• 교육녹색환경연구
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• 제17권2호
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• pp.1-10
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• 2018

우리나라는 현재 학생수 급감으로 인하여 학교 신설위주의 학교수용계획 정책 수정이 긴급히 요구되는 일대 전환기를 맞이하고 있다. 이에 따라 적정규모 학교 육성정책도 시급히 수립되어야 하는 실정이다. 특히 학생수 감소 상황에서 특정지역내 무분별한 학교 신설은 주변의 기설학교 학생수를 더욱 감소시키는 악영향을 끼치고 있다. 이를 검증하기 위하여 본 연구에서는 전체 19개시 1,197개교를 대상으로 개교년도와 재학생수와의 상관성 검증을 통하여 적정규모 정책에 대한 기초자료를 제공하고자 하는데, 그 목적이 있다. 전국 4개 권역 19개시 총 1,197개 초등학교를 대상으로 재학생수 현황을 조사하고, 선형회기 분석한 주요 결과는 다음과 같다. 첫째, 전국 19개 시중에서 수원시와 안양시를 제외한 17개 시에서 '신설학교 학생수가 기설학교 학생수보다 많다'는 가설이 성립하는 것으로 나타났다. 둘째, 전국 총 1,197개교를 대상으로 분석한 결과뿐만 아니라 권역별 분석 결과에서도 가설이 성립하는 것으로 나타났다. 셋째, 전국 시지역내 소규모 학교와 과대학교가 많이 발생하고 있어 시급한 적정규모 학교 정책 수립이 필요함을 알 수 있다. 본 연구는 적정규모 정책 수립의 기초자료를 제공하고자 전국 19개시 1,197개 초등학교를 대상으로 연구하게 되었으나, 조사되지 않은 여타 시와 차이를 보일 수 있다. 따라서 여타 시에 대한 추가적인 후속연구가 필요할 것으로 보인다.

• 한국육종학회지
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• 제42권5호
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• pp.534-539
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• 2010

사과 국내 육성 품종인 '홍로'의 형질전환 체계를 확립하고 칼슘이 강화된 '홍로' 형질전환체를 육성하기 위하여 CAX1 유전자 전환을 실시하였다. 접종에 사용되는 절편체는 기내에서 증식 배양 중인 신초의 유엽을 사용하는 경우가 생육기 수체의 유엽을 사용하는 것보다 높은 재분화율을 보여 효과적이었다. 항생제가 첨가된 재분화 선발 배지에서 재분화된 신초들을 대상으로 PCR을 실시한 결과 5개체에서 유전자 도입을 확인할 수 있었고, 이들을 Southern blot 분석한 결과 2개체에서 안정적으로 유전자가 도입되었음을 확인할 수 있었다. 또한 유전자의 정량적 발현 분석을 위해 real-time PCR을 실시한 결과 대조구에 비해 형질전환체 모두에서 CAX1 유전자의 상대적 발현량이 높게 나타났다. 형질 전환체의 칼슘 분석 결과 기내 증식 잎과 결실된 과실의 과육과 잎에서 칼슘 함량이 대조구에 비해 높게 나타났다.

• 한국ITS학회 논문지
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• 제19권6호
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• pp.163-179
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• 2020

플랫폼 기반의 택시서비스의 확대로 이용자의 이동성 및 편의성이 개선되고 있으나, 수익성의 문제로 공급 취약지역이 발생할 것으로 예상된다. 이에 따라 본 연구에서는 대중교통이 종료되는 심야시간을 중심으로 수요 공급의 불균형에 따른 택시 서비스의 공간적 취약성을 분석하였다. Hot-spot 분석결과 승차대비 공차량 및 승차대비 하차량의 경우 도시 외곽지역 및 주거밀집 지역에서 높게 도출되었고, 반대로 도심 및 부도심에서 낮게 나타나는 것을 확인하였다. 중심성 분석 결과 또한 Hot-spot 분석결과와 유사한 패턴으로 분석되었다. 이는 운전자의 관점에서 내향 대비 외향중심성이 낮은 지역은 다음 영업에 한계로 간접승차 거부의 문제가 발생할 수 있으며, 승객의 입장에서는 대기시간 증가로 이어질 것으로 예상된다. 이에 향후 수요공급의 불일치에 의한 공간적 취약성 개선이 필요할 것으로 판단되며, 본 연구의 결과를 기초자료로 활용 할 수 있을 것으로 기대된다.

• 한국물환경학회지
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• 제38권2호
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• pp.103-112
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• 2022

A gold amalgam voltammetric microelectrode (GAVM) system was developed for the quantification of dissolved biogeochemical species, such as O₂, Fe²⁺, Mn²⁺, and HS^- in sediment porewater. Commercially available Ag/AgCl and platinum electrodes were used as the reference and counter electrode, respectively, and a gold amalgam microelectrode was fabricated in the laboratory using 150-um diameter gold wire and a borosilicate capillary tube with a 1.6-mm diameter. A portable potentiostat (Metrohm, DropSens) was used for the application of voltage sweeping and to acquire the electric current. For sediment profiling, a commercially available actuator was customized and modified. The analysis method used in the system used the most widely used analysis method among the electrochemical analysis currently used The GAVM system was successively calibrated with the species and applied to estuarine sediments. The porewater analysis showed that the oxygen concentration was decreased to zero at a depth of 0.6 mm, and maximum Mn²⁺ and Fe²⁺ concentrations of 50 uM and 20 uM were detected at 2 and 3-cm depths, respectively. Maximum HS^- concentrations of 10 uM were detected at 4 cm in the deeper sediments. The GAVM system was successfully developed and applied to the sediment and can be used to better understand biogeochemical reactions.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.197-198
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• 2008

The forging process produces complicated and designed components in a die at high productivity for mass production and minimizes the machining amount for favorable material utilization; the forging products used at highly stressed sections are well accepted at a wide range of industry such as automobile, aerospace, electric appliance and et cetera. Accordingly, recent R&D activities have been emphasized on improvement of forging die-life and near net shaping technology for cost effectiveness and better performance. Usually closing and consolidation of internal void defects in a ingot is a vital matter when utilized as large forged products. It is important to develop cogging process for improvement of internal soundness without a void defect and cost reduction by solid forging alone with limited press capacity. For experiments of cogging process, hydraulic press with a capacity of 800 ton was used together with a small manipulator which was made for rotation and overlapping of a billet. Size of a void was categorized into two types; ${\phi}$ 6.0 mm and ${\phi}$ 9.0 mm to investigate the change of closing and consolidation of void defects existed in the large ingot during the cogging process. In addition for forming experiment of piston grown air drop hammer with a capacity of 16 ton was used. The experiment with piston crown was carried out to show the formability and void closing status. In this paper systematic configuration for closing process of void defects were expressed based on this experiment results in the cogging process. Also forging defects through forming process for piston crown was improved using the experiment results and FE analysis. Consequently this paper deals with the effect of radial parameters in cogging process on a void closure far large forged products and formability of piston crown.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국항공우주학회지
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• 제37권4호
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• pp.344-349
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• 2009

본 논문은 헬기용 주륜 착륙장치의 성능을 향상시킬 목적으로 반능동형 착륙장치를 도입하였다. 상용 유한요소 코드를 이용하여 자기장해석을 한 MR 댐퍼를 완충기에 적용 하였다. 착륙 거동 시 내력으로 발생되는 공기력과 감쇠력의 합을 일정하게 유지시키는 개념의 하중제어기법을 적용하여 반능동형 착륙장치의 제어기를 구성하였다. 다른 형태의 수동형 및 스카이 훅 제어 반 능동형 착륙장치와 함께 ADAMS를 이용한 낙하 시뮬레이션을 수행하였고 착륙특성에 대한 성능평가를 위해 그 결과들을 비교하였다.

• 한국의류학회지
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• 제36권4호
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• pp.391-399
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• 2012

This study helps out-size consumers purchase swimsuits and improves fitness by classifying the torso of middle-aged obese women; in addition, it creates a size system based on each size interval for obese types. The criteria for subjects in this study were over 25kg/$m^2$ of the BMI, over 85cm of waist, and over 95cm of bust; 199 females were surveyed. Three torso types were categorized by a cluster analysis into X type (the vertical size of hip girth was the biggest of the three and the waist was slender), H-O type (larger than other groups in bust girth with more fat above the circumstance of the abdomen), and Y type (the upper half of body development type and lower body fatness were between those of type X and those of type H-O). As a consequence of size system establishment according to obesity types, the basic body sizes and reference body sizes were different according to types even in commonly-appeared size names at sections of respective types. The research findings show the necessity to understand obesity types according to bust girth and hip girth sizes that represent basic sizes as well as to design patterns in consideration of the characteristics of obese body shapes when swimsuits are designed for obese groups. The findings can be used as basic data to decide the desirable output of production according to respective body types.

• 한국통신학회논문지
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• 제38B권2호
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• pp.97-104
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• 2013

본 논문에서는 프레임 기반 스케줄러에서 지연시간에 민감한 트래픽에 대해 지연시간을 쉽게 제한하기 위한 대기시간 기반 주기적 패킷 폐기 기법에 대해 소개한다. 이 기법은 프레임 기반 스케줄러에서 매 스케줄링 시점에 임계값보다 오래 버퍼에 머물러 있는 패킷을 폐기하는 방법으로 지연시간을 제한한다. 본 논문에서는 제안하는 기법에 대해 혼잡상황에서의 평균 큐잉 지연시간 및 패킷 손실율을 수식적으로 분석하고, 시뮬레이션 결과와 비교하였다. 성능 분석 결과, 제안한 패킷 폐기 기법은 임계값 설정으로 패킷의 큐잉 지연시간을 쉽게 제한할 수 있음을 확인하였다. 또한 패킷 폐기를 스케줄링 이전에 수행함으로 서비스 처리율의 제한이 가능함을 확인하였다.