• 한국표면공학회지
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• 제37권2호
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• pp.110-118
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• 2004

The corrosion of pure titanium (CP- Ti Grade 2) and titanium alloy (Ti6Al4V ELI) were studied under various conditions of simulated body fluids. The static immersion test and the electrochemical test were performed in accordance with ISO 10271 : 2001. For the electrochemical test, the open circuit potential was monitored as a function of time, and the cyclic polarization curve was recorded. The corrosion resistance was evaluated from the values of corrosion potential, passivation current density, breakdown potential, and the shape of hysteresis etc. The effects of alloy type, surface condition, temperature, oxygen, and constituents in the fluids such as acid, chloride were estimated. Both specimens had extremely low dissolution rate in the static immersion test. They showed strong passivation characteristics in the electrochemical test. They maintained negligible current density throughout the wide anodic potential range. The passive layer was not broken up to 2.0 V (vs. SCE). The hysteresis and the shift of passivation potential toward the anodic direction was observed during the reversed scan. The passivation process appeared to be accelerated by oxygen in air or that dissolved in the fluids. The passivation also proceeded without oxygen by the reaction of constituents in the fluids. Acid or chloride in the fluids, specially later weakened the passive layer, and then induced higher passivation current density and less shift of passivation potential in the reversed scan. CP-Ti Grade 2 was more reactive than Ti6Al4V ELI in the fluids containing acid or chloride, but thicker layer produced on its surface provided higher corrosion resistance.

• Corrosion Science and Technology
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• 제22권3호
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• pp.153-163
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• 2023

Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

• Corrosion Science and Technology
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• 제6권2호
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Corrosion Science and Technology
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• 제9권2호
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• pp.57-66
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• 2010

Since nuclear power plants are being operated under high temperature and high pressure, on-line monitoring technique to detect corrosion could be more effective than off-line method in shut-off period. In this operating condition, electrochemical noise method may be suitable to monitor the corrosion. This paper aims the analysis on the relation between the cracking and electrochemical noise signal of Alloy 600 under U-bending. When electrochemical noise monitoring technique was used during SCC test, it was judge to be obvious that if cracks generate, its generation can be detected by electrochemical current noise. Cracking-related noise was defined as the noise showing 5~10 times greater than the average value of background noise bands. On the base of crack noise, crack initiation time was determined. From SCC test and electrochemical noise monitoring in $25^{\circ}C$, 0.1 M $Na_2S_4O_6$ solution (Reverse U-Bended Alloy 600 SE+), average crack initiation time was obtained as 9,046 seconds and from its initiation time, it could be defined that net crack propagation rate is the crack length divided by ${\Delta}T$(= total test period - crack initiation time). Therefore, average net crack propagation rate was obtained to be $1.18{\times}10^{-9}\;m/s$.

• Corrosion Science and Technology
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• 제3권1호
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• pp.14-19
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• 2004

Crack growth rate and threshold stress intensity factor for stress corrosion cracking(SCC), $K_{ISCC}$ were measured for type 403 stainless steel in 3,5% NaCl solution at room temperature and SCC was monitored by electrochemical noise technique during $K_{ISCC}$ testing. In rising load test, pits were formed at the tip of pre-crack for the pre-cracked compact tension specimen unlike in smooth round specimen in which only unstable pits were observed and hence immune to SCC. Micro-cracks were found to initiate from the pits in the former specimen, and initiation of micro-crack as well as macro-crack was detected by electrochemical noise technique in rising load $K_{ISCC}$ tests. Crack growth rate increased with increasing either displacement rate or stress intensity factor at crack initiation and was higher in rising load $K_{ISCC}$ test compared to constant load $K_{ISCC}$ test at given stress intensities.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2003년도 가을 학술논문집
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• pp.358-362
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• 2003

산화물 형태의 사용후핵연료를 용융염에서 금속 형태로 전환하여, 발열량, 부피 및 방사능을 1/4로 감소시킬 수 있는 전기화학적 금속전환 공정을 개발하고, 5kg $U_3O_8$/Batch 규모의 mock-up 실험을 수행하였다. 본 연구에서는 전해 셀의 운전변수를 해석하였으며, 아울러 hot test를 위한 장치개발 연구도 병행하였다. 전기화학적 금속전환 공정을 이용하여 $U_3O_8$ 형태의 천연우라늄 분말을 99% 이상 금속전환할 수 있었으며, 또한 20kg $U_3O_8$/batch 규모 장치의 설계자료를 산출할 수 있었다.

• 한국물환경학회지
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• 제33권1호
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• pp.34-39
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• 2017

Under a corrosive environment, electrodes that are applied in the water-treatment system need not only very high electrochemical activity for fast reactions, but also high durability for cost saving. Therefore, the fabrication condition of iridium electrodes was examined to produce a more durable iridium electrode in this study. Tantalum was selected as a binder to enhance the durability of the iridium electrode. Investigation of the weight ratio between the catalyst and the binder to improve electrochemical activity was performed. Also, to compare the effect of the different coating amounts of the catalyst, the results of CV (Cyclic Voltammetry) and EIS (Electrochemical Impedance Spectroscopy) were discussed. Furthermore, an ALT(Accelerated Lifetime Test) was designed and applied to the electrodes to determine the conditions for highly durable electrode fabrication.

• Journal of Welding and Joining
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• 제29권5호
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Journal of Welding and Joining
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• 제25권3호
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• Journal of Electrochemical Science and Technology
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• 제10권2호
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• pp.123-130
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• 2019

We investigated the electrochemical behavior of an electrode coated with a nickel hexacyanoferrate/graphene oxide (NiPB/GO) composite to evaluate its potential use for the electrochemical separation of radioactive Cs as a promising approach for reducing secondary Cs waste after decontamination. The NiPB/GO-modified electrode showed electrochemically switched ion exchange capability with excellent selectivity for Cs over other alkali metals. Furthermore, the repetitive ion insertion and desertion test for assessing the electrode stability showed that the electrochemical ion exchange capacity of the NiPB/GO-modified electrode increased further with potential cycling in 1 M of $NaNO_3$. In particular, this electrochemical treatment enhanced Cs uptake by nearly two times compared to that of NiPB/GO and still retained the ion selectivity of NiPB, suggesting that the electrochemically treated NiPB/GO composite shows promise for nuclear wastewater treatment.