• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.69-71
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• 2003

Mechanical Properties, such as tensile strength, elongation, and tear strength, decreased according to increasing the load of ATH, volume resistivity, AC break down strength, and tracking resistance for HVI SC contained ATH treated by vinyl Silane were better than those for HVI SC were contained ATH treated by other surface treatment agent, such as stearic acid and acryl silane.

• Progress in Superconductivity and Cryogenics
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• v.5 no.1
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• pp.128-132
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• 2003

This paper discusses several electrical properties of tape-type insulation impregnated with liquid nitrogen ($LN_2$) in superconducting cable. Synthetic polypropylene laminated paper has been tested for its short-term breakdown strength and partial discharge(PD) characteristics under AC voltage. furthermore, the effect of winding parameter on breakdown strength, PD incepti on and extinction electrical stress with different test samples are discussed.

• Journal of Pharmaceutical Investigation
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• v.26 no.3
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• pp.207-213
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• 1996

The kinetic change of electrical resistance of hairless mouse skin as a function of ionic strength of the bathing medium was determined from impedance measurements. After increasing (decreasing) the ionic strength of the bathing medium, resistance decreased (increased) continuously with time, finally reaching an equilibrium value. We have modelled this process, using nonsteady-state diffusion kinetics. The results show semi-quantitative correlation between theoretically derived and experimentally obtained values. Overall, this work provides further mechanistic insight into ion-conduction through the skin.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.11
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• pp.941-946
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• 2001

The fundamental study on HTV silicone for insulation material has been performed. In order to estimate the chemical behavior of siloxane under high voltage, H-NMR, GPC and vinyl contents measurement were used. As an experimental results, after high voltage stress, the molecular weight of siloxane are increased, the vinyl contents of siloxane are decreased. The dielectric strength of vinyl group containing siloxane was lower than only methyl containing siloxane.

• Electrical & Electronic Materials
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• v.10 no.3
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• pp.255-261
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• 1997

In this study, pore-containing barium titanate ceramics were prepared with different porosities and pore sizes, in order to better understand how porosity and pore size affect electrical breakdown of barium titanate ceramics. A granulated barium titanate powder was mixed with three grades of commercial polymer microspheres up to 11wt%. The electrical breakdown test was performed at two different temperatures of 30.deg. C(below Tc) and 150.deg. C(above Tc) for samples immersed in a silicon oil bath using a 60kV de power supply. Electrical breakdown strength of pore containing barium titanate ceramics with porosity lower than 10% decreased as pore size and porosity increased. However, above the 10% porosity region, electrical breakdown strength decreased as the pore connectivity increased. From the experimental results, an optimum electrical breakdown model is proposed in an attempt to explain the effect of pores.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.135-139
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• 2011

In an effort to develop new electrical insulation materials, four different kinds of organically modified layered silicate were incorporated into an epoxy matrix to prepare nanocomposites for electrical insulation. Five wt% of organically modified layered silicates were processed in a planetary centrifugal mixer in an epoxy matrix, and the thermal, mechanical, and electrical properties of the cured epoxy/layered silicate were investigated. The morphology of the nanoscale silicate dispersed in the epoxy matrix was observed using transmission electron microscopy, and the interlayer distance was measured by wide-angle X-ray scattering diffraction analysis.

• Korean Journal of Materials Research
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• v.20 no.2
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• pp.65-71
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• 2010

In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm $Mg_3P_2$ precipitation phase was observed having lattice parameter $a:12.01{\AA}$ such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.8
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• pp.1398-1406
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• 2008

This paper describes the electrical breakdown characteristics of broken toughened glass stem insulators by comparing with those of sound ones. The broken toughened glass stem insulators were taken from the electric railway field. According to the international standards, the sound and broken toughened glass stem insulators were tested in electrical strength. In the test, the power frequency voltage and the impulse voltage with a standard waveform were applied to the insulators. The power frequency voltage tests were carried out under both dry and wet condition and the impulse voltage tests under only dry condition. The acquired results were compared one another and discussed in electrical breakdown characteristic by analyzing the flashover progress pictures. As a result, the electrical strength of the broken toughened glass insulators was acquired and the processes of the surface breakdown on the toughened glass insulators were confirmed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.4
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• pp.693-699
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• 2010

General transformer's life is known as paper insulation' life. If a transformer is degraded by these aging factors, it is known that electrical, mechanical and chemical characteristics for transformer's oil-paper are changed. When the kraft paper is aged, the cellulose polymer chains break down into shorter lengths. It causes decrease in both tensile strength and degree of polymerization of paper insulation. The paper breakdown is accompanied by an increase in the content of furanic compounds within the dielectric liquid. In this paper it is aimed at analysis on correlation between aging characteristics for insulating diagnosis of thermally aged paper. For investigating the accelerated aging process of oil-paper samples accelerating aging cell was manufactured for estimating variation of paper insulation during 500 hours at $140^{\circ}C$ temperature. To derive the results, it was performed analysis such as tensile strength(TS), depolymerization(DP), dielectric strength(DS), relative permittivity, water content(WC) and furan compound(FC) for aged paper. Also for analyzing correlation between insulating degradation characteristics, we used linear regression method. As as results of linear regression analysis, there was a close correlation between TS and DP. WC, FC. But dielectric strength was a weak correlation with aging time.