Browse > Article
http://dx.doi.org/10.5757/JKVS.2012.21.6.354

Floating Gate Organic Memory Device with Tunneling Layer's Thickness  

Kim, H.S. (Electrical Engineering, Inha University)
Lee, B.J. (Electronic Engineering, Namseoul University)
Shin, P.K. (Electrical Engineering, Inha University)
Publication Information
Journal of the Korean Vacuum Society / v.21, no.6, 2012 , pp. 354-361 More about this Journal
Abstract
The organic memory device was made by the plasma polymerization method which was not the dry process but the wet process. The memory device consist of the styrene and MMA monomer as the insulating layer, MMA monomer as the tunneling layer and Au thin film as the memory layer which was fabricated by thermal evaporation method. The I-V characteristics of fabricated memory device got the hysteresis voltage of 27 V at 40/-40 V double sweep measuring conditions. At this time, the optimized structure was 7 nm of Au thin film as floating gate, 400 nm of styrene thin film as insulating layer and 30 nm of MMA thin film as tunneling layer. Therefore we got the charge trapping characteristics by the hysteresis voltage. From the paper, styrene indicated a good charge trapping characteristics better than MMA. In the future, we expect to make devices by using styrene thin film rather than Au thin film.
Keywords
Plasma ploymerization; Styrene; Organic memory; Floating gate;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 T.-W. Kim, Y. Gao, O. Acton, H.-L. Yip, H. Ma, H. Chen, and A. K.-Y Jen, Appl. Phys. Lett. 97, 023310 (2010).   DOI   ScienceOn
2 S.-J. Kim, Y-S. Park, S.-H. Lyu, and J.-S. Lee, Appl. Phys. Lett. 96, 033302 (2010).   DOI
3 S.-J. Kim and J.-S. Lee, Nano Lett. 10, 2884 (2010).   DOI
4 Q.-D. Ling, D.-J. Liaw, C. Zhu, D. S.-H. Chan, E.-T. Kang, and K.-G. Neoh, Prog. Polym. Sci. 33, 917 (2008).   DOI   ScienceOn
5 C.-Y. Lu, K.-Y. Hsieh, and R. Liu, Microelectron. Eng. 86, 283 (2007).
6 P. Pavan, R. Bez, P Olivo, and E. Zanoni, Proc. IEEE 85, 1248 (1997).   DOI   ScienceOn
7 H. Sirringhaus, Adv. Mater. 17, 2411 (2005).   DOI   ScienceOn
8 Y.-S. Park, S. Chung, S.-J. Kim, S.-H. Lyu, J.-W. Jang, S.-K. Kwon, Y. Hong, and J.-S. Lee, Appl. Phys. Lett. 96, 213107 (2010).   DOI
9 J. Ouyang, C.-W. Chu, C. R. Szmanda, L. Ma, and Y. Yang, Nature Mater. 3, 918 (2004).   DOI   ScienceOn
10 T. J. Gim, B. J. Lee, and P. K. Shin, J. Korean Vac. Soc. 19, 341 (2010).   DOI
11 T. J. Gim, Y. Choi, P. K. Shin, G. B. Park, H. Y. Shin, and B. J. Lee, J. Korean Vac. Soc. 19, 148 (2010).   DOI
12 M. F. Mabrook, Y. Yun, C. Pearson, D. A. Zeze, and M.l C. Petty, Appl. Phys. Lett. 94, 173302 (2009).   DOI