• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.853-854
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• 2006

Warm compaction powder metallurgy was used to produce a $Ti_3SiC_2$ particulate reinforced Cu matrix composite. Fabrication parameters and warm compaction behaviors of Cu powder were studied. Based on the optimized fabrication parameters a Cu-based electrical contact material was prepared. Results showed that in expend of some electrical conductivity, addition of $Ti_3SiC_2$ particulate increased the hardness, wear resistivity and anti-friction ability of the sintered Cu-base material.

• 한국표면공학회지
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• 제43권3호
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• pp.148-153
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• 2010

Transparent conducting films having a hybrid structure of GZO/Metal/GZO were prepared on glass substrates by sequential deposition using DC magnetron sputtering. Silver, copper, aluminum and zinc thin films were used as the intermediate metal layers in the hybrid structure. The electrical and optical properties of hybrid transparent conducting films were investigated with varying the thickness of metal layer or GZO layers. With increasing the metal thickness, hybrid films showed a noticeable improvement of the electrical conductivity, which is mainly dependent on the electrical property of the metal layer. GZO(40 nm)/Ag(10 nm)/GZO(40 nm) film exhibits a resistivity of $5.2{\times}10^{-5}{\Omega}{\cdot}cm$ with an optical transmittance of 82.8%. For the films with Zn interlayer, only marginal reduction in the resistivity was observed. Furthermore, unlike other metals, hybrid films with Zn interlayer showed a decrease in the resistivity with increasing the GZO thickness. The optimal thickness of GZO layer for anti-reflection effect at a given thickness of metal (10 nm) was found to be critically dependent on the refractive index of the metal. In addition, x-ray diffraction analysis showed that the insertion of Ag layer resulted in the improvement of crystallinity of GZO films, which is beneficial for the electrical and optical properties of hybrid-type transparent conducting films.

• 한국결정성장학회지
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• 제28권6호
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• pp.235-242
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• 2018

$Y_2O_3$를 소결조제로 사용한 질화알루미나(AlN)에 다양한 소결조건과 MgO의 도핑이 고온전기전도도의 특성에 대해 미치는 영향에 대해 연구하였다. MgO를 도핑 하였을 때, 2차상으로 스피넬과 페로브스카이트 상이 생성되었고, 이는 전기적 특성에 영향을 끼쳤다. 고온 임피던스를 분석한 결과 MgO의 도핑은 AlN 입내의 활성화 에너지와 전기전도도의 감소를 보이는 반면에, 입계의 경우에는 활성화 에너지와 전기전도도의 증가를 보였다. 이는 저항이 높은 비정질의 액상이 입계에 형성되거나, Mg의 석출에 의하여 쇼트키 장벽이 높아졌기 때문으로 예상된다. MgO가 도핑된 AlN을 어닐링 한 경우에는 어닐링 하지 않은 경우에 비하여, 활성화 에너지와 전기전도도가 더욱 증가하는 것을 볼 수 있었다. 이러한 결과는 $1500^{\circ}C$에서 어닐링을 통하여 미세구조분석에서 보이는 바와 같이 Mg 이온이 입계에서 입내로 확산된 때문으로 예상된다.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.189-192
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• 2014

Yttria-stablized zirconia (YSZ) is the most commonly used electrolyte material, but the reduction in working temperature leads to insufficient ionic conductivity. Ceria based electrolytes (GDC) are more attractive in terms of conductivity at low temperature, but these materials are well known to be reducible at very low oxygen partial pressure. The reduction of electrolyte resistivity is necessary to overcome cell performance losses. So, thin YSZ/GDC bilayer technology seems suitable for decreasing the electrolyte resistance at lower operating temperatures. Bilayer electrolytes composed of a galdolinium-doped $CeO_2$ ($Ce_{0.9}Gd_{0.1}O_{1.95}$, GDC) layer and yttria-stabilized $ZrO_2$ (YSZ) layer with various thicknesses were deposited by RF sputtering and E-beam evaporation. The bilayer electrolytes were deposited between porous Ni-GDC anode and LSM cathode for anode-supported single cells. Thin film structure and surface morphology were investigated by X-ray diffraction (XRD), using $CuK{\alpha}$-radiation in the range of 2ce morphol$^{\circ}C$. The XRD patterns exhibit a well-formed cubic fluorite structure, and sharp lines of XRD peaks can be observed, which indicate a single solid solution. The morphology and size of the prepared particles were investigated by field-emission scanning electron microscopy (FE-SEM). The performance of the cells was evaluated over $500{\sim}800^{\circ}C$, using humidified hydrogen as fuel, and air as oxidant.

• Journal of Mechanical Science and Technology
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• 제15권5호
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• pp.630-638
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• 2001

The electrical resistivity of sinter dusts generated from the steel industry and coal fly ash from the coal power plant has been investigated using the high voltage conductivity cell based on JIS B 9915 as a function of temperature and water content. Dust characterization such as the chemical composition, size distribution, atomic concentration, and surface structure has been conducted. Major constituents of sinter dusts were Fe$_2$O$_3$(40∼74.5%), CaO (6.4∼8.2%), SiO$_2$(4.1∼6.0%), and unburned carbon (7.0∼14.7%), while the coal fly ash consisted of mainly SiO$_2$(51.4%), Al$_2$O$_3$(24.1%), and Fe$_2$O$_3$(10.5%). Size distributions of the sinter dusts were bi-modal in shape and the mass median diameters (MMD) were in the range of 24.7∼137㎛, whereas the coal fly ash also displayed bi-modal distribution and the MMD of the coal fly ash was 35.71㎛. Factors affecting resistivity of dusts were chemical composition, moisture content, particle size, gas temperature, and surface structure of dust. The resistivity of sinter dusts was so high as 10(sup)15 ohm$.$cm at 150$\^{C}$ that sinter dust would not precipitate well. The resistivity of the coal fly ash was measured 1012 ohm$.$cm at about 150$\^{C}$. Increased water contents of the ambient air lowered the dust resistivity because current conduction was more activated for absorption of water vapor on the surface layer of the dust.

• Carbon letters
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• 제14권2호
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• pp.105-109
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• 2013

Effects of the amount of nickel powder (Ni) in Ni-carbon fiber (CF) hybrid filler systems on the conductivity(or resistivity) and thermal coefficient of resistance (TCR) of filled high density polyethylene were studied. Increases of the resistivity and TCR with increasing Ni concentration at a given hybrid filler content were observed. Using the fiber contact model, we showed that the main role of Ni in the hybrid filler system is to decrease the interfiber contact resistance when Ni concentration is less than the threshold point. The formation of structural defects leading to reduced reinforcing effect resulted in both a reduction of strength and an increase of the coefficient of thermal expansion in the composite film; these changes are responsible for the increases of both resistivity and TCR with increasing Ni concentration in the hybrid filler system.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• 한국지구물리탐사학회:학술대회논문집
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• 한국지구물리탐사학회 2000년도 정기총회 및 특별심포지움
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• pp.19-40
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• 2000

본 연구에서는 해수에 의한 누수지점 파악을 위하여 방조제 4개소에 대해 단극배열 전기비저항탐사, SP탐사 및 SP 모니터링을 실시하였고, 해석 자료들을 조석변화와 비교한 결과 본 방법들이 방조제 누수지점 파악에 효과적임을 확인하였다. 저수지의 경우는 그라우팅 보강공사가 계획된 1개소에 대하여 그라우팅 보강 전후에 각 각 쌍극자배열 전기비저항 탐사와 SP탐사를 실시하여 누수구간에 대한 탐사기법 적용성 검토 및 그라우팅 효과를 비교한 결과 저수지의 경우에도 SP탐사의 적용성이 높음을 알 수 있었다. 방조제의 경우는 해수의 영향으로 안정된 전기비저항 값을 얻기 어려워, 단극배열을 이용하여 측정전위값을 크게 만들어 높은 SiN비를 확보한 결과 지하의 정보가 단순화되는 단점에도 불구하고 적용성이 높음을 확인하였고, 방조제 제체를 통한 누수에 의해 발생되는 유동전위를 대상으로 SP 모니터링을 실시한 결과와 조석변화를 비교한 결과, SP값의 변화가 조위 변화와 일치되어 나타나므로 SP탐사가 누수지점의 탐지뿐만 아니라 누수 추세를 밝히는데 효과적인 탐사법으로 판단된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.53-54
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• 2000

Measurements of the direct current resistivity, on multiwalled carbon nanotubes(MWNT) for field electron emitter source that had been screen printed in a thick film form were made as a function of temperature T in the range of 1.7K-390K. In this measuring temperature range, the electrical resistivity for the MWNT show that the main contribution to the conductivity comes form carries that hop directly between localized states executing variable range hopping processes. This thick-film form system for large area display showed a high bright light emission as well as very low turn-on field as like an individual MWNT system at room temperature. Furthermore, the electron emission characteristics followed well typical Fowler-Nordheim conduction under the vacuum.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.437-440
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• 1999

The objective of this study is to deposited the preparation of SrTiO$_3$dielectric thin films on Ag/barrier-mater/Si(N-type 100) bottom electrode using a conventional rf-magnetron sputtering technique with a ceramic target under various conditions. It is demonstrated that the leakage current of films are strongly dependent on the substrate temperature. The current-voltage characteristics are influenced by the Schottky effict. The resistivity properties of films deposited on silicon substrates were very high resistivity. Conduction mechanisms in the films was dependent on the substrate temperature range.