• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.10
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• pp.1421-1424
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• 2013

The electronic equipment which is exposed to high level pulsed radiation is damaged by Upset, Latchup, and Burnout. Those damages come from the instantaneous photocurrent from electron-hole pairs generated in itself. Such damages appear as losses of a power in military weapon system or as a blackout in aerospace equipment and eventually caused in gross loss of national power. In this paper, we have implemented a RDC(Radiation detection and control module) as a part of the radiation protection technology of the electronic equipment or devices from the pulsed gamma radiation. The RDC, which is composed of pulsed gamma-ray detection sensor, signal processors, and pulse generator, is designed to protect the an important electronic circuits from the a pulse radiation. To verify the functionality of the RDC, LM118s, which had damaged by the pulse radiation, were tested. The test results showed that the test sample applied with the RDC was worked well in spite of the irradiation of a pulse radiation. Through the experiments we could confirm that the radiation protection technology implemented with the RDC had the functionality of radiation protection for the electronic devices.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.252-261
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• 2014

A Bayesian network (BN) based fault diagnosis framework for semiconductor etching equipment is presented. Suggested framework contains data preprocessing, data synchronization, time series modeling, and BN inference, and the established BNs show the cause and effect relationship in the equipment module level. Statistically significant state variable identification (SVID) data of etch equipment are preselected using principal component analysis (PCA) and derivative dynamic time warping (DDTW) is employed for data synchronization. Elman's recurrent neural networks (ERNNs) for individual SVID parameters are constructed, and the predicted errors of ERNNs are then used for assigning prior conditional probability in BN inference of the fault diagnosis. For the demonstration of the proposed methodology, 300 mm etch equipment model is reconstructed in subsystem levels, and several fault diagnosis scenarios are considered. BNs for the equipment fault diagnosis consists of three layers of nodes, such as root cause (RC), module (M), and data parameter (DP), and the constructed BN illustrates how the observed fault is related with possible root causes. Four out of five different types of fault scenarios are successfully diagnosed with the proposed inference methodology.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.06a
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• pp.1246-1251
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• 2000

High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment very rapidly, unless the equipment is properly packaged. Thus very careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.1
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• pp.131-138
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• 2001

The performance analysis of an electronic equipment test is very complicate due to the variety o vehicles. In this study, automatic design system for the electronic equipment test has been carried out using the standard load patterns. For the test, standard signal patterns for each item are modeled. The test items can be decided by the user by means of these patterns. Also, engineering software modules are developed and proved to be very efficient for analyzing the test results statistically. Experiments are performed for the test system in the vehicle assembly line. By analyzing the test results, it is found that bad samples can be detected without failure. Also, the engineering software modules provide an analytical tool for the automation of the test process.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1959-1961
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• 2002

Requirements for high-efficiency equipment for energy saving are rapidly increasing recently keeping pace with development of digital and semiconductor technology. Accordingly, there are many changes and development in ballast. Ballast currently in use are Magnetic ballast (Coiled Type) and Electronic ballast. Electronic ballast produces incredible energy saving effect, but falls short of confidence instead. In addition, use at higher frequency through switching device creates Electromagnetic Interference (EMI) and high frequency. EMI creates low quality of equipment, damage in facilities and low productivity by leading miss operation of equipment, and interferes with surrounding machines. In this analysis I am going to examine characteristics of EMI on the Electronic ballast of FLR32SS one type pursuant to annex 3 of Electric Goods Technology Standard, and counter technology.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.3
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• pp.333-340
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• 2022

Recently, the use of large-capacity secondary batteries for electric vehicles is rapidly increasing, and accordingly, the demand for technologies and equipment for battery reliability evaluation is increasing significantly. The existing short circuit test equipment for evaluating the stability of the existing secondary battery consists of relays, MCs, and switches, so when a large current is energized during a short circuit, contact fusion failures occur frequently, resulting in high equipment maintenance and repair costs. There was a disadvantage that repeated testing was impossible. In this paper, we developed an electronic short circuit test device that realizes stable switching operation when a large-capacity power semiconductor switch is energized with a large current, and applied smart ICT technology to this electronic short circuit stability test system to achieve high speed and high precision through communication with the master. It is expected that the inspection history management system based on data measurement, database format and user interface will be utilized as essential inspection process equipment.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.15-19
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• 2001

Electronic navigation system onboard have have been developed with recent technology based on new concept such as electronic chart date. The most valuable system of revolution in electronic navigation equipment is ECDIS, which have been developed in order to reduce work load of mariner and give an integrated information by simple means, especially to improve the safety of ship's navigation. In order to be sure the function of ECDIS is satisfied, The international standard have regulated the performance in the standard, so ECDIS should be type approved by the marine equipment authority of each government. There are three basic documents, IEC61174, IEC61162, IEC60945 issued by IMO(International Maritime Organization) which should be used for type approval system of each authority. IEC 61174 include the method of test and required results for operational and functional performance of test equipment. IEC61162 is for sensor interface and IEC60945 is related to the test of environmental condition for general marine radiocommunication equipment. In this paper, we investigate international standard in detail and current approval system of general marine equipment. After that, we present the possible structure of type approval of ECDIS and important considerations of approval system such that ECDIS should be tested as one system not be separated between S/W and H/W.

• Resources Recycling
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• v.17 no.6
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• pp.3-9
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• 2008

The Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment commonly referred to as the Restriction of Hazardous Substances Directive or RoHS was adopted in February 2003 by the European Union. The RoHS directive took effect on 1 July 2006, and is required to be enforced and become law in each member state. This directive restricts the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment. It is closely linked with the waste electrical and electronic equipment directive (WEEE) 2002/96/EC which sets collection, recycling and recovery targets for electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.