• Applied Chemistry for Engineering
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• v.10 no.8
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• pp.1175-1179
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• 1999

The rheological properties of highly filled epoxy molding compound(EMC) for semi-conductor encapsulants are greatly affected by the content of filler loaded. In this study, the change of viscosity of EMC for semi-conductor encapsulants with the filler content was investigated. Also, both of Cox-Merz and modified Cox-Merz equations were applied to convert the viscosity change as a function of frequency to that of shear rate. It was ovserved that shear thinning and yield stress occured at high filler contents and that the Cox-Merz equation could not be applied at high filler contents because of the difference of viscosity according to the various strains. When the modified Cox-Merz equation was applied, the all the curves having different strain tend to be represented by one master curve, even though some deviation was obseved at high filler content and strain.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.529-534
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• 2002

It was recommended for all ship engaged in international voyages to carry the dedicated Digital Selective Calling receiver, DSC equipment, VHF transceiver, etc according to Global Maritime Distress & Safety System. Also International Maritime Organization recommended for navigation and communication equipments to applicate the EMC regulations, therefore most of electronic equipments using in the vessel to be faced with problems to cope with new regulations. This study has applied and analyzed the EMC for an equipment integrated with Ch.70 dedicated DSC receiver, DSC equipment, VHF transceiver and groped for solutions to cope with. The test has applied the electromagnetic interference such as the measurement for unwanted emissions from conductive & radio emission and the electromagnetic susceptibility such as the immunity from voltage, frequency variation and electro static discharge, hence comes to be understand the problems related with the power and the earth.

• The Magazine of the IEIE
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• v.28 no.11
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• pp.79.2-80
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• 2001

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.1 s.53
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• pp.16-25
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• 2005

• Proceedings of the Korean Society of Laser Processing Conference
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• 2003.05a
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• pp.116-118
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• 2003

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.1
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• pp.15-27
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.2
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• pp.245-250
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• 2001

Since the most of malfunctions in the industrial equipment controlled by processors is occurred by the Electrical Fast Transient(EFT), the International Electrotechnical Commission(IEC) prepared the dummy signal to test the immunity level of the equipments. In this paper, we designed a new EMC fitter for power line in break-box, which consist of the feed-through capacitor and ferrite materials with high permeability, which was wound or inserted, in the second layer of the power cable in order to increase common mode inductance. We have obtained a excellent insertion loss characteristics over wide frequency band from 10 MHz up to 1.5 GHz. It is expected that the new EMC filter could be effectively used for industrial, MIL, and medical equipments to reduce a malfunctions and be suitable for IEC 61000-4-4.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.5
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• pp.437-443
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• 2003

A interference of outside electric source and electric fast transient(EFT) are origins of destroy and malfunction in the precise electrical and electronic equipments. It makes a serious obstacle as the form of conducted noise. Therefore, it is strongly needed to protect precision electrical and electronic equipments from the interference and EFT. In this research, a EMC filter composed of feed-through capacitors and ferrite beads of high permeability is designed and it＇s properties are investigated for PDP. The filter produced in this research have wide band frequency characteristics and more than 40 dB reflection loss in the frequence of 10 MHz∼1.5 GHz which satisfy the standard of CISPR Pub. 22 and the level 4 of IEC 61000-4-4.

• Proceedings of the Korea Water Resources Association Conference
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• 2009.05a
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• pp.1042-1046
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• 2009

강원도 홍천군 북방면 능평리에 위치한 규사광산을 2008년 3월부터 12월까지 발생한 강우사상에 대하여 모니터링을 실시하였다. 모니터링 지점은 채광작업과 가공작업이 이루어지는 계곡의 하류로 평시 $500m^2$/day의 유량이 흐르는 작은 소하천이다. 관측된 13회의 총 강우량은 712.6 mm가 발생하였다. 강우강도는 0.5 ${\sim}$ 4.7 mm/hr, 선행무강우일수는 1.2 ${\sim}$ 9.8일로 나타났다. 유출률은 28.0 $^{\sim}$ 98.0 %로 나타났으며, 유출율 98.0 %는 168.0 mm의 많은 양의 강우가 발생한 7월 24일부터 25일까지의 강우사상에서 발생하였다. 채석과 가공작업등의 영향으로 인하여 강우시 다른 오염 물질보다 SS 농도와 EMC가 매우 높고, 범위가 가장 큰 것으로 나타났다. 또한 SS는 강우량과 건기일수에 민감한 영향이 있는 것으로 나타났다. 따라서 규사광산지역은 다른 오염 물질보다 SS를 저감 시킬 수 있는 비점오염저감시설이 필요할 것으로 사료된다. 기상조건에 따른 오염부하와 EMC의 정확한 산정하기 위해서는 장기간의 모니터링을 통한 많은 자료의 수집이 동반되어야 할 필요가 있다. 본 연구에서 조사된 자료와 분석된 결과는 토지이용별 비점오염부하의 산정과 저감기술의 개발에 활용할 수 있으며, 수질오염총량제의 신뢰성을 향상시킬 것으로 판단된다.