• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.5
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• pp.1029-1034
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• 2012

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for US-PCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The maximum insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer module is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.8
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• pp.709-716
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• 2016

In this paper, A duplexer module with temperature-insensitive electrical characteristics was proposed for remote wireless communication system. Duplexer modules are required to have performances of low insertion loss, high isolation between transmitted band and received band, harmonic suppression as well as high power durability in the system for transmitting guided information to missile flying a free space on the ground. The proposed duplexer module are consist of transmission bandpass filter and receiving bandpass filter which are connected to common antenna port, planar coupler for output power monitoring and low pass filter for harmonic attenuation of power amplifier and coaxial cavity resonator. The material and dimensions of the resonator are determined for minimum frequency shift by temperature variation using 3D EM simulation. The measured results of the prototype showed a good agreement with the simulation results, and it should be well applied not only for guided weapon systems but also for any other communication systems such as remote radio head.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.382-385
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• 2001

In the previous study, a new LTCC material in the $PbWO_{4}-TiO_{2}-B_{2}O_{3}-CuO$ system was introduced. The developed material can be sintered at $850^{\circ}C$ and its dielectric properties are $\varepsilon_{r}=20-25$, $Q{\times}f_{o}=30000\sim50000GHz$, and $\tau_{f}=0.2{\sim}30ppm/^{\circ}C$, respectively. Therefore this material can be used as a LTCC substrate material for fabrication of multilayered high frequency communication module set. In present study, using this material, tape casting condition was established. With this condition, a multilayered resonator was fabricated and its electrical properties were examined. In present study, an antenna-duplexer module was also fabricated. Frequency characteristics of as-fabricated antenna-duplexer module was compared with simulation results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.382-385
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• 2001

In the previous study, a new LTCC material in the PbWO$_4$-TiO$_2$-B$_2$O$_3$-CuO system was introduced. The developed material can be sintered at 850$^{\circ}C$ and its dielectric properties are $\varepsilon$$\sub$r/=20-25, Qxf$\sub$o/=30000∼500000Hz, and $\tau$$\sub$f/=0.2∼30ppm/$^{\circ}C$, respectively Therefore this material can be used as a LTCC substrate material for fabrication of multilayered high frequency communication module set. In present study, using this material, tape casting condition was established. With this condition, a multilayered resonator was fabricated and its electrical properties were examined. In present study, an antenna-duplexer module was also fabricated. Frequency characteristics of as-fabricated antenna-duplexer module was compared with simulation results.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12A
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• pp.1932-1938
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• 1999

In this paper, planar duplexer module combined with power amplifier is described. This new scheme is to enhance power efficiency as well as to minimize the size of RF circuit in CDMA phone. Each filter which was a part of duplexer, was realized with planar type and rearranged into the power amplifier module on the multilayer board. Each electrical specifications of existing power amplifier and duplexer were satisfied. Especially, ACPR performances measured at output power of 24dBm which is 2dB lower than that of a conventional one, meet IS-95 for a power amplifier of CDMA phone. Overall current about 80mA has been successfully saved as a result of new scheme. In addition, the module size has been reduced to be as small as 1.08CC.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.7
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• pp.1156-1160
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• 2000

The cancellation loop configuration for power amplifier module is proposed to reject the RX signals using feed-forward technique. In this paper, we implement the 1W-ampilfier module of WLL band to show validity of the proposed cancellation loop. The power amplifier module with the proposed cancellation loop can provide low TX insertion path loss due to duplexer and choice of loose RX attenuation characteristic for various wireless communication systems. It shows at least 90 % improved RX rejection characteristic compared to power amplifier module without RX band cancellation loop.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• The Journal of Korean Institute of Communications and Information Sciences
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• v.23 no.6
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• pp.1602-1609
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• 1998

In this paper, the design and implementation of the novel RF front end circuit for CDMA based PCS phone is described. This novel scheme is realized by building the power amplifier module combined with duplexer. The dielectric filters which are parts of duplexer are broken up and relocated into the module. Electromagnetic analysis for via holes and coupling between narrow transmissio lines is icluded to design a circuit. The combined moule has been minimaturized to be as small as 1.5CC. It has satisfied IS-95 requirements for linearity performances of CDMA signal at 24-dBm output power as well as played apart as a duplexer. The operating current of about 95mA has been saved owing to both rearranging dielectric filters and limiting operating point to class-B by considering real working power range of CDMA phones.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2001.11a
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• pp.222-226
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• 2001

In this paper, 2.4GHz RF Module using Even Harmonic Mixer(EHM) was designed and fabricated for Direct conversion(DC) system. By minimizing performance degradation of DC system with DC offset and LO radiation, the capability of minimization and one chip solution in wireless system was proposed. The designed EHM using anti-parallel diode pair represented 9dB conversion loss and about -60dBm 2LO leakage radiation in RF port, and output reflection and reverse transmission characteristic of low noise amplifier was improved. So superior DC offset suppression characteristic is expected. RF Module which consists of EHM, LNA, RF amplifier, Frequency synthesizer and Duplexer was designed and fabricated.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.85-91
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• 2017

This paper concerns the design of a matching module system enabling the RF signal to be harmonized between the new base stations (RRH) and the repeater in the same frequency band of the asynchronous transfer network. This matching system controls the RF Gain Control of the module while monitoring the quality of the quality. Additionally, the RF environment has been adapted accordingly to adjust the RF Gain Control to match the receiver characteristics of the relay. As a result of this study, we improved the quality of the interface between the new base stations and existing relays.