• Title/Summary/Keyword: Dual process

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A Dual-Level Model of Team Decision Making (팀 의사결정에 대한 이원적 단계 모델)

  • Kang, Min-Cheol
    • Asia pacific journal of information systems
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    • v.14 no.2
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    • pp.37-59
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    • 2004
  • Team decision making is a collective behavior that needs to be understood by considering properties belonging to team and individual member domains together. This paper introduces a conceptual model called "Dual-Level(DL)" model that describes a team decision-making process in terms of team level, member level, and the relationship between them. The team-level view explains the decision-making process by considering the team as a wholeand divides the process into three stages: Problem Conceptualization, Alternative Generation, and Selection. The member-level view describes what happens to individual members when they go through the group process and splits it into the five phases: Individual Cognitive Mapping, Problem Decomposition, Subproblem Session, Subproblem Integration, and Team Decision. The DL model works as a theoretical framework to explore team decision making by using a set of computational models of team design and team members. In practice, the conceptual framework is used to build a computational model of decision making team, called "Team-Soar."

A Study of Semiconductor Process Control using Dual Damping EWMA (Dual Damping EWMA를 이용한 효율적인 반도체 공정 제어에 관한 연구)

  • Kim, Seon-Eok;Ko, Hyo-Heon;Kim, Jih-Yun;Kim, Sung-Shick
    • IE interfaces
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    • v.21 no.2
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    • pp.141-150
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    • 2008
  • In this paper, an efficient control method for semiconductor fabrication process is presented. Generally, control is performed with data which is under the influence of process disturbance. EWMA is one of the most popular control methods in semiconductor fabrication that effectively deals with varying process condition. A new method using EWMA, called the Dual Damping EWMA, is presented in this study to reduce over-control by separating weight factor of input and output. The goal is to reflect Drift but reduce the effects of White noise in run to run control. Simulation is performed to evaluate the performance of DPEWMA and to compare with EWMA and Double EWMA.

A Study on Dual Response Approach Combining Neural Network and Genetic Algorithm (인공신경망과 유전알고리즘 기반의 쌍대반응표면분석에 관한 연구)

  • Arungpadang, Tritiya R.;Kim, Young Jin
    • Journal of Korean Institute of Industrial Engineers
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    • v.39 no.5
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    • pp.361-366
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    • 2013
  • Prediction of process parameters is very important in parameter design. If predictions are fairly accurate, the quality improvement process will be useful to save time and reduce cost. The concept of dual response approach based on response surface methodology has widely been investigated. Dual response approach may take advantages of optimization modeling for finding optimum setting of input factor by separately modeling mean and variance responses. This study proposes an alternative dual response approach based on machine learning techniques instead of statistical analysis tools. A hybrid neural network-genetic algorithm has been proposed for the purpose of parameter design. A neural network is first constructed to model the relationship between responses and input factors. Mean and variance responses correspond to output nodes while input factors are used for input nodes. Using empirical process data, process parameters can be predicted without performing real experimentations. A genetic algorithm is then applied to find the optimum settings of input factors, where the neural network is used to evaluate the mean and variance response. A drug formulation example from pharmaceutical industry has been studied to demonstrate the procedures and applicability of the proposed approach.

Development of Hot and Cold Forging Process for Manufacturing a Hub of Dual Clutch Transmission (변속기용 허브 부품 제조를 위한 열간 및 냉간 복합단조 공정 개발)

  • Jo, A.R.;Jeong, M.S.;Lee, S.K.;Cho, Y.J.;Hwang, S.K.
    • Transactions of Materials Processing
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    • v.28 no.6
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    • pp.321-327
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    • 2019
  • In this study, a hot and cold forging process was investigated to produce a complex-shaped hub of dual clutch transmission with low material loss and high productivity. The process was designed by the commercial finite element (FE) analysis program, DEFORM-2D (hot forging) and 3D (cold forging). And, the material flow and ductile fracture characteristics were studied to check the surface crack initiation of the specimen. The simulation results indicated that the proposed process could manufacture the complex-shaped hub with no surface crack and high-efficiency compared to the conventional machining process. For verification the numerical results, the hub of the SCM440 was fabricated by the proposed process and the mechanical properties and microstructure evolution were studied. It was demonstrated that the suggested hot and cold forging process might be useful in producing the key components of the automobile industry as a high-efficiency and environmentally friendly process.

A Study on the Performance Analysis of the Dual-arm Robot for the Assembly Task (조립 공정에서 양팔 로봇의 구조에 따른 작업성 평가 방법 연구)

  • Kim, Gi-Hoon;Park, Dong Il;Park, Jong-Woo;Kim, Hwi-Su;Cho, Youngsoo;Jung, Won-suk
    • The Journal of Korea Robotics Society
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    • v.17 no.2
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    • pp.164-171
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    • 2022
  • Recently, interest of a dual arm robot which can replace humans is increasing in order to improve the working environment and solve the labor shortage. Various studies related with design and analysis of dual-arm robots have been conducted because dual arm robots can have various kinematic configurations according to the objective task. It is necessary to evaluate the work performance according to various kinematic structures of the dual arm robot to maximize its effectiveness. In the paper, the performance analysis is studied according to the shoulder configuration and the wrist configuration of the dual-arm robot by using main performance indices such as manipulability, condition number, and minimum singular value by assigning proper weight values to each objective motion. Performance analysis for the robotic assembly process is effectively carried out for each representative dual arm robot configuration.

Characteristics of Electric Resistance Dual Spot Welding Process of AZ31 Magnesium Alloy Sheets (AZ31 마그네슘 합금 판재의 전기저항 이중 스폿용접 특성)

  • Sun, Xiao-Guang;Jin, In-Tai
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.3
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    • pp.1-11
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    • 2022
  • In this study, an electric resistance dual-spot welding process using a copper electrode inserted in a heating electrode is suggested for the spot welding of AZ31 magnesium sheets. This spot-welding process involves two heating methods for welding at the interfacial zone between the magnesium sheets, one of which is the heating method by thermal conduction from the heating electrode heated by the welding current induced to the steel electrode, and the other heating method uses the electric resistance between the contacted surfaces of the two sheets by the welding current induced to the copper electrode. This welding process includes the welding variables, such as the current induced in the heating electrode and the copper electrode, and the outer diameters of the heating electrode. This is because the heat conducted from the heating electrode can be maintained at a higher temperature in the welding zone, which has a slow cooling effect on the nugget of the melted metal after the welding step. The pressure exerted during the pressing of the magnesium sheets by the heating electrode can be increased around the nugget zone at the spot-welding zone. Thus, it not only reduces the warping effect of the elastoplastic deformation of sheets, but also the corona bond can make it less prone to cracking at the welded zone, thereby reducing the number of nuggets expelled out of the corona bond. In conclusion, it was known that an electric resistance dual spot welding process using the copper electrode inserted in the heating electrode can improve the welding properties in the electric resistance spot welding process of AZ31 magnesium sheets.

Development of Wear Equation according to Friction Coefficient and Temperature using a Dual Leaf-Spring in the Sliding Test (판스프링을 사용한 마모실험에서 마찰계수와 마찰온도를 고려한 마모식의 개선)

  • Kim, Jung-Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.5 no.1
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    • pp.19-26
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    • 2006
  • The wear behavior as the hardness of the sliding elements on the dry wear has been investigated using a dual leaf-spring. The materials of the specimens are used as ten kinds along their hardness. In this study, both upper and lower specimens have been used the same materials. Using experimental data, we figured the relationship between wear coefficient and friction coefficient, and the relationship between wear coefficient and friction temperature. Also we combined friction temperature and friction coefficient instead of wear coefficient. We substituted this into wear equation of Archard. The result had been derived a newly wear equation in using dual leaf-spring wear system.

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Flow Characteristics of Dual Impinging Jets using PIV (PIV를 이용한 이중 충돌제트의 유동 특성)

  • Kim, Dong-Keon;Kwon, Soon-Hong;Chung, Sung-Won;Park, Jong-Min;Choi, Won-Sik;Kim, Jong-Soon;Kwon, Soon-Goo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.6
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    • pp.102-108
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    • 2011
  • The flow characteristics of unventilated dual impinging jets were experimentally investigated. Two nozzles with an aspect ratio of 20 were separated by 6 nozzle widths. The Reynolds number based on nozzle width and nozzle exit velocity was set to 5,000. A Particle Image Velocimetry (PIV) was used to measure turbulent velocity components. It was found that, when an impingement plate was installed in the converging region, there was a stagnation region in the inner area between nozzles. However, when it was installed in the combined region, both jets were merged and collided into the plate, showing single-jet characteristics. In addition, at a dual impinging jet, as the distance between a nozzle and an impingement plate decreased, the spanwise turbulent intensity at the plate increased.

Application of Method of Moving Asymptotes for Non-Linear Structures (비선형 구조물에 대한 이동 점근법(MMA)의 적용)

  • 진경욱;한석영;최동훈
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.05a
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    • pp.141-146
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    • 1999
  • A new method, so called MMA(Method of Moving Asymptotes) was applied to the optimization problems of non-linear functions and non-linear structures. In each step of the iterative process, tile MMA generates a strictly convex approximation subproblems and solves them by using the dual problems. The generation of these subproblems is controlled by so called 'moving asymptotes', which may both make no oscillation and speed up tile convergence rate of optimization process. By contrast in generalized dual function, the generated function by MMA is always explicit type. Both the objective and behaviour constraints which were approximated are optimized by dual function. As the results of some examples, it was found that this method is very effective to obtain the global solution for problems with many local solutions. Also it was found that MMA is a very effective approximate method using the original function and its 1st derivatives.

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Cu Plating Thickness Optimization by Bottom-up Gap-fill Mechanism in Dual Damascene Process (Dual Damascene 공정에서 Bottom-up Gap-fill 메커니즘을 이용한 Cu Plating 두께 최적화)

  • Yoo, Hae-Young;Kim, Nam-Hoon;Kim, Sang-Yong;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.93-94
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    • 2005
  • Cu metallization using electrochemical plating(ECP) has played an important role in back end of line(BEOL) interconnect formation. In this work, we studied the optimized copper thickness using Bottom-up Gap-fill in Cu ECP, which is closely related with the pattern dependencies in Cu ECP and Cu dual damascene process at 0.13 ${\mu}m$ technology node. In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge, Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness.

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