• Title/Summary/Keyword: Dual process

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Characterization of the High Luminance Top Emission Organic Light-emitting Devices (TEOLEDs) Using Dual Cathode Layer (이중 음극층을 이용한 고휘도 전면발광(Top emission) 유기EL소자의 특성평가)

  • Kang, Yoon-Ho;Lee, Su-Hwan;Shin, Dong-Won;Kim, Sung-Jun;Kim, Dal-Ho;Lee, Gon-Sub;Park, Jea-Gun
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.3 s.16
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    • pp.23-27
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    • 2006
  • Recently, Top emission organic light-emitting diode (TEOLED) has been attracted by their potential application for the development of flat panel display (FPD). We have fabricated the high luminance top emission organic-emitting diode (TEOLED) using dual cathode layer and three top emitting structure. These devices were characterized by electroluminescence (EL) and current density-voltage (J-V) measurements. After compared it with Au anode structure, luminance of the device using dual anode was better than using without Al device. Consequently, Al layers are very good candidates for a promising electron-injecting buffer layer for top emission light-emitting diode (TEOLED).

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Characterization of Organic Light-Emitting Diode (OLED) with Dual Emission using Al:Au Cathode (Al:Au 음극층을 이용한 양면발광(dual emission) 유기 EL 소자의 Al 두께별 특성 평가)

  • Lee, Su-Hwan;Kim, Dal-Ho;Yang, Hee-Doo;Kim, Ji-Heon;Lee, Gon-Sub;Park, Jea-Gun
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.1
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    • pp.47-51
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    • 2008
  • The Al:Au double-layer metal electrode for use in transparent, dual emission of organic light-emitting diode (OLED) was fabricated. The electrode of Al:Au metals with various thicknesses was deposited by the vacuum thermal evaporation technique. For Al thickness of 1 nm, a bottom luminance of $4880\;cd/m^2$ was observed at 8 V. Otherwise, top luminance of $2020\;cd/m^2$ were observed at 8 V. In addition, the threshold voltages of the electrodes were 2.2 V. It was forward that the inserting 1 nm Al between LiF and Au enhanced electron injection with tunneling effect.

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A Study on the 0.5$\mu\textrm{m}$ Dual Gate High Voltage Process for Multi Operation Applications (Multi Operation을 위한 0.5$\mu\textrm{m}$Dual Gate 고전압 공정에 관한 연구)

  • 송한정;김진수;곽계달
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.463-466
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    • 2000
  • According to the development of the semiconductor micro device technology, IC chip trends the high integrated, low power tendency. Nowadays, it can be showed the tendency of single chip in system level. But in the system level, IC operates by multi power supply voltages. So, semiconductor process is necessary for these multi power operation. Therefore, in this paper, dual gate high voltage device that operate by multi power supply of 5V and 20V fabricated in the 0.5${\mu}{\textrm}{m}$ CMOS process technology and its electrical characteristics were analyzed. The result showed that the characteristics of the 5V device almost met with the SPICE simulation, the SPICE parameters are the same as the single 5V device process. And the characteristics of 20V device showed that gate length 3um device was available without degradation. Its current was 520uA/um, 350uA/um for NMOS, PMOS and the breakdown voltages were 25V, 28V.

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Experimental Study on Air Flow Characteristics of Axial Dual-blade Fan (축류형 이중 블레이드 팬의 공기 유동 특성에 관한 실험적 연구)

  • Kim, Hae-Ji;Lee, Yong-Min
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.4
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    • pp.113-120
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    • 2014
  • To ventilate indoor spaces, axial single-blade fans are widely used in various areas, such as schools, houses, offices, and restaurants. Recently, axial single-blade fans were developed to realize energy efficiency and noise reduction improvements. Here, an experimental study of the air flow characteristics of an axial dual-blade fan is conducted. The characteristics of the axial dual-blade fan were tested via an air flow analysis and with prototypes. For the performance of the fan, the flow rate, power consumption, and noise were evaluated. The result showed that the axial dual-blade fan uses less power and produces less noise in comparison with an axial single-blade fan.

A 0.5-2.0 GHz Dual-Loop SAR-controlled Duty-Cycle Corrector Using a Mixed Search Algorithm

  • Han, Sangwoo;Kim, Jongsun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.2
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    • pp.152-156
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    • 2013
  • This paper presents a fast-lock dual-loop successive approximation register-controlled duty-cycle corrector (SARDCC) circuit using a mixed (binary+sequential) search algorithm. A wider duty-cycle correction range, higher operating frequency, and higher duty-cycle correction accuracy have been achieved by utilizing the dual-loop architecture and the binary search SAR that achieves the fast duty-cycle correcting property. By transforming the binary search SAR into a sequential search counter after the first DCC lock-in, the proposed dual-loop SARDCC keeps the closed-loop characteristic and tracks variations in process, voltage, and temperature (PVT). The measured duty cycle error is less than ${\pm}0.86%$ for a wide input duty-cycle range of 15-85 % over a wide frequency range of 0.5-2.0 GHz. The proposed dual-loop SARDCC is fabricated in a 0.18-${\mu}m$, 1.8-V CMOS process and occupies an active area of $0.075mm^2$.

Patch Integrity Verification Method Using Dual Electronic Signatures

  • Kim, JunHee;Won, Yoojae
    • Journal of Information Processing Systems
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    • v.13 no.6
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    • pp.1516-1526
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    • 2017
  • Many organizations today use patch management systems to uniformly manage software vulnerabilities. However, the patch management system does not guarantee the integrity of the patch in the process of providing the patch to the client. In this paper, we propose a method to guarantee patch integrity through dual electronic signatures. The dual electronic signatures are performed by the primary distribution server with the first digital signature and the secondary distribution server with the second digital signature. The dual electronic signature ensures ensure that there is no forgery or falsification in the patch transmission process, so that the client can verify that the patch provided is a normal patch. The dual electronic signatures can enhance the security of the patch management system, providing a secure environment for clients.

A study on the control system with dual structure to enhance its reliability (제어 시스템의 신뢰도 향상을 위한 이중화 구조 연구)

  • 박세화;문봉채;김병국;변증남
    • 제어로봇시스템학회:학술대회논문집
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    • 1990.10a
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    • pp.773-778
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    • 1990
  • In this paper, a reliable control system structured with dual CPU modules and dual I/O modules is implemented as a means of achieving a highly reliable fault tolerant control system. For this, faults in the system modules are first examined, and a fault detection technique consisting of self diagnostic, comparison process, and exception processing is applied. Also reliability analysis is conducted for the discrete time Markov model with dual structure. It is shown quantitatively that the reliability is improved in the control system with dual structure in comparison with a system with single module structure.

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The Optimal Composing the Filter-Bed for Coping with Daily Flow-Rate Fluctuation for the Performance of Sand Filtration Process (일유량 변동에 따른 여과수질 악화에 대처하기 위한 최적 여재구성에 관한 연구)

  • Park, Dong-Hak;Park, No-Suk;Kim, Seong-Su;Bae, Cheol-Ho;Jung, Nahm-Chung;Cjoi, Seung-II
    • Journal of Korean Society of Water and Wastewater
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    • v.21 no.4
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    • pp.485-491
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    • 2007
  • The fluctuation of inlet flow to a water treatment plant makes a serious problem that it can change the filtration rate abruptly, and ultimately occur the breakthrough of the detained particles inside filter media. Also, since it takes very short time (about 10 minutes) for the surface wave occurred from the fluctuation of inlet flow to reach the filtration process, it is impossible to control the filtration rate stably. Therefore, this study was conducted to evaluate the effect of daily flow-rate fluctuation on the performance of sand filtration process, and to suggest the dual media composition for coping with that effect. Comparative column tests have been carried out for various dual media (sand and anthracite) compositions. From the results of column tests, dual media, especially in the case of sand 45cm/anthracite 30cm, is more effective to cope with the effect of flow-rate fluctuation on the performance of filtration than single media (only sand). In addition, irrespective of dual media composition, managing ability to cope with that fluctuation tends to be weak at the end of allowable filtration duration time,

A Study on the Optimization for a V-groove GMA Welding Process Using a Dual Response Method (듀얼 반응표면법을 이용한 V-그루브 GMA 용접공정 최적화에 관한 연구)

  • Park, Hyoung-Jin;Ahn, Seung-Ho;Kang, Mun-Jin;Rhee, Se-Hun
    • Journal of Welding and Joining
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    • v.26 no.2
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    • pp.85-91
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    • 2008
  • In general, the quality of a welding process tends to vary with depending on the work environment or external disturbances. Hence, in order to achieve the desirable quality of welding, we should have the optimal welding condition that is not significantly affected by these changes in the environment or external disturbances. In this study, we used a dual response surface method in consideration of both the mean output variables and the standard deviation in order to optimize the V-groove arc welding process. The input variables for GMA welding process with the dual response surface are welding voltage, welding current and welding speed. The output variables are the welding quality function using the shape factor of bead geometry. First, we performed welding experiment on the interested area according to the central composite design. From the results obtained, we derived the regression model on the mean and standard deviation between the input and output variables of the welding process and then obtained the dual response surface. Finally, using the grid search method, we obtained the input variables that minimize the object function which led to the optimal V-groove arc welding process.

A dual-link CC-NUMA System Tolerant to the Multiprogramming Environment (다중 프로그램 환경에 적합한 이중 연결 CC-NUMA 시스템)

  • Suh, Hyo-Joong
    • The KIPS Transactions:PartA
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    • v.11A no.3
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    • pp.199-206
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    • 2004
  • Under the multiprogrammed situation, the performance of multiprocessor system is affected by the process allocation policy of the operating systems. The lowest communication cost can be achieved when the related processes positioned to the adjacent processors. While the effective allocation is quite difficult to the real situation, and the processing of the allocation policy consumes some computation time. The dual-ring CC-NUMA systems exhibit a quite performance difference according to the process a1location policy due to a lot of unbalanced memory transactions on the interconnection networks. In this paper, I propose a load balanced dual-link CC-NUMA system that does not requires the processes allocation policy. By the program-driven simulation results. the proposed system shows no remarkable difference according to the allocation policy while the dual-ring systems shows 10% performance improvement by the process allocation. In addition, the proposed system outperforms the dual~ring systems about 1.5 times.