• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1237-1238
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• 2013

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.129-129
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• 2006

인쇄회로를 제작하기 위하여 기판상에 에칭 레지스트, 도금막, 절연재료, 솔더 마스크 등을 패터닝 하게 되는데, 일반적으로 이러한 유기체 막들은 대부분 액상이나 고형의 필름 형태로 패턴을 형성하게 된다. 형성된 패턴과 동박과의 접착력 향상이 가장 주요한 문제점 중의 하나이다. 상대적으로 편평한 동박면과 유기체 막과의 접착력을 향상시키기 위해 일반적으로 접촉 면적을 증가시키기 위한 표면개질을 하게 된다. 기계적 브러싱이나 스크러빙에 의해서도 기판상의 동박의 surface topography 를 개선하기 위한 노력이 시도 되고 있지만, 본 연구에서는 microetching 방법에 의해서 화학적으로 동박 표면상에 최대한 요철을 많이 형성하여 에칭 레지스트와 동박 간의 접착력을 증대시키기 위한 연구를 수행하였다.

• Journal of the Korean institute of surface engineering
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• v.46 no.1
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• pp.1-8
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• 2013

Cathodic current on a metal tends to increase the $OH^-$ neighboring to the metal surface, especially during electro-deposition in seawater. The increased pH at metal/seawater interface results in precipitation of brucite crystal structure-$Mg(OH)_2$ as following formula; $Mg^{2+}+2OH^-{\rightarrow}Mg(OH)_2$, that is typical mechanism of the main calcareous deposits-compound in electro deposited coating films. In this study, the effects of anode and current density on deposition rate, composition structure and morphology of the deposited films were systematically investigated by scanning electron microscopy(SEM) and x-ray diffraction(XRD), respectively in order to overcome the problems such as deposition rate and a weak adhesion between deposit film and metal surface. The adhesion and corrosion resistance of the coating films were also evaluated by anodic polarization test. The electro-deposited film formed by using AZ31-Mg anode had the most appropriate physical properties. Weight gain of electro-deposit films increased with increasing cathodic current. Electro-deposit prepared at $5A/cm^2$ current density shows better adhesion than that formed at $8{\sim}10A/cm^2$.

• Journal of the Korean Mathematical Society
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• v.53 no.1
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• pp.161-185
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• 2016

We consider a mathematical model which describes the quasistatic frictional contact between a piezoelectric body and an electrically conductive obstacle, the so-called foundation. A nonlinear electro-viscoelastic constitutive law is used to model the piezoelectric material. Contact is described with Signorini's conditions and a version of Coulomb's law of dry friction in which the adhesion of contact surfaces is taken into account. The evolution of the bonding field is described by a first order differential equation. We derive a variational formulation for the model, in the form of a system for the displacements, the electric potential and the adhesion. Under a smallness assumption which involves only the electrical data of the problem, we prove the existence of a unique weak solution of the model. The proof is based on arguments of time-dependent quasi-variational inequalities, differential equations and Banach's fixed point theorem.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.02a
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• pp.93-93
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• 1996

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.21-25
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• 2009

Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.153-156
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• 2005

Nondestructive sensing of electrospun PYDF web and multi-wall carbon nanotube (MWCNT)/epoxy composites were investigated using electro-micromechanical technique. Electrospinning is a technique used to produce micron to submicron diameter polymeric fibers. Electrospun PVDF web was also evaluated for the sensing properties by micromechanical test and by measurement electrical resistance. CNT composite was especially prepared for high volume contents, 50 vol% of reinforcement. Electrical contact resistivity on humidity sensing was a good indicator for monitoring as for multifunctional applications. Work of adhesion using contact angle measurement was studied to correlate acid-base surface energy between carbon fiber and CNF composites, and will study furher for interfacial adhesion force by micromechanical test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.316-316
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• 2008

Using an evaporation method, $SiO_2$ was deposited as a buffer layer between a flexible PET substrate and a ITO film deposited by DC magnetron sputtering and electro-optical properties were investigated with thickness variance of $SiO_2$ layers. After coating a $SiO_2$ layer and a ITO film, the ITO/$SiO_2$/PET was heated up to $200^{\circ}C$ and the resistivity and the transmittance were measured by hall effect measurement system and UV/VIS/NIR spectroscopy. As a result of depositing a $SiO_2$ buffer layer, the resistivity increased and the transmittance and adhesion property were enhanced than ITO films with no buffer layers and the resistivity was lowered as $SiO_2$ thickness increased from 50 $\AA$ to 100 $\AA$. It was found that the transmittance was independent of annealing temperature variance in $150^{\circ}C{\sim}200^{\circ}C$ and the resistivity decreased as the temperature increased and especially decreasing rate of the resistivity was higher as the buffer layer thickness was thinner. So under optimized depositing of $SiO_2$ buffer layers and post-annealing of ITO/$SiO_2$/PET, ITO films with enhanced adhesion, electro-optical properties can obtained.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.18-24
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• 2006

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ($3{\mu}m$ in thickness) on the $W-40\%Ag$ contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at $710^{\circ}C$ in $H_2$ atmosphere. The optimum brazing temperature of $710^{\circ}C$ was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at $710^{\circ}C$. Thin Ag electro-plated layer precoated on the electric contact ($3{\mu}m$ in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.