• Geophysics and Geophysical Exploration
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• v.6 no.2
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• pp.87-94
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• 2003

ULF geomagnetic field anomalies related to earthquakes have been reported and a mechnism that magnetic field variations could be generated by the induced telluric current due to the high frequency fluctuation of conductivity in a fault Bone have been proposed. In this study, we calculated electromagnetic anomalies using a simple fault model and investigated the possibility of significant perturbation. Since low frequency electromagnetic fields are modulated by the high frequency oscillation of conductivity and the modulated fields are concentrated in a narrow ULF band, the electromagnetic fields in ULF band could be perturbed significantly. The amplitude of electromagnetic field anomaly depends on various factors: the geometry and conductivity of fault zone, the magnitude and frequency of conductivity fluctuation, the resistivity structure of crust or mantle, the frequency bandwidth of observational data and so on. Therefore, it is strongly required to reveal the deep resistivity structure of crust a.: well ah the structure of fault zone and to ,select the optimal observation frequency band for the observation of electromagnetic activities related with earthquakes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.277-283
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• 2009

In this paper, aluminum doped zinc oxide (ZnO:Al) thin films on plastic substrate such as poly carbonate (PC), polyethylene terephthalate (PET) were prepared by RF magnetron sputtering method for flexible solar cell applications. Effects of the sputter pressure on the structural, electrical and optical properties were investigated. The crystallinity and the degree of the (002) orientation were deteriorated with increasing the sputter pressure. When the sputter pressure was higher, the conductivity of ZnO:Al films was improved because of the high carrier concentration and the Hall mobility. High quality ZnO:Al films with resistivity as low as $1.9{\times}10^{-3}{\Omega}-cm$ and the optical transmittance over 80 % in the visible region have been obtained on PC substrate at 2 mTorr.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.9
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• pp.1060-1067
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• 1988

In this paper, we have investigated the effects of rapid thermal process on the electrical and structural properties of silicon films. It was shown that required times and temperature for the successful activation of dopants (Boron, Phosphorus:5E15atoms/cm\ulcorner were above 1000\ulcorner, 10sec, respectively. The typical resistivities of films deposited below 600\ulcorner were in the range of 1.0 E-3ohm-cm which was 20-30% lower than that of initially polycrystalline silicon depositd above 600\ulcorner. After rapid thermal process at high temperature above 1000\ulcorner, the films did not reveal any change in resistivity due to the dopant segregation, and better electrical conductivity could be obtained by increasing the process time. The grain growth by RTA treatment was more salient in the case of the doped amorphous than that of initially polycrystalline. The surface of the films also preserved the higher structural perfection and surface smoothness.

• Journal of the Korean Ceramic Society
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• v.33 no.7
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• pp.735-742
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• 1996

Antimony-doped Tin oxide (ATO) thin films were deposited on soda-lime glass substrates by DC magnetron sputtering technique. Effects of DC power film thickness and post heat-treatment on electrical conductivity of ATO film were investigated. Other properties of ATO film such as optical anti-chemical and wear properties were also reported in this work. The obtained ATO films showed electrical resistivities ranging from 5$\times$10-3 $\Omega$cm to 3$\times$10-3 $\Omega$cm with the average optical transparency above 80% in visible wavelength range and excel-lent anti-chemical properties where the electrical resistivity was not changed even after soaking the films in 1M HCl or 1M NaOH solution for 10 days. These properties were found to be related to the crystallinity of ATO film and the films having higher crystallinity showed better properties.

• Journal of the Korean Ceramic Society
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• v.20 no.2
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• pp.161-165
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• 1983

We studied the dependence of electrical conduction mechanism of Cupric Oxide on temperature and measured the specific resistivity of sintered specimen from $600^{\circ}C$ to 90$0^{\circ}C$ . We considered the relations between electrical conducti-vityand temperature with reheating the sintered specimen. X-Ray diffraction patterns showed that lattice parameters of cupric oxide increased above 20$0^{\circ}C$. Cupric oxide had nostoichiometric compositions$(CuO_{1+x})$ owing to the excess oxygen and showed hole conduction with energy gap of 0.15eV below $650^{\circ}C$$\pm$1$0^{\circ}C$ Above $650^{\circ}C$$\pm$1$0^{\circ}C$ cupic oxide had the stoichiometric composition and showed electron-hole conduction owing to the intrinsic ionization with energy gap of 1.04V.

• Journal of the Korean institute of surface engineering
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• v.52 no.6
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• pp.289-292
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• 2019

Transparent and conducting titanium doped indium oxide (TIO) thin films were deposited by RF magnetron sputtering on zinc oxide (ZnO)-coated glass substrates to investigate the effect of the ZnO buffer layer on optical and electrical properties of TIO/ZnO bi-layered films. TIO 90 nm / ZnO 10 nm films having a lower resistivity (3.09×10^-3 Ωcm) and a higher visible transmittance (80.3%) than other TIO/ZnO films were prepared in this study. Figure of merit results indicate that a 10 nm thick ZnO thin film is an effective buffer layer that enhances optical transmittance and electrical conductivity of TIO films without intentional substrate heating or post-deposition annealing.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.27-31
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• 2017

AZO/Ag/AZO multi-layer films deposited on glass substrate by RF magnetron sputtering and thermal evaporator have a much better electrical properties than Al-doped ZnO thin films. The multi-layer structure consisted of three layers, AZO/Ag/AZO, the electrical and optical properties of AZO/Ag/AZO were changed mainly by thickness of Ag layers. The optimum thickness of Ag layers was determined to be $90{\AA}$ for high optical transmittance and good electrical conductivity. The Ag layers thickness $90{\AA}$ is an optical transmittance greater than 80% of visible light and the obtained multilayer thin film with the low resistivity of $8.05{\times}10-3{\Omega}cm$ and the low sheet resistance $5.331{\Omega}/sq$. Applying to TCO and Solar electrode will improve efficiency.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.