• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.264-268
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• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Journal of the Korean institute of surface engineering
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• v.52 no.3
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• pp.156-162
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• 2019

Electroless Ni-P coatings are widely used in the chemical, mechanical, and electronic industries because of their excellent wear and abrasion resistance. In this study, The influence of pH values on properties of Ni-P-PTFE composite coatings was investigated. To improve mold lubrication, Ni-P-PTFE composite coatings at different pH value were studied. The morphology and phase structure of Ni-P-PTFE composite coatings were analyzed by scanning electron microscopy(SEM) and X-ray diffractometry(XRD). The result showed that Ni-P-PTFE composite coating is composed of Ni, P and PTFE. It exhibits an amorphous structure and good Corrosion Resistance to the substrate. Ni-P-PTFE composite coatings have higher open circuit potential than that of the substrate, which obtained at pH value of 5.0 optimal integrated properties.

• Journal of the Korean institute of surface engineering
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• v.54 no.6
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• pp.315-323
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• 2021

In general, surface treatments of electroless Ni-P coating are extensively applied in the industry due to their excellent properties for considerable wear resistance, hardness, corrosion resistance. This study aims to determine the effect of ultrasonic conditions on the morphology, alumina content, roughness, hardness, and corrosion resistance of electroless Ni-P-Al₂O₃ composite coatings. The characteristics were analyzed by Energy-dispersive X-ray spectroscopy (EDX), x-ray diffractions (XRD), and atomic force microscopy (AFM), etc. In this study, the effect of ultrasonic condition uniformly distributed alumina within Ni-P solution resulting in a smoother surface, lower surface roughness. Furthermore, the corrosion resistance behavior of the coating was analyzed using tafel polarization curves in a 3.5 wt.% NaCl solution at 25 ℃. Under ultrasonic, Al₂O₃ content in Ni-P composite solution increased from 0.5 to 5.0 g/L, Al₂O₃ content at 3.0 g/L was showed a significantly enhanced corrosion resistance. These results suggested that ultrasonic condition was an effective method to improve the properties of the composite coating.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.725-729
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• 2008

Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

• Corrosion Science and Technology
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• v.6 no.5
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• pp.257-260
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• 2007

In order to further improve the corrosion resistance and wear resistance of the Ni-P coatings of electroless plating, electroless Ni-P/n-$Al_2O_3$ composite deposits were prepared by adding some nano $Al_2O_3$ Particles in Ni-P plating bath. The bath composition and proproties were studied in this paper. The orthogonal test was applied in order to get the new composite solution, taking the initial stable potential as evaluation standard and considering the elements correlation at the same time. The processing parameters have been optimized by single factor experiment in which the depositing speed was chosen as the evaluation standard. The results showed that the process is stable and the composite Ni-P/n-$Al_2O_3$ deposits werebright and smooth, whose hardness and corrosion resistance are much better than simple Ni-P coatings. Furthermore the surface appearance and structure of the composite Ni-P/n-$Al_2O_3$ coating were investigated by SEM and XRD method. It was proved that the coating surface is typical cystiform cells and its structure is amorphous. All test results ofcomposite coating showed that all various physical coating properties had been improved by adding nano-particles. The hardness of optimal coating is more than 600HV and increases to 1000HV after heat-treating, and its hardness is 20~50% higher than Ni-P coating. The rust points appeared in 200 hour by immersing the coating into the 10%HCl solution and the corrosive speed is $3{\times}10^{-3}mg/(cm^2{\cdot}h)$which was obtained after 300 hour. In the same condition Ni-P coating is $5.6{\times}10^{-3}mg/(cm^2{\cdot}h)$. The salt spray resistance of the layers can exceed 600h with the thickness $20{\mu}m$.