• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.11
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• pp.1053-1058
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• 2007

Micro-EDM technology (or the manufacture of miniature parts is used to make a micro hole. Two electrode shaping methods, mechanical electrode grinding and WEDG technique, have been studied. In this study, an electrode shaping method by using previously machined hole is introduced in order to obtain an optimal hole-making condition. Key factors such as applied voltage, capacitance, feedrate, and hole-dimension have an influence on the fabricating error of electrode shaping, which are taper ratio of a hole, electrode form accuracy, and electrode surface. Therefore, we try to investigate the optimal fabricating of electrode shaping from various experiments. Results from experiments, it was able to minimize the electrode fabricating error as voltage increases, and also applied feedrate and capacitance decreases.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1499_1500
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• 2009

In this paper, we present a simple fabrication process for sloped electrodes in 2-degree of fredom(DOF) scanning micromirror employing pholydimethylsiloxane(PDMS). Using this process, quasi-conic figure electrode is successfully fabricated on the substrate. Simulation results show sloped electrodes decrease actuation voltage down to 22% compared with parallel plate type of electrodes having the same electrode area.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.165-166
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• 2014

The electric double-layer capacitors (EDLCs) are consisted of electrodes, electrolyte and separator. Among of them, electrode materials are generally used carbon materials. In this study, we experimented for the purpose of fabrication of carbon spheres from various carbohydrates as electrode material. Carbon spheres were prepared by hydrothermal synthesis process. Carbon spheres' morphology had been examined using scanning electron microscopy (SEM) and specific surface area had been examined using BET analysis. To confirm the possibilities of carbon spheres as EDLC's electrode materials, we conducted electrochemical tests such as cyclic voltammetry (CV), impedance and cycle ability.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2236-2238
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• 2000

The paper represents the fabrication of an electrostatic micro actuator for optical devices. The micro actuator consists of a plate suspended four p+ silicon cantilevers and an electrode on a glass substrate. The cantilever curls down because of the residual stress gradient in p+ silicon. When input voltage is applied between the p+ cantilevers and the electrode. the cantilevers are pulled toward the electrode by the electrostatic force. The displacement of the plate is measured with a laser displacement meter for various input voltage and frequencies.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2016-2018
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• 2005

Dye-sensitized solar cell (DSC) consist of oxidation semiconduction electrode, electrolyte and counter electrode. Among these, Pt as counter electrode of DSC plays a role in helping redox reaction of iodine ions in electrolyte, also, transferring electrons into electrolyte. In this case, it is expected that characteristics of Pt electrodes strongly depend on fabrication process and its surface condition. In this study, electrochemical behavior of the electro-plated Pt electrode was compared with that of the sputtered Pt electrode, using cyclic-voltammetry and impedance spectroscopy (PARSTATE 2273, by AMETEK). Surface morphology of Pt electrode was investigated by AFM (XE-100, by PSIA). As a result, it was considered that electrochemical properties of sputtered Pt electrode is superior to that of electro-plated Pt electrode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.2
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• pp.118-123
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• 2007

The purpose of this work was to investigate the design and fabrication process effects on electrical properties in high capacitance multilayer ceramic capacitor (MLCC) with nickel electrode. Dielectric breakdown voltage and insulation resistance value were decreased with increasing stack layer number, but dielectric constant and capacitance were increased. With increasing green sheet thickness, dielectric breakdown voltage, C-V and I-V properties were also increased. The major reasons of the effects were thought to be the defects generated extrinsically during fabrication process and interfacial reactions formed between nickel electrode and dielectric layer. These investigations clearly showed the influence of both green sheet thick ness and stack layer number on the electrical properties in fabricating the MLCC.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.234-234
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• 2013

The counter electrodes in dye-sensitized solar cells (DSSCs) play roles in not only collecting electrons from external circuit but also reducing I3- to I- in electrolytes. Generally, conventional counter electrodes for DSSCs are prepared from the high temperature treatment of the H2PtCl6 precursor solution at $400^{\circ}C$ However, the more simplified fabrication process of counter electrodes is required for the commercialization of DSSCs. In this work, we developed novel fabrication process of counter electrodes using nano-second pulsed laser. DSSCs employing counter electrodes prepared by laser process showed conversion efficiency of 6.75% with short-circuit current of 12.73 mA/cm2, open-circuit voltage of 0.74 V and fill factor of 0.72. Closer investigating of photovoltaic properties will be reported.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.4
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• pp.139-143
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• 2005

For application of carbon nano-tube (CNT) as a counter electrode materials of dye-sensitized solar cell (DSSC), the electrochemical behavior of CNT electrode was studied, employing cyclic-voltammetry (C-V) and impedance spectroscopy. Fabrication of CNT-paste and formation of CNT-counter electrode for characteristic measurement have been carried out using ball-milling and doctor blade process, respectively. Unit cell for measurements was assembled using Pt electrode, CNT electrode, and iodine-embedded electrolyte. Field emission-scanning electron microscopy (FE-SEM) was used for structural investigation of CNT powder and electrode. Sheet resistance of electrode was measured with 4-point probe method. Electrochemical properties of electrode, C-V and impedance spectrum, were studied, employing potentiogalvanostat (EG&G 273A) and lock in amplifier (EG&G 5210). As a results, the sheet resistance of CNT electrode is almost similar to that of F-doped SnO2 (FTO) coated glass substrate as approximately 10 ohm/sq. From C-V and impedance spectroscopy measurements, it was found that CNT electrode has high reaction rate and low interface reaction resistance between CNT surface and electrolyte. These results provides that CNT electrode were superior to that of conventional Pt electrode. Particularly, the reaction rate in the CNT electrode is about thrice high than Pt electrode. Therefore. CNT electrode is to be good candidate material for counter electrode in DSSC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.229-230
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• 2010

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.30-37
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• 2005

We present an air bridge type electrode system with tunable electrode distance for detecting electroactive biomolecules. It is known that the narrower gap between electrode fingers, the higher sensitivity in IDA (interdigitated array) electrode. In previous researches on IDA electrode, narrower patterning required much precise and expensive equipment as the gap goes down to nanometer scale. In this paper, an improved method is suggested to replace nano gap pattering with downsizing electrode distance and showed that the patterning can be replaced by thickness control using metal deposition methods, such as electroplating or metal sputtering. The air bridge type electrode was completed by the following procedures: gold patterning for lower electrode, copper electroplating, gold deposition for upper electrode, photoresist patterning for gold film support, and copper etching for space formation. The thickness of copper electroplating is the distance between upper and lower electrodes. Because the growth rate of electroplating is $0.5{\mu}m\;min^{-1}$, the distance is tunable up to hundreds of nanometers. Completed electrodes on the same wafer had $5{\mu}m$ electrode distance. The gaps between fingers are 10, 20, 30, and $40{\mu}m$ and the widths of fingers are 10, 20, 30, 40, and $50{\mu}m$. The air bridge type electrode system showed better sensitivity than planar electrode.