• Journal of the Mineralogical Society of Korea
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• v.24 no.4
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• pp.313-320
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• 2011

Mica-type phyllosilicate particles in the shales of the Manhang formation at the Taeback area in the Kangwon Province were studied using electron probe microanalysis (EPMA) and transmission electron microscopy (TEM). The average chemical formula of the mica-type phyllosilicate mineral analysed by EPMA is $K_{1.35}(Fe_{0.18}Mg_{0.03}Al_{3.86})(Si_{6.55}Al_{1.45})O_{20}(OH)_4$. Low K contents compared to the ideal chemistry of muscovite indicate the presence of illite in the mica-type phyllosilicate particle. X-ray diffraction study showed that pyrophyllite commonly coexists with muscovite in the shales from the Manhang Formation. TEM observations showed both the interlayer and intralayer mixing of $9.3-{\AA}$ pyrophyllite and $10-{\AA}$ muscovite layers. The low K content of the mica-type phyllosilicates apparently come from the close mixing of pyrophyllite and muscovite.

• Korean Journal of Materials Research
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• v.22 no.4
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• pp.169-173
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• 2012

Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$. Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$, $Al_3Fe$, and $Al_5Fe_2$ formed in the die soldering layers.

• Advances in aircraft and spacecraft science
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• v.4 no.6
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• Restorative Dentistry and Endodontics
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• v.9 no.1
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• pp.101-106
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• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.105-109
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• 2007

In this paper, we fabricated TCO (transparent conductive oxide) electrode on flexible substrate in order to study effects of electrical and optical properties according to Al-doped ZnO(AZO) film thickness. The thickness of film was from 100 nm to 500 nm and was controlled by changing deposition time. We used High Resolution X-ray Diffractometer (HR-XRD) to analyze crystal structure and UV-visible spectrophotometer to measure property of optical transmittance, respectively. The surface images are obtained by using ESEM (Environment Scanning Electron Microscopy). In this experiment, all the AZO films deposited on flexible substrate show high transmittance over 90% and especially in the films with 400 nm and 500 nm thickness, the resistivity ($4.5{\times}10^{-3}\;{\Omega}-cm$) and optical bandgap energy (3.61 eV) are superior to the other films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.9
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• pp.589-593
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• 2014

AlNO multi-layer thin films on aluminum substrates were prepared by DC reactive magnetron sputtering method. $Al_2O_3$/AlNO(LMVF)/AlNO(HMVF)/Al/substrate of 4 multi-layer has been prepared in an Ar and ($N_2+O_2$) gas mixture, and $Al_2O_3$ of top layer is anti-reflection layer on double AlNO(LMVF)/AlNO(HMVF) layers and Al metal of infrared reflection layer. In this study, the roughness and surface properties of AlNO thin films were estimated by field emission scanning electron microscopy(FE-SEM). The grain size of AlNO thin films increased with increasing sputtering power. The composition of thin films has been systematically investigated using electron probe microanalysis(EPMA). The optical properties with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 200~1,500 nm. The absorptance of AlNO films shows the increasing trend with swelling ($N_2+O_2$) gas mixture in HMVF and LMVF deposition. The excellent optical performance showed above 98% of absorptance in visible wavelength region.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.283-283
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• 2013

Because of beautiful glossy and color, the value of gold leverage is very high in Europe. To improve the quality of gold alloys, we performed heat treatment on 14 K white gold alloys by variously changing age-hardening conditions. Age-hardening behavior and the related phase transformation changes were studied to elucidate the hardening mechanism of 14 K white gold alloy. For solid solution treatment [ST], casted gold alloy specimens were treated at high temperature ($750^{\circ}C$) for 30 minutes, and the specimens dropped to water to quench them. For Age-hardening treatment [AT], the specimens were treated at various temperatures ($250{\sim}300^{\circ}C$). After the heat treatment, we observed the phenomenon to increase hardness from 126 Hv to 166 Hv by Vicker's hardness tester. Through electron probe micro-analysis (EPMA) mapping analysis, we investigated that irregular particles were changed uniformly. In the SEM and OM images, two phases of matrix and particle-likestructures were observed, and the precipitation of these elements from the matrix progressed during age-hardening. By transmission electron microscope and X-ray diffraction observation, it was revealed that the formation of the Au3Cu superstructure contributed to the age-hardening at $270^{\circ}C$ in the gold alloy. After the heat treatment, this analysis shows that casted gold alloys were to improve hardness and to moderate surface defects at specific temperatures and duration.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.743-747
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• 2003

The improvement of luminance and luminous efficiency is the one of the most important part in AC-PDPs. To achieve high luminance and luminous efficiency, high VUV emission efficiency is needed. We measured the emission spectra of vacuum ultraviolet(VUV) and infrared(IR) rays in surface discharge AC-PDP with Ne-Xe mixture gas. The influence of Ne-Xe gas-mixture ratio on resonance state $Xe^{\ast}(3P_{1})$ and exited state $Xe^{\ast}(3P_{2})$ has been investigated. It is found that the intensity of VUV 147nm emission is proportional to that of the IR 828 nm emission, and the VUV 173nm emission is roughly proportional to that of the IR 823nm emission. The electron temperature and plasma density have been experimentally measured from the center of sustaining electrode gap by a micro Langmuir probe in AC-PDPs. The plasma density from the center of sustaining electrode gap are shown to be maximum value of $9{\times}10^{11}cm^{-3}$, where the electron temperature is about 1.6 eV in this experiment

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.7
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• pp.731-736
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• 2012

A new method for producing boron-containing nanoparticles is described. Boron trichloride ($BCl_3$) and methane ($CH_4$) are dissociated through injection into a thermal plasma followed by a nucleation process producing boron or boron carbide nanoparticles. X-ray photoelectron spectroscopy was used to detect B-C bonds related to the carbide state and to probe the ratio of boron to carbon in the B-C bond structure. In addition, nanoparticles were characterized with scanning transmission electron microscopy and electron energy loss spectroscopy. It was found that nanoparticles were in the range 30-70 nm and a boron to carbon ratio in the B-C bond structure of up to 2 can be reached when $BCl_3$ of 20 sccm and $CH_4$ of 25 sccm were used.