• 한국표면공학회지
• /
• 제38권1호
• /
• pp.14-20
• /
• 2005

The control of internal stress is extremely important in electroforming because of the deliberately low adhesion between the electro form and the mandrel. Excessive tensile or compressive stress can cause distortion, separation problem, curling, peeling or separation of electroform prematurely from the mandrel, buckling and blistering. Nickel sulfamate bath has been widely used in electroforming because of its low internal stress and moderate hardness. In this study, real-time stress sensor has been used for stress control in chloride-free nickel sulfamate bath for 400 mm x 300 mm x 500 ㎛ nickel electroform. It was found that compressive stress found at low current density indicated the contamination of electrolyte, which is very useful in procuring buckling and peeling of electroform. No compressive stress is allowed for plate electroform. The real-time stress can also be used for accurate stress control of nickel electroform. The tensile stress was found to be increased slightly with increase in nickel electroform thickness, i.e., from initial 1.47 ksi to 2.02 ksi at 320 ㎛.

• Composites Research
• /
• 제24권4호
• /
• pp.11-16
• /
• 2011

극저온 응용에서 사용하는 고분자복합재료의 계면물성 유지가 아주 중요하다. 본 연구에서는 상온과 극저온에서 사용하는 단일 탄소섬유강화 에폭시 복합재료를 마이크로드롭넷 시험과 전기-미세역학시험법을 이용한 계면전단강도와 겉보기 강성도를 평가하였다. 탄소섬유와 저온용 에폭시의 극저온에 따른 기계적 물성변화를 확인하였다. 극저온에서 탄소섬유 인장실험 결과, 상온과 비교하여 강성도는 유지하면서 강도와 연신율이 감소하였다. 이에 비해, 에폭시 기지는 상온보다 극저온에서 강도가 증가되었으나, 연신율이 감소하는 결과를 보여주었다. 이는 탄소섬유에 비해 에폭시 수지내 존재하는 빈 공간이 극저온에서 열적 수축이 최대로 일어나기 때문이다. 계면전단강도는 $-10^{\circ}C$에서 최대를 보인 후에 극저온까지 점차 감소를 보여 주었다. 그러나, 탄소섬유와 YDF-175 에폭시가 극저온에서도 여전히 상온보다 양호한 계면전단강도를 보여주었다. 이 결과는 아주 유용하며 선정된 저온용 에폭시의 인성과 계면접착력이 극저온에서도 유지되기 때문이다.

• Tribology and Lubricants
• /
• 제36권1호
• /
• pp.1-10
• /
• 2020

Large-area two-dimensional (2D) materials synthesized by chemical vapor deposition on donor substrates are promising functional materials for conductors, semiconductors, and insulators in flexible and transparent devices. In most cases, 2D materials should be transferred from a donor substrate to a target substrate; however, 2D materials are prone to damage during the transfer process. The damages to 2D materials during transfer are caused by contamination, tearing, and chemical doping. For the commercialization of 2D materials, a damage-free, large-area, and productive transfer process is needed. However, a transfer process that meets all three requirements has yet to be developed. In this paper, we review the recent progress in the development of transfer processes for 2D materials, and discuss the principles, advantages, and limitations of each process. The future prospects of transfer processes are also discussed. To simplify the discussion, the transfer processes are classified into four categories: wet transfer, dry transfer, mechanical transfer, and electro-chemical transfer. Finally, the "roll-to-roll" and "roll-to-plate" dry transfer process is proposed as the most promising method for the commercialization of 2D materials. Moreover, for successful dry transfer of 2D materials, it is necessary to clearly understand the adhesion properties, viscoelastic behaviors, and mechanical deformation of the transfer film used as a medium in the transfer process.

• Korean Chemical Engineering Research
• /
• 제47권2호
• /
• pp.203-207
• /
• 2009

소형 반도체 접착에 쓰이는 비전도성 고분자 접착제에서 발생하는 문제점으로는 접착소재와 칩 또는 기판 간의 열 팽창계수 차이에 의한 박리, 크래킹 및 접착력 부족 등이 있다. 이러한 결점의 보완을 위하여 무기입자를 첨가한 고분자 복합소재를 통해 접착제의 열팽창계수를 낮추거나, 접착소재에 유연성 첨가제를 첨가하는 방법 등이 사용되고 있다. 본 연구에서는 양 말단에 아민기를 가지는 아미노 변성 실록산(AMS)의 함량을 1, 3, 5 phr로 변화시켜 실록산/에폭시 복합재를 제조하였다. 그 결과, 실록산의 첨가는 유리전이 온도를 $134^{\circ}C$에서 $122^{\circ}C$까지, 모듈러스를 2,425 MPa에서 2,143 MPa까지 감소시켰으며, 열팽창계수는 67 ppm/에서 71 ppm/까지 상승시켰다. 실록산은 유연성 부여에는 효과를 나타냈지만, 유리전이온도의 감소를 가져오는 것을 확인하였다.

• 한국재료학회지
• /
• 제22권7호
• /
• pp.335-341
• /
• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Composites Research
• /
• 제22권5호
• /
• pp.8-14
• /
• 2009

유리섬유 강화 CNT-에폭시 나노복합재료의 계면특성은 미세역학적 시험법과 젖음성 측정을 통하여 평가하였다. CNT-에폭시 나노복합재료의 접촉저항은 전기적 접촉부가 일정하게 점차적으로 증가하는 경사형 (gradient) 시편으로 측정되었다. CNT-에폭시나노복합재료의 접촉저항은 2-점법 대신에 4-점법을 사용하여 평가하였다. 불균일한 표면에 존재하는 소수성 영역 때문에 CNT-에폭시 나노복합재료의 어떤 부분은 초소수성보다는 다소 낮은 접촉각인 120도를 가졌다. 표면처리된 유리섬유는 에칭된 섬유 표면의 흠이 있지만 인장 강성도는 약간의 변화가 나타나는 반면에, 인장강도는 현저하게 감소하였다. 에칭된 유리섬유와 CNT-에폭시 나노복합재료는 표면 에너지와 거친 정도가 증가함으로써, 계면전단강도가 증가되었다 열역학적 에너지 일인 $W_a$가 증가함에 따라, 기계적 계면전단강도와 겉보기 강성도 모두 상호일치하게 증가를 보여주었다.

• 열처리공학회지
• /
• 제37권1호
• /
• pp.16-22
• /
• 2024

The conventional degreasing process involves removing oil and contaminants at temperatures above 80℃, resulting in excessive energy consumption, increased process costs, and environmental issues. In this study, we aimed to find the optimal degreasing conditions for the pre-treatment process of electro-galvanizing cold-rolled steel sheets, conducted efficiently at room temperature without the need for a separate heating device. To achieve this, we developed a room temperature degreasing solution and a brush-type degreasing tool, aiming to reduce energy consumption and normalize the decrease in degreasing efficiency caused by temperature reduction. Alkaline degreasing solution were prepared using KOH, SiO₂, NaOH, Na₂CO₃, and Sodium Lauryl Sulfate, with KOH and NaOH as the main components. To enhance the degreasing performance at room temperature, we manufactured additives including sodium oleate, sodium stearate, sodium palmitate, sodium lauryl sulfate, ammonium lauryl sulfate, silicone emulsion, and EDTA-Na. Room temperature additives were added to the alkaline degreasing solution in quantities ranging from 0.1 to 20 wt.%, and the uniformity of degreasing and the adhesion of the galvanized layer were evaluated through Dyne Test, T-bending Test, OM, SEM, and EDS analyses. The results indicated that the optimal degreasing solution composition consisted of NaOH (30 g/L), Na₂CO₃ (30 g/L), SLS (6 g/L), and room temperature additives (≤1 wt%).

• 한국표면공학회지
• /
• 제47권1호
• /
• pp.39-47
• /
• 2014

The peculiar feature of cathodic protection in seawater has the capability to form mineral calcareous deposits such as magnesium and calcium on metal surfaces. It is assumed that $OH^-$ ions are generated close to the metal surface as a result of cathodic protection and generated $OH^-$ ions increases the pH of the metal/seawater interface outlined as the following formulae. (1) $O_2+2H_2O+4e{\rightarrow}4OH^-$, or (2) $2H_2O+2e{\rightarrow}H_2+2OH^-$. And high pH causes precipitation of $Mg(OH)_2$ and $CaCO_3$ in accordance with the following formulae. (1) $Mg^{2+}+2OH^-{\rightarrow}Mg(OH)_2$, (2) $Ca^{2+}+CO{_3}^{2-}{\rightarrow}CaCO_3$. The focus of this study was to increase the amount of $CO{_3}^{2-}$ with the injection of $CO_2$ gas to the solution for accelerating process of the following formulae. (1) $H_2O+CO_2{\rightarrow}H_2CO_3$, (2) $HCO^{3-}{\rightarrow}{H^+}+CO{_3}^{2-}$. Electrodeposit films were formed by an electro-deposition technique on steel substrates in solutions of both natural seawater and natural seawater dissolved $CO_2$ gas with different current densities, over different time periods. The contents of films were investigated by scanning electron microscopy(SEM) and X-ray diffraction(XRD). The adhesion and corrosion resistance of the coating films were evaluated by anodic polarization. From an experimental result, only $CaCO_3$ were found in solution where injected $CO_2$ gas regardless of current density. In case of injecting the $CO_2$ gas, weight gain of electrodeposits films hugely increased and it had appropriate physical properties.

• 공업화학
• /
• 제22권1호
• /
• pp.104-108
• /
• 2011

소형 반도체 접착에 쓰이는 비전도성 고분자 접착제에서 발생하는 문제점으로는 접착소재와 칩 또는 기판 간의 열팽창계수 차이에 의한 박리, 크래킹 및 접착력 부족 등이 있다. 이러한 결점의 보완을 위하여 실리카, 나노클레이 등의 무기입자를 첨가한 고분자 복합소재를 통해 접착제의 열팽창계수를 낮추거나, 접착소재에 유연성 첨가제를 첨가하는 방법 등이 사용되고 있다. 본 연구에서는 양 말단에 아민기를 가지는 아미노 변성 실록산(AMS)을 유연제로 활용하기 위한 실험으로서, 다른 당량을 갖는 두 종류의 AMS의 함량을 1, 3, 5, 7, 9, 10 phr로 변화시켜 AMS/에폭시 복합체를 제조하였다. 그 결과, 당량이 작은 AMS인 KF-8010과 에폭시 복합체의 유리전이 온도는 148에서 $122^{\circ}C$까지, 당량이 큰 AMS인 X-22-161A와 에폭시의 복합체의 유리전이 온도는 148에서 $121^{\circ}C$까지 감소하여 AMS의 당량 변화에 대한 영향이 크지 않음을 확인하였다. KF-8010/에폭시 복합체의 모듈러스는 2648에서 2143 MPa까지 X-22-161A/에폭시 복합체는 2648에서 2015 MPa까지 감소하여 큰 당량의 AMS를 첨가한 에폭시 복합체가 적은당량의 AMS를 첨가한 에폭시 복합체보다 더 큰 폭의 모듈러스 감소율을 확인하였다.