• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.201-208
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• 2004

In this study a general Galerkin FE lubrication analysis method was utilized to analyze the complex lubrication performance of a spiral groove seal having an additional inner circular groove, which was designed for a chemical process mixer operating at a low speed of the maximum 500 rpm. Equilibrium seal clearance analyses under varying outer pressure revealed that the seal maintains a certain levitation seal clearance under the outer pressure of more than about 1.5 bar, regardless of a rotating speed. Also, under the normal outer pressure of 11 bar, the axial stiffness of the seal was predicted to have a high value of more than 7.0e+07 N/m, regardless of a rotating speed and thereby, the seal is expected to maintain a stable thickness of lubrication film under a certain external excitation acting.

• Journal of the Korean Ceramic Society
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• v.27 no.1
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• pp.79-85
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• 1990

A study on the oxidation of SiO2 sensing layer was done at 950, 1000, 105$0^{\circ}C$ under dry O2 atmosphere. The rate determining step around the oxide layer thickness, 1000$\AA$ was different with the oxidation temperature, as follows ; ⅰ) linear growth at 95$0^{\circ}C$ and ⅱ) parabolic growth at 100$0^{\circ}C$ and 105$0^{\circ}C$. The flatness of SiO2 film was observed within $\pm$1% and surface state charge density was reduced by annealing in N2 atmosphere. Finally, pH sensitivity of SiO2 film, in the range of pH 3-9, was 20mV/pH.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.139-141
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• 2007

Thin films of polyimide (Pl) were fabricated by a vapor deposition polymerization method (VDPM) and studied for the photosensitive characteristic. Polyamic acid (PAA) thin films fabricated by vapor deposition polymerization (VDP) from 6FDA and 4-4' DDE were converted to PI thin films by thermal curing. From AFM and Ellipsometer experimental, the films thickness was decreased and the reflectance was increased as the curing temperature was increased. Those results implies that thin film is uniform. From UV-Vis spectra, PI thin films showed high absorbance in 225 $\sim$ 260 [nm] region.

• Nuclear Engineering and Technology
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• v.56 no.1
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• pp.317-327
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• 2024

This study investigated the chloride-induced stress corrosion cracking (CISCC) behavior expected to occur in welds of austenitic stainless steel, which are considered candidate materials for dry storage containers for spent nuclear fuel. The behavior was studied by varying temperature, relative humidity (RH), and chloride concentration. 304L-ER308L welded plates were processed into U-bend specimens and exposed to a cyclic corrosion chamber for 12 weeks. The CISCC behavior was then analyzed using electron microscopy. A previous study by the authors confirmed that CISCC occurred in ER308L at 60 ℃, 30% RH, and 0.6 M NaCl via selective corrosion of δ-ferrite. When the temperature was lowered from 60 ℃ to 50 ℃, CISCC still occurred. However, when the humidity was reduced to 20% RH, CISCC did not happen. This can be attributed to the retardation of the deliquescence of NaCl at lower humidity, which was insufficient to promote CISCC. Furthermore, increased chloride concentration to 1.0 M resulted in the absence of CISCC and widespread surface corrosion with severe pitting corrosion because of the increase in thin film thickness.

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.6
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• pp.1175-1180
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• 2022

STI has been studied a lot as a process technology for wide area planarization according to miniaturization and high integration of semiconductor devices. In this study, as methods for improving the STI profile, wet etching of pad oxide using hydrofluorine solution and dry etching of O₂+CF₄ after STI dry etching were proposed. This process technology showed improvement in profile imbalance and leakage current between patterns according to device density compared to the conventional method. In addition, as a result of measuring the HLD thickness after CMP for a device having the same STI depth and HLD deposition, the measured value was different depending on the device density. It was confirmed that this was due to the difference in the thickness of the nitride film according to the device density after CMP and the selectivity of the slurry.

• Tribology and Lubricants
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• v.31 no.3
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• pp.109-124
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• 2015

This paper presents a wear analysis procedure for the journal bearings on a stripped-down single-cylinder engine during start-up and coast-down by motoring. A journal bearing is in the mixed elastohydrodynamic (EHL) lubrication region when the shaft speed is less than the corresponding lift-off speed. Below the lift-off speed, a wear scar can form on bearing surfaces. In part 1 of this paper, we develop the appropriate formulations and the calculation procedure for the analysis. Specifically, we formulate an equation for modified film thickness in a journal bearing considering the additional wear volume. In order to obtain the modified specific wear rate induced by the modified Archard’s wear coefficient, we utilized the extended non-dimensional diagram for the specific wear rate, k, the fractional film defect coefficient, Ψ and the asperity load sharing factor, γ₂. This asperity load sharing factor is newly calculated by setting the Zhao-Maietta-Chang (ZMC) asperity contact pressure equation coupled with the central film thickness equation derived by using the ZMC asperity contact model equal to the modified central contact pressure derived by using the central (or maximum) contact pressure at the dry rough line-contact configuration. We can use the procedure introduced in this paper to determine the lifetime (or longterm) linear wear in radial journal bearings that is a result of repeated stop-start cycles.

• Textile Coloration and Finishing
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• v.35 no.4
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• pp.196-205
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• 2023

Water-dispersed pigment is on-going study for without air pollution in the textile and print industry. Primer treatment is essential for the substrate to improve the printing quality of eco-friendly water-dispersed pigment ink. Otherwise in the case of untreated primer, the water-dispersed pigment ink will dry onto the surface and cause defective images. This study was conducted on film substrate coating (primer) to fix eco-friendly water-dispersed pigment ink on film substrate. The drying, bleeding, and color strength of the pigment ink were examined depending on the composition and mixing ratio of the coating solution. The mixing ratio of silica gel in the coating film is increased to 0, 0.5, 1, 2 and 3 and results that DK-1-3 of silica gel ratio of 1 showed the lowest bleeding such as 52%, the letter thickness of 0.76mm and DK-1-5 of SG ratio of 3 showed the highest bleeding such as 304%, the letter thickness of 2.02mm. The mixing ratio of SPA in the coating film is increased to 2.5, 5, 7.5, SPA ratio of 7.5 has a bleeding ratio of 9% and letter thickness of 0.544mm. It showed the closest value to 0.5mm. According to the result, the optimal mixing ratio of binder, polymer coagulant, silica gel is 100:7.5:1.

• Journal of the Korean Vacuum Society
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• v.22 no.3
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• pp.131-137
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• 2013

The thin insulator films for organic memory device were made by the plasma polymerization method using the styrene monomer which was not the wet process but the dry process. For the formation of stable plasma, we make an effort for controlling the monomer with bubbler and circulator system. The thickness of plasma polymerized styrene insulator layer was 430 nm, the thickness of the Au memory layer was 7 nm thickness of plasma polymerized styrene tunneling layer was 30, 60 nm, the thickness of pentacene active layer was 40 nm, the thickness of source and drain electrodes were 50 nm. The I-V characteristics of fabricated memory device got the hysteresis voltage of 45 V at 40/-40 V double sweep measuring conditions. If it compared with the results of previous paper which was the organic memory with the plasma polymerized MMA insulation thin film, this result was greater than 18 V, the improving ratio is 60%. From the paper, styrene indicated a good charge trapping characteristics better than MMA. In the future, we expect to make the organic memory device with plasma polymerized styrene as the memory thin film.

• Journal of the Korean Vacuum Society
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• v.21 no.6
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• pp.354-361
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• 2012

The organic memory device was made by the plasma polymerization method which was not the dry process but the wet process. The memory device consist of the styrene and MMA monomer as the insulating layer, MMA monomer as the tunneling layer and Au thin film as the memory layer which was fabricated by thermal evaporation method. The I-V characteristics of fabricated memory device got the hysteresis voltage of 27 V at 40/-40 V double sweep measuring conditions. At this time, the optimized structure was 7 nm of Au thin film as floating gate, 400 nm of styrene thin film as insulating layer and 30 nm of MMA thin film as tunneling layer. Therefore we got the charge trapping characteristics by the hysteresis voltage. From the paper, styrene indicated a good charge trapping characteristics better than MMA. In the future, we expect to make devices by using styrene thin film rather than Au thin film.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.7
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• pp.17-25
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• 2017

To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.