• Journal of Korea Ship Safrty Technology Authority
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• v.12
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• pp.36-43
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• 2003

Fatigue life estimation by the theoretical stress concentration factors are, in general, considerably different from test results. And in calculating stress concentration factor, it is very difficult to consider actual geometry and material property which are the notch shapes, imperfections or defects of materials such as porosities inclusions and casting defects, etc. Therefore, the paper deals with the experimental method to find out the more exact stress concentration factors by measuring the strain distributions on each specimen by 3D-ESPI(Electronic Speckle Pattern Interferometry) System. Then the fatigue lives are compared between theoretical calculations using stress concentration factors determined by 3D-ESPI system and fatigue test results

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.217-224
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• 2002

It is very important to measure and visualize the changes in the physical properties of fluid flow because this is the foundation of measurement techniques used in aerodynamics, heat transfer, plasma diagnostics, and stress analysis of transparent models. The optical methods are advantageous over probe-based techniques in the optical methods are of high speed, non-contact and are capable of providing full-field results with high spatial resolution. Therefore we propose the electronic speckle pattern interferometry(ESPI) that gives us a solution to overcome those limitations. In this paper the experimental results show qualitative and quantitative visualization of changes in the physical properties of the candle and alcohol lamp with 3D plotting. And we obtained the refractive index, mass density and temperature distribution of fluids. The results clearly show the process of flow phenomena and give the feasibility of quantitative interpretation of gasdynamics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.323-324
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• 2006

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.2
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• pp.81-86
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• 2005

This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.211-214
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• 2001

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively. In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.254-258
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• 2003

Electronic Speckle Pattern for quantitative evaluation of a impact defect inside of composite material plate are described. The impact on composite material makes inside delamination which is difficult to detect visual inspection and ultrasonic testing due to non-homeogenous structure. This paper proposes the quantitative evaluation technique of defects under real impact. Artificial defects are designed inside of composite plate for development of inspection technique and real defects under impact are inspected and compared with results of visual inspection.

• Proceedings of the Korean Reliability Society Conference
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• 2002.06a
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• pp.245-251
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• 2002

Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

• Journal of the Korean Society for Nondestructive Testing
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• v.14 no.2
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• pp.101-111
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• 1994

Electronic speckle pattern interferometry(ESPI) using a CW laser, a video system and an image processor were applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and it can be measured in-plane displacement without any contact and real time. In this experiment, specimen was loaded in paralled with a loa cell. The specimen was plance to which strain gauges was attached. The study provides an example of how ESPI have been used to measure displacement and strain distribution in this specimen. The results measured by ESPI were compared with the data which were measured by strain gauge method in tensile testing.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.69-74
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,00$0^{\circ}C$ . Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 80$0^{\circ}C$ . There needs to measure the data up to 80$0^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000'E In previous studies related to thermal strain analysis, the quantitative results have not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,00$0^{\circ}C$ and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1% blow $600^{\circ}C$ however, there is some difference up to $600^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 80$0^{\circ}C$ . The reason is the phase transformation of STS430 probably begins at 80$0^{\circ}C$