• Title/Summary/Keyword: ELV

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Present Condition of End-of-Life Vehicles & SLF/ASR Recycling in Europe (EU의 ELVs & SLF/ASR 재활용 현황)

  • Baek, Sang-Ho;Jeon, Ho-Seok;Lee, Eun-Seon;Choi, Hee-Kyung;Kim, Jae-Geung
    • Resources Recycling
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    • v.23 no.4
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    • pp.58-68
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    • 2014
  • The statistics showed that about 1 billion automobiles were registered and about 40million ELVs occurred on the world in 2010. So all advanced countries including EU had plan to increase the ELVs recycling rate up to 95% of total by 2015. The Korean government also established a target for raising up to 95% of ELVs recycling rate according to 'Act on the Resource Circulation of Electrical and Electronic Equipment and Vehicles'. Before being satisfied with the requirement of recycling of ELVs however, the problem is issued on the scraps of plastic and non-ferrous metals which are now being abandoned and reclaimed with no adequate reuse. Therefore, as a part of preceding investigation on the present state of ELVs recycling in the world, this preliminary investigation study was carried out focusing on the state of EU's disposal and management regulations of ELVs and SLF/ASR including the world trend of disposal and management regulations of ELVs and SLF/ASR.

The Status of Recycling Technology of Hyundai and Kia

  • Park, Joon-Chul
    • Resources Recycling
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    • v.14 no.3
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    • pp.37-47
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    • 2005
  • Global automobile manufacturers have made a lot of efforts to comply European Union (EU) end-of-life vehicles (ELVs) Directive. Hyundai and Kia have also made a lot of studies to eco-friendly treat our ELVs. Some results of studies have already reflected on our models to produce eco-friendly vehicles. This paper introduces our status of the recycle technology and our measures to respond to EU ELVs Directive.

Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics (자동차 전장제품의 무연솔더 적용기술 및 솔더 접합부 열화거동)

  • Hong, Won Sik;Oh, Chul Min
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.22-30
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    • 2013
  • Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

A Study on Domestic Legislation Plan by Analysis of American Commercial Space Transport Laws (미국상업우주운송법 분석을 통한 국내상업우주운송법 제안)

  • Ahn, Hyo-Jung;Park, Jong-Hyuk
    • Journal of Aerospace System Engineering
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    • v.5 no.1
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    • pp.24-29
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    • 2011
  • The industry related to commercial space transport is growing rapidly as a futurity industry all over the world and America is leading them. If this trend continues, domestic individuals or private enterprises may plan for the commercial space transport business by adopting the advanced technology. Therefore it is necessary to make a law to control the business in our country for the industrial development and the growth related to commercial space transport. This paper provides outline for domestic commercial space transport law by the study and analysis of U.S. commercial space transport laws.

Application PDX to BOM of Auto Parts Manufacturers for Environmental Regulation Compliance (환경규제 준수를 위한 PDX 표준의 자동차 부품 업계 BOM 적용)

  • Lee, Jai-Kyung;Lee, Seung-Woo
    • Journal of the Korea Safety Management & Science
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    • v.12 no.2
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    • pp.133-138
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    • 2010
  • The environmental regulation of a product is a global trend. The environmental regulation directives such as RoHS, WEEE, ELV and REACH have impacted Korean export-oriented auto parts manufacturer and affects the export of the product to aboard. In electronics manufacture and auto parts manufacturer, there are different systems for environmental regulation compliance. Nowadays the automotive mechatronics parts in a car are increasing. The HEV and intelligent car will need more mechatronics parts. It is necessary to apply the environmental regulation system of electronics to the automotive parts. In this paper, we proposed the application of PDX standard used in electronic industry to the BOM of the auto parts manufactures and showed an example of generated BOM for selected auto part using PDX. The PDX-based BOM can be used for the recording of environmental substances of the automotive mechatronics part and help the collaboration across auto parts manufactures in accordance with environmental regulation.

Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics (자동차 전장을 위한 플렉시블 기판 무연 솔더 접합부 특성)

  • Ahn, Sungdo;Choi, Kyeonggon;Park, Dae Young;Jeong, Gyu-Won;Baek, Seungju;Ko, Yong-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.2
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    • pp.25-30
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    • 2018
  • Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

A Study on the Forecasting of the Number of End of Life Vehicles in Korea using Markov Chain (Markov Chain을 이용한 국내 폐차발생량 예측)

  • Lee, Eun-A;Choi, Hoe-Ryeon;Lee, Hong-Chul
    • Journal of Korean Institute of Industrial Engineers
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    • v.38 no.3
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    • pp.208-219
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    • 2012
  • As the number of end-of-life vehicles (ELVs) has kept increasing, the management of ELV has also become one of the academic research focuses and European Union recently adopted the directive on ELVs. For the stakeholders has become a principle agent of dealing with all about ELVs, it is relevant investment decision to set up and to decide high-cost ELVs entity locations and to forecast future ELVs' amount in advance. In this paper, transition probability matrixes between months are made by using Markov Chain and the number of ELVs is predicted with them. This study will perform a great role as a fundamental material in Korea where just started having interests about recycling resources and studies related to the topic. Moreover, the forecasting method developed for this research can be adopted for other enhancements in different but comparable situations.

Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation (고온동작소자의 패키징을 위한 천이액상확산접합 기술)

  • Jung, Do-hyun;Roh, Myung-hwan;Lee, Jun-hyeong;Kim, Kyung-heum;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.17-25
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    • 2017
  • Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

Disinfection of Total Coliforms in Sewage Treatment Effluent using Electron Beam (전자선을 이용한 하수처리장 방류수내 대장균군 살균)

  • Kim, Yuri;Han, Bumsoo;Kim, Jinkyu;Kang, Ho
    • Journal of Korean Society on Water Environment
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    • v.20 no.4
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    • pp.376-381
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    • 2004
  • The use of electron beam irradiation was investigated to disinfect total coliforms in the secondary sewage treatment effluent. Unchlorinated secondary effluent was irradiated at different dose of 0.2~1.0 kGy by 1 MeV, ELV-4 Model electron beam accelerator. It is interesting to note that a 100 % reduction in total coliforms and total colonies were achieved until a dose of approximately 0.8 kGy. Even at low dose of 0.2 kGy, the total coliforms and total colonies were successfully inactivated to the level of satisfying the new effluent discharge guideline. Besides disinfection of total coliforms, approximately a 50% removal in biochemical oxygen demand was pronounced at a dose of 0.2 kGy. More than 20 % removal in suspended solids and turbidity was also observed at a dose of 1.0 kGy. The application of electron beam irradiation appeared to be one of options to reuse sewage treatment effluent as agricultural or industrial water.

Life Cycle Assessment and Its Application (전과정 평가 기법과 활용)

  • Kim, Yong-Ki;Lee, Cheul-Kyu;Lee, Jae-Young
    • Proceedings of the KSR Conference
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    • 2009.05a
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    • pp.365-370
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    • 2009
  • LCA is a tool to support for making decisions by offering information of environmental aspects of products or services. It can be used to make decisions to consumers and NGOs as well as government and enterprises. LCA evaluates the environmental aspects throughout the entire life cycle of a product. Therefore it can quantify and assess environmental impacts from raw material acquisition, manufacturing, distribution, use and disposal to end of life and recycling. The demands of the recycling rate increase and the use of suitable materials for RoHS, REACH, WEEE, ELV which are linked trade with environmental regulation have increased the worldwide. Global warming is the critical challenge of the world facing. And under post-Kyoto protocol each country has to prepare for target reduction, so it became essential to save energy and resources. In addition that, the carbon mark has been run as the way of showing example of CO2 reduction in domestic and it will be extended gradually. And also through the introduction of Eco-label, environmentally-friendly product will be promoted. When those systems are operated, global warming gases (i.e. CO2) can be calculated throughout the entire life of the products by LCA. And the environmental impacts such as harmful material emission in the process of manufacturing, energy consumption, distribution and so on, can also be assessed. Therefore, The basic concepts of LCA technique and various cases and the practical application in the future will be review in this study.

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