• Title/Summary/Keyword: Electrode pattern

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Comparison of Electrical Tree Initiation According to Flow Pattern in EHV Power Cable Insulation (초고압 전력 케이블 절연층의 Flow Pattern 방향각에 따른 전기 트리 개시 특성 비교)

  • Lee, Seung-Yoo;Kim, Young-Ho;Cho, Dae-Hee;Lee, In-Ho;Park, Wan-Ki
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1532-1534
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    • 1999
  • Electrical treeing phenomenon, regarded as pre-breakdown which accelerates aging process leading an insulation to the complete breakdown, is with no doubt extremely fatal to the performance of the insulation. Investigated in this paper is electrical treeing representing local dielectric failure according to flow pattern, the flow history of liquid polyethylene formed during the extrusion process. Experiments of electrical tree initiation by means of ramp tests were conducted using newly developed electrode system with point-to-point structure. Constant voltage tests were also carried out with the electrode system to estimate the life time of the insulation. Results were analyzed using statistical method such as Weibull distribution.

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The fabrication of electrodes with low resistance and fine pattern for PDP

  • Cho, Soo-Je;Ryu, Byung-Gil;Park, Myung-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.107-108
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    • 2000
  • We propose the method which is possible to fabricate the electrodes with the fine pattern and low resistance by photolithography and electroplating. The widths of pattern fabricated were 30, 50, 70 and 100um and the thickness could be up to $10{\mu}m$. The resistivity of the copper electrode electroplated was below $2.0{\mu}{\Omega}$ cm which is about half of photosensitive silver electrode. Dielectric layer was coated on the electrodes by screen printing and the pores harmful to the discharge were not formed after heat treatment. In the viewpoint of resistance and patterning, this method has much higher potential for large area display than other methods like screen printing, photosensitive conductive paste method and sputtering.

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The Improvement of Fabrication Process for a-Si:H TFT's Yield (a-Si:H TFT의 수율 향상을 위한 공정 개선)

  • Hur, Chang-Wu
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.6
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    • pp.1099-1103
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    • 2007
  • TFT's have been intensively researched for possible electronic and display applications. Through tremendous engineering and scientific efforts, a-Si:H TFT fabrication process was greatly improved. In this paper, the reason on defects occurring at a-Si:H TFT fabrication process is analyzed and solved, so a-Si:H TFT's yield is increased and reliability is improved. The a-Si:H TFT of this paper is inverted staggered type TFT. The gate electrode is formed by patterning with length of $8{\mu}m{\sim}16{\mu}m$ and width of $80{\sim}200{\mu}m$ after depositing with gate electrode (Cr). We have fabricated a-SiN:H, conductor, etch-stopper and photo-resistor on gate electrode in sequence, respectively. We have deposited n+a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-slower pattern. The NPR layer by inverting pattern of upper Sate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. The a-Si:H TFT made like this has problems at photo-lithography process caused by remains of PR. When sample is cleaned, this remains of PR makes thin chemical film on surface and damages device. Therefor, in order to improve this problem we added ashing process and cleaning process was enforced strictly. We can estimate that this method stabilizes fabrication process and makes to increase a-Si:H TFT's yield.

AN IMPROVED ELECTRICAL-CONDUCTANCE SENSOR FOR VOID-FRACTION MEASUREMENT IN A HORIZONTAL PIPE

  • KO, MIN SEOK;LEE, BO AN;WON, WOO YOUN;LEE, YEON GUN;JERNG, DONG WOOK;KIM, SIN
    • Nuclear Engineering and Technology
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    • v.47 no.7
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    • pp.804-813
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    • 2015
  • The electrical-impedance method has been widely used for void-fraction measurement in two-phase flow due to its many favorable features. In the impedance method, the response characteristics of the electrical signal heavily depend upon flow pattern, as well as phasic volume. Thus, information on the flow pattern should be given for reliable void-fraction measurement. This study proposes an improved electrical-conductance sensor composed of a three-electrode set of adjacent and opposite electrodes. In the proposed sensor, conductance readings are directly converted into the flow pattern through a specified criterion and are consecutively used to estimate the corresponding void fraction. Since the flow pattern and the void fraction are evaluated by reading conductance measurements, complexity of data processing can be significantly reduced and real-time information provided. Before actual applications, several numerical calculations are performed to optimize electrode and insulator sizes, and optimal design is verified by static experiments. Finally, the proposed sensor is applied for air-water two-phase flow in a horizontal loop with a 40-mm inner diameter and a 5-m length, and its measurement results are compared with those of a wire-mesh sensor.

In-Process Monitoring of Micro Resistance Spot Weld Quality using Accelerometer (가속도계를 이용한 마이크로스폿용접의 인프로세스 모니터링)

  • Chang, Hee-Seok;Kwon, Hyo-Chul
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.115-122
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    • 2011
  • This study is to propose an in-process monitoring system for micro resistance spot welding processes using minute accelerometer. A minute accelerometer is mounted on the upper moving electrode tip holder. With its high sensitivity and frequency response characteristics, accelerometer output signal has been successfully recorded and integrated twice to reflect electrode expansion during micro spot welding processes. The analysis of electrode expansion pattern was attempted to find its correlation with spot weld quality. Major previous findings1-6) regarding spot weld quality assessment with the electrode expansion signal in large scale resistance spot welding processes were proved to be true in this in-process monitoring system.

Implementation of High Performance Micro Electrode Pattern Using High Viscosity Conductive Ink Patterning Technique (고점도 전도성 잉크 패터닝 기술을 이용한 고성능 미세전극 패턴 구현)

  • Ko, Jeong Beom;Kim, Hyung Chan;Dang, Hyun Woo;Yang, Young Jin;Choi, Kyung Hyun;Doh, Yang Hoi
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.1
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    • pp.83-90
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    • 2014
  • EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

Effect of Ag Powder Sources on the Patterning of PDP Electrodes

  • Woo, Chang-Min;Kim, Soon-Hak;Hur, Young-June;Kim, Duck-Gon;Song, Gab-Duk;Lee, Yoon-Soo;Cho, Ho-Young;Park, Lee-Soon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.953-955
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    • 2006
  • In this work we compared different sources of composition of Ag powders obtained by dry and wet process on the photolithographic patterning of PDP electrode and resistance of sintered Ag electrode. It was found that 90 : 10 wt% ratio of Ag powder made by dry and wet processes gave optimum result both on the PDP electrode pattern and resistance of PDP electrode after sintering.

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Electrical stabilities of half-Corbino thin-film transistors with different gate geometries

  • Jung, Hyun-Seung;Choi, Keun-Yeong;Lee, Ho-Jin
    • Journal of Information Display
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    • v.13 no.1
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    • pp.51-54
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    • 2012
  • In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.

Enhancement of the Bright Room Contrast Ratio in a Plasma Display Panel (플라스마 디스플레이 패널에서 명실 콘트라스트 개선)

  • Moon, C.H.
    • Journal of the Korean Vacuum Society
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    • v.19 no.1
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    • pp.28-35
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    • 2010
  • A new electrode structure in a plasma display panel was designed in a way to increase the bright room contrast ratio (BRCR). The area of the black matrix pattern to get a low reflection from the panel surface was enlarged using the new electrode design concept. The electrical characteristics such as firing voltage, voltage margin and power consumption were measured. The luminance of the panel was measured and the luminous efficiency was calculated. It was found that the new electrode structure was very effective to enhance the BRCR.