• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.375-376
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• 2007

In this work, we have simulated a 42-inch LED BLU which was based on 300 RGB LEDs. We have done an adjustment of LEDs' strip distance and a height of the top of the LED to the back of the LCD to get white color uniformity. So, we have changed simultaneously the distance between the top of the LEDs and the back of the LCD. Moreover, we set a fixed position for the horizontal of LED's pitch. And then, we have experimented and compared to our simulation data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.313-316
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• 2004

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics(ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.188-191
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of $WO_3$ CMP used silica slurry, ceria slurry, tungsten slurry. In this paper, the effects of addition oxidizer on the $WO_3$ CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.567-568
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• 2006

To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina ($Al_2O_3$) powder as an abrasive added within DSS were evaluated to achieve the improvement of removal rates (RRs) and within-wafer non-uniformity (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate the possible ways of reusing it. And then, we have discussed the CMP characteristics of silica slurry retreated by mixing of original slurry and used slurry (MOS).

• Journal of the Optical Society of Korea
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• v.4 no.1
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• pp.30-36
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• 2000

In this paper, a method based on the Genetic Algorithm(GA) for phase optimization is proposed. The programmable hybrid optical interconnection system implemented by the spatial light modula-tor is tested for a near-real-time optical processing. Designed diffractive grating has a 74.7[%] high diffraction efficiency and a $1.73 {\times}10^{-1}$ uniformity quantitatively. The dependence of characteris-tics on several parameters in the grating design are analyzed. Also, as a result of the geometrical transformation to obtain quantitative data for $3 {\times} 3$ spot beams, an objective optical experiment using CCD array detector produces the mean of beam intensity as a gray level of 202, the maximum value is 225, the minimum value is 186, and uniformity is quantitatively $1.93 {\times} 10^{-1}$, similar to the simulation result.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.2
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• pp.147-150
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• 2019

There is a need for the development of transparent conductive materials that are economical and environmentally friendly with exhibit low resistivity and high transmittance in the visible spectrum. In this study, the deposition rate and uniformity of Al-doped ZnO-thin films were improved by changing the Z-motion of the sputtering system. The deposition rate and the uniformity were determined to be 3.44 nm/min and 1.23%, respectively, under the 10 mm Z-motion condition. During $O_2$ plasma treatment, the intrusion-type metal elements in the thin film were reduced, which contributed to an oxygen vacancy reduction in addition to structural stabilization. Moreover, the sheet resistance was more easily saturated.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.4
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• pp.140-145
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• 2003

The influence of microstructure nonuniformity on the electrical characteristics of ZnO varistors was analyzed with the added amount of $Al_2$O$_3$ dopants. $Al_2$O$_3$ doping can effectively inhibit grain growth. When $Al_2$O$_3$ content is in the range between 0-0.1 %, the average grain size and the standard deviation decrease quickly and the grain growth is strongly inhibited. Therefore, it is possible to increase the microstructure uniformity by accurate addition of $Al_2$O$_3$ to the ZnO varistor. The breakdown voltage increases with the decrease of standard deviation. The greater the uniformity of the Zno varistor means the higher the global breakdown voltage. The $Al_2$O$_3$ dopants having about 0-0.023 wt% content can effectively improve the voltage ratio, and the voltage ratio reaches a minimum value of 2.32 at an $Al_2$O$_3$ content of 0.005 wt%.

• Applied Microscopy
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• v.45 no.3
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• pp.119-125
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• 2015

Two-dimensional (2D) transition metal dichalcogenides (TMDCs) have attracted significant attention due to their unique and exotic properties attributed to their low dimensionality. In particular, semiconducting 2D TMDCs such as $MoS_2$, $WS_2$, $MoSe_2$, and $WSe_2$ have been demonstrated to be feasible for various advanced electronic and optical applications. In these regards, process to synthesize high quality 2D TMDCs layers with high reliability, wafer-scale uniformity, controllable layer number and excellent electronic properties is essential in order to use 2D TMDCs in practical applications. Vapor deposition techniques, such as physical vapor deposition, chemical vapor deposition and atomic layer deposition, could be promising processes to produce high quality 2D TMDCs due to high purity, thickness controllability and thickness uniformity. In this article, we briefly review recent research trend on vapor deposition techniques to synthesize 2D TMDCs.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.39-44
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• 2022

Using a CFD (computational fluid dynamics) simulation tool, we have offered a design guideline of a slot-die head having a simple T-shaped cavity through an analysis of the fluid dynamics in terms of cavity pressure and outlet velocity, which affect the uniformity of coated thin films. We have visualized the fluid flow with a transparent slot-die head where poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS) is injected. We have shown that the fluid dynamics inside the slot-die head depends sensitively on the cavity depth, cavity length, land length, and channel gap (i.e., shim thickness). Of those, the channel gap is the most critical parameter that determines the uniformity of the pressure and velocity distributions. A pressure drop inside the cavity is shown to be reduced with decreasing shim thickness. To quantify it, we have also calculated the coefficient of variation (CV). In accordance with Hagen-Poiseuille's laws and electron-hydraulic analogy, the CV value is decreased with increasing cavity depth, cavity length, and land length.