• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.37-45
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• 2008

In this study, reliabilities of Cu (60 um)/SnAg (20 um) double-bump flip chip assemblies were investigated for the flip chip interconnections on organic substrates with 100 um pitch. After multiple reflows at $250^{\circ}C\;and\;280^{\circ}C$, bump contact resistances were almost same regardless of number of reflows and reflow temperature. In the high temperature storage test, there was no bump contact resistance change at $125^{\circ}C$ up to 2000 hours. However, bump contact resistances slightly increased at $150^{\circ}C$ due to Kirkendall voids formation. In the electromigration test, Cu/SnAg double-bump flip chip assemblies showed no electromigration until about 600 hours due to reduced local current density. Finally, in the thermal cycling test, thermal cycling failure mainly occurred at Si chip/Cu column interface which was found out the highest stress concentration site in the finite element analysis. As a result, Al pad was displaced out under thermal cycling. This failure mode was caused by normal compressive strain acting Cu column bumps along perpendicular direction of a Si chip.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.166-166
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• 1994

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.167-167
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• 1994

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.04a
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• pp.107-135
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• 2005

• Journal of the Korean Vacuum Society
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• v.1 no.2
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• pp.286-290
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• 1992

본 논문은 Al, Ag 박막에서 엘렉트로마이그레이션 현상에 의한 힐록, 기공형성과 접착력에 대하여 연구하였다. Mo 보트를 이용하여 1 $\times$ 10-7Torr의 진공도에서 전자빔 증착 기로 현미경용 유리기판에 약 1$000AA$의 두께로 Al, Ag 박막을 각각 증착하였다. Al, Ag 박 막에서 엘렉트로마이그레이션에 의한 결함을 연구하기 위하여 1 $\times$ 105(A/cm2)의 d.c. 전류 를 인가하였고 Scratch Method와 Tape Method로 Al과 Ag 박막의 접착력을 측정하였다. 가공과 힐록, 그리고 스크레치 채널은 SEM과 광학현미경 사진을 이용하여 분석하였다. Al 박막에서는 엘렉트로마이그레이션으로 힐록과 기공이 양극부분과 음극부분에서 각각 관찰되 었다. 반면에 Ag 박막에서는 Coulombic force에 의해 기공과 힐록이 양극부분과 음극부분 에서 각각 형성되어 역엘렉트로마이그레이션 현상을 보였다. 접착력은 산소 친화력이 강한 Al 박막에서 Ag 박막보다 크게 나타났다.

• Journal of the Korean Vacuum Society
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• v.1 no.2
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• pp.291-297
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• 1992

알루미늄 박막 stripe에 d.c. 전류를 인가하여 electromigration에 의한 결함을 분 석하였다. 6 $\times$ 10-8Torr의 진공동에서 전자빔 증착기를 사용하여 현미경을 유리기판에 $1000AA$의 두께로 알루미늄 박막을 증착하였다. Al/glass 박막의 초기 비저항은 2.7 $\pm$ 0.15($\mu$$\Omega$cm)이였다. 알루미늄 stripe에 electromigration에 의해 양극쪽에 물질 축적영역 (hillocks)과 음극쪽에는 물질 고갈영역(voids)이 형성되었다. SEM, EDAX와 Optical microscope로 hillocks과 voids를 분석하였다. 또한 결함에 대한 SiO2 보호막효과에 대하여 도 분석하였으며, SiO2 보호막에 의하여 Al 박막의 신뢰성은 향상되었다.

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.161-168
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• 1996

For the improvement of microelectronic thin film interconnection materials, dielectric passivation effects on the electromigration phenomena were studied. Using Al-1%Si, various shaped patterns were fabricated and dielectric passivation layers of several structures were deposited on the $SiO_2$ layer. Lifetime of straight pattern showed 2~5 times longer than the other patterns that had various line width and area. It is believed that the flux divergence due to the structural inhomogeneity and so the current crowding effects shorten the lifetime of thin film interconnections. The lifetime of thin film interconnections seems to depend on both the passivation materials and the passivation thickness. PSG/$SiO_2$ dielectric passivation layers showed longer lifetime than $Si_3N_4$ dielectric passivation layers. This results from the PSG on $SiO_2$ layer reduces stress and from the improvement of resistance to the moisture and to the mobile ion such as sodium. This is also believed that the lifetime of thin film interconnections seems to depend on the passivation thickness in case of the same deposition materials.

• Proceedings of the Korean Geotechical Society Conference
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• 2004.03b
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• pp.890-896
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• 2004

This study is intended as an investigation of the EK remediation characteristics of natural soil with treatment time under unsaturated conditions. EK tests are performed under the voltage gradient of 1V/cm, the degree of saturation of 82.8%, and the installing of cation exchange membrane. It was found from the results that the acid front is initially transported at 0.75cm/day and then continuously degreased until the transport velocity of the acid front is balanced to the velocity of the base front. The residual lead concentration indicated the maximum value at the treatment time of lOdays, then the increasing of treatment time largely decreases the concentration within the sample though electromigration than electroosmosis.