimen and the crack growth length under cyclic loading were measured by ESPI (Electronic Speckle Pattern Interferometry) system. The measured magnitude of plastic zone was compared with the proposed by Irwin and calculated by a nonlinear static method of MSC/NASTRAN. The measured crack growth length by ESPI system was also compared with the obtained data by the image analysis system. From the study, it is confirmed that the plastic zone and crack growth length can be measured accurately with the high-tech equipment (ESPI System).

• 한국정밀공학회지
• /
• 제24권7호
• /
• pp.69-74
• /
• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• 한국생산제조학회지
• /
• 제8권6호
• /
• pp.78-83
• /
• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• 한국정밀공학회지
• /
• 제12권10호
• /
• pp.40-49
• /
• 1995

This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interferometry (ESPI) method, in measuring two - dimensional in-plane displacement. The anyalysis result of measurement by ESPE is quite comparable to that tof measurement by strain gauge method. This implies that the method of ESPE is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversal point, measurment error. This error is discussed to be affected not by ESPE method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. In this case, it is turned out that the more errors would be occurred in the large interval of fringe. And so this paper describes a computer method for drawing when the height is available only for some arbitrary collection of points. The method is based on a distance-weighted, last- squares approximation technique with the weight varying with the distance of the data points.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2001년도 추계학술발표대회 개요집
• /
• pp.162-164
• /
• 2001

• 비파괴검사학회지
• /
• 제21권2호
• /
• pp.182-188
• /
• 2001

대부분의 실제구조물은 인장과 진동 등이 동시에 작용하는 복합하중 상태가 되며 이러한 환경에서 물체의 거동을 해석하는 것이 중요하다. 이 논문에서는 x축에 대해 $45^{\circ}$ 결함이 있는 평판이 하중을 받고 있을 때, 진동 특성을 시간평균 electro speckle pattern interferometry(ESPI)를 이용하여 해석하였다. 결함이 있는 박판 시험편에 인장력을 증가하면서 물체의 고유진동수 변화와 모드의 형태 변화를 동시에 관찰하였다. 실험결과에서 결함은 저차모드에서는 진동모드에 영향을 주지 않았으나, 고차모드에서는 진동모드에 변화를 주었으며, 특정 진동모드에서 결함의 영향으로 현저하게 고유주파수가 낮아지는 경향을 보였다. 또한 실험결과는 유한요소해석과 비교하여 주파수 비교에서는 5% 이내의 오차율을 보였으며, 진동모드 비교에서는 완전히 일치하였다.

• 비파괴검사학회지
• /
• 제21권6호
• /
• pp.630-633
• /
• 2001

본 연구에서는 국내에서 생산되는 에어콘용 팬의 진동해석을 위해 ESPI를 이용하였다. 기존의 진동해석 실험으로 많이 사용되는 가속도계를 에어콘용 팬에 직접 적용하는 데에는 형상의 제약 등으로 적용이 어려워 비접촉 진동해석기술을 요구하였다. 실험은 가진 장치를 이용하여 팬에 가진을 하고 ESPI를 이용하여 진동모드 및 고유주파수, 고유주파수의 범위를 검사하였다. 또한, 실험결과는 유한요소 해석과 비교되었으며, 실험결과로부터 실제 팬의 사용 회전수에서 제품의 신뢰성을 평가하였다 본 연구에서 사용된 ESPI는 품질개선을 위한 재질변화 또는 형상변화 시 설계측면에서 효과적인 설계정보를 제공할 수 있으며, 기존의 진동해석 기술의 단점을 보완할 수 있으리라 사료된다.