• Korean Journal of Materials Research
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• v.10 no.8
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• pp.551-557
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• 2000

Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.521-522
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• 2008

21세기를 접하면서 산업전자 분야의 비약적인 발전과 함께 과학문명은 눈부시게 발전해 나아가고 있다. 이것의 원천은 바로 전기(Electric)이다. 우리는 풍요로운 삶 자체를 전기 공급에서 누리고 있으며 또 비극적인 사태를 맞이할 때도 있다. 즉, 전기기기를 이용하면 원하건 원치 않건 전자기파가 발생이 된다 이것이 자연현상이며 전자기파는 IT, BT, CT를 비롯하여 산업 전체에 많은 영향을 미치고 있다. 일반적으로 우리가 말하는 전자기파 장해의 기본 요소는 노이즈원(잡음원), 경로매체, 피해장치 등으로 구성되는 데 잡음원(Noise Source)은 각종 시스템에서 구성되고 있는 전자기 에너지의 발생원으로 볼 수 있으며 이 발생원에서 경로매체(금속:전도성, 대기중:전파성 등)를 통하여 피해장치(전기전자통신기기류)에 방해를 주고 있는 상태를 전자기파 장해라고 설명할 수 있다. 전자기파 잡음원에서 경로를 거쳐 전자기파에 대하여 피해장치가 안정된 상태로 동작하도록 규정하는 용어 즉, 전자파 양립성 또는 적합성 (EMC : Electro Magnetic Compatibility))이란 용어를 가지고 전기 전자 통신기기에서 발생되는 불필요한 전자파와 전자파 내성시험을 만족하도록 의무화하고 있다. EMC 는 EMI (불요 전자파 또는 전자파 간섭 : Electro Magnetic Interference) + EMS (전자파 내성 : Electro Magnetic Susceptibility) 2가지 시험을 함께 전자파 적합성 (EMC) 시험으로 표현되고 있다. 전자파 적합성 시험의 목적으로 EMl는 전도성 또는 전파성에 대한 주파수 대역(잡음)을 보호하기 위한 것이 목적이고 EMS는 프로세서가 내장된 기기류의 오동작을 방지하기 위하여 감응평가를 하는 것이다. 즉, 감응(Susceptibility)이란 어떤 장비나 시스템이 전자기파 장해에 쉽게 영향을 받는 것을 뜻하는 데 전자파 장해를 견디면서 본래의 기능을 충분하게 발휘하며 동작할 수 있는 능력을 말한다.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Archives of Plastic Surgery
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• v.38 no.4
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• pp.501-504
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• 2011

Purpose: Epithelial-myoepithelial carcinoma (EMC) represents about the 1% of the malignant neoplasms in the salivary glands and clinically most commonly found localized, well defined and sometimes presents orofacial pain. Treatment of choice is surgical excision. Postoperative radiotherapy can be used when surgical margins are doubtful. We report our experience of EMC of the parotid gland. Methods: A 78-year-old man presented with a three-year history of a localized, painless, $7{\times}6cm$ sized recurred tumor in his right preauricular area. He was diagnosed as EMC of the right parotid gland. So a total parotidectomy was performed. In his old medical history, he had a mass in the same area 5 years ago. The diagnosis of pleomorphic adenoma was made and the mass excision was performed at the local clinic without further evaluation. Results: It was unable to visually discriminate between the tumor and the normal tissue. So a total parotidectomy was performed. The patient was got post-operative radiotherapy and was followed up for 9 months. There was no specific evidence of recurrence. Conclusion: We present a case of EMC of the parotid gland in right preauricular area, which is uncommon. So we report a uncommon case of EMC to discuss about our experience with relevant journal discussion.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of Environmental Impact Assessment
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• v.24 no.5
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• pp.407-419
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• 2015

The unit load of paddy field was estimated by several methods and compared in this study. Four year field study was conducted at the paddy fields located in Yeongsan river and Sumjin river basins. The unit load was estimated by four methods; (1) averaging field monitored load; (2) NIER (National Institute of Environmental Research) method which use EMC(Event Mean Concentration) and runoff ratio of rainfall groups with rainfall weighting factors; (3)method using EMC determined by best fit probability distribution; (4)method using arithmetic mean EMC and runoff ratio. The result of this study showed that the unit loads of water quality constituents by field monitoring was similar to those of NIER method whereas those by probability distribution(log-normal, gamma) method were less than unit loads of NIER method. The unit loads by arithmetic mean EMC and runoff ratio were larger than those by NIER method. The unit load by NIER method showed higher BOD, COD, SS, lesser T-N, and similar T-P values when compared to unit loads determined by MOE in 1995.

• Journal of Wetlands Research
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• v.11 no.2
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• pp.67-76
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• 2009

The contribution of pollutant loadings from non-point source (NPS) to the four major rivers in Korea exceeded 22~37 % of the total loadings in 2004 and is expected to reach 60 % in 2020. Most of NPS loadings are coming from urban areas, especially from paved areas. Because of high imperviousness rate, many types of NPS pollutant are accumulating on the surface during dry periods. The accumulated pollutants are wash-off during a storm and highly degrading the water quality of receiving water bodies. For this reason, the Korean Ministry of Environment (MOE) developed the Total Maximum Daily Load (TMDL) program to protect the water quality by managing the point source and NPS loadings. NPS has high uncertainties during a storm because of the characteristics of rainfall and watershed areas. The rainfall characteristics can affect on event mean concentrations (EMCs), mass loadings, flow rate, etc. Therefore, this research was performed to determine EMCs for rainfall ranges from transportation landuses such as road and parking lot. Two sites were monitored over 45 storm events during the 2006/06 through 2008/10 storm seasons. Mean TSS EMCs decrease as rainfall ranges increase and highest at less than 10mm rainfall. The results of this study can be used to determine the efficient scale of BMP facility considering specific rainfall range.

• Journal of the korean veterinary medical association
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• v.28 no.12
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• pp.726-735
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• 1992

For the pathologic study of experimental encephalomyocarditis(EMC) infection in piglets by the isolates EMC $K_3$ and $K_11$ isolated from Korea,12 piglets aged 35 days divided into three groups, each of which was infected with the t

• ETRI Journal
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• v.7 no.2
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• pp.49-58
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• 1985

본 고는 교환기에서 방출되는 전계 및 자계의 허용 규제치와 외부에서 들어오는 전계 및 자계에 대해 교환기가 얼마나 정상적인 동작을 할 수 있는가를 규정하고 있는 피방해 감도(EMC), 교환기에 의한 EMI 및 주변장치에서 발생하는 전자계의 규제에 대해 서술하고 이에 따른 측정 방법을 제시한다.