• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.46-55
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• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.2
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• pp.147-154
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• 2021

In this paper, the configuration and design of the test equipment are presented to examine the impact of rapid temperature change in cooling-air that may occur during the operation of the fixed wing aircraft Environmental Control System (ECS) on avionic electronic equipment. At the start of the ECS, the temperature of the air supplied by the aircraft ECS may be increased to 5.0℃ per second. In order to ensure operating of the avionic electronic equipment that is mounted on the aircraft and receives cooling-air from the ECS, testing equipment that can implement the cooling-air characteristic test environment is required. During design of test equipment was verified cooling-air rapid rate of temperature change by performing a thermal/flow analysis, performance of the test equipment implemented was verified by applying an avionic electronic equipment.

• International Journal of Air-Conditioning and Refrigeration
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• v.16 no.2
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• pp.64-69
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• 2008

Electronic and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers. The liquid-cooling heat exchangers had twelve rectangular channels with different flow paths of 1, 2, and 12. Silicon rubber heaters were used to control the heat load to the heat exchangers. Heat input ranged from 293 to 800W, and inlet temperatures of working fluid varied from 15 to $27^{\circ}C$. The heat transfer coefficients were strongly affected by flow conditions. All liquid-cooling heat exchangers showed higher cooling performance than the air-cooling heat exchanger. The heat exchanger with 2-paths could provide more controllability on the maximum temperature than the others.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.4
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• pp.415-424
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• 2004

Cooling the electronic equipment is one of the major focal points of the design process and the key to successful product launch. The two-phase loop thermosyphone which is a good candidate among many available options was investigated fur cooling of the high power amplifiers. The system is composed of evaporator which contains 6 parallel cold plates, fan cooled condenser, gas-liquid separator, and interconnecting tubes. Experiments were performed for several refrigerant charging values, hs and as a experiment result, the optimum charging value fur this system was proposed. In order to optimize the system design, the operating cycle pressure and inlet/outlet temperatures of evaporator and condenser are measured and analyzed. The effect of the three parameters such as flow rate and temperature of condenser cooling air, and thermal load on the evaporator are investigated. The lower the operating pressure and the cycle temperatures are also better to prevent the leakage of the system. The system invesigated in this paper can be directly used for cooling of a real unmanned wireless communication station.

• Journal of Biomedical Engineering Research
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• v.29 no.1
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• pp.82-87
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• 2008

In this paper, the study was carried out to design and implement the medical compound stimulator based on the preexisting individual medical stimulators with Low frequency, High frequency and cooling stimulation. The proposed equipment is designed to compound all the functions including a cooling stimulation with a range of $0{\sim}20^{\circ}C$ and the verified low and high frequencies of 250Hz, 500Hz, 1KHz and 1MHz respectively from the previous clinical experiment with a consideration of its credibility and efficiency. Also, it was constructed by using a new technique, thermoelectricity semiconductor with a consideration of miniaturization and stability. In accordance with patients' treatment purpose, the hand piece of low frequency/cooling stimulation and High frequency/cooling stimulation were separately designed for convenience. The frequency, accuracy and other factors of implemented medical compound stimulator was satisfied according to its measurement. It was also tested by Korean Testing Laboratory (KTL) for its stability and efficacy and it confirmed that the medical compound stimulator is suitable for use as it fits in with the medical equipment standards.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.12
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• pp.1774-1781
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• 2012

There are some efforts to improve the performance of electrical heat pump(EHP) and replace it with an alternative cooling equipment such as gas engine-driven heat pump(GHP), a gas cooling equipment, in order to solve the problem of summer electricity supply through reducing the summer electricity peak. This paper analyzes cost-benefit in accordance with replacement of electrical cooling system by gas cooling system using california standard test and sensitivity analysis of some scenarios.

• Journal of the Korea Institute of Military Science and Technology
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• v.16 no.1
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• pp.74-80
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• 2013

In this paper, we have proposed a vapor cycle refrigeration system as a cooling system to provide cooling air to the aircraft external reconnaissance stores. In the proposed vapor cycle system, receiver which prevents refrigerant from subcooling was eliminated and thermal expansion valve was replaced with electronic expansion valve. The vapor cycle refrigeration system is aimed to provide cooling air to the reconnaissance stores which is added to the aircraft in the form of external store. The wide temperature range of ambient air from the flight conditions can decrease the cooling performance and can make the refrigeration system unstable in low ambient temperature. Performance characteristics of the vapor cycle refrigeration system has been experimented under air conditions which is derived from the flight envelope. From the experiments, the vapor cycle refrigeration system has been proved to provide enough cooling air to the reconnaissance equipment and to be stable under all the flight conditions.