• The Journal of Sustainable Design and Educational Environment Research
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• v.17 no.2
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• pp.1-10
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• 2018

Due to the sudden drop in the number of students currently, Korea is facing a turning point in the urgent need to revise the school acceptance plan policy. Especially, in the case of the decrease of the number of students, the reckless establishment of a school in a certain area has an adverse effect of further reducing the number of students in the nearby school. The purpose of this study is to provide basic data on the appropriate scale policy through the correlation between the opening school year and the number of enrolled students in 19 out of 1,179 schools. The results of the linear regression analysis are as follows : First, in 19 cities nationwide, 17 cities except Suwon city and Anyang city had a hypothesis that 'the number of new school students is more than the number of existing school students'. Second, not only the results of the analysis of 1,179 schools in Korea, but also the results of regional analysis showed a hypothesis. Third, there are many small schools and oversized schools in the national city. It is necessary to establish an appropriate school policy.

• Korean Journal of Breeding Science
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• v.42 no.5
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• pp.534-539
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• 2010

'Hongro' is early-mid maturing cultivar with good quality like 'Tsugaru' and it has not preharvest drop. The CAX1 gene was introduced into Korean apple cultivar 'Hongro' by Agrobacterium tumefaciens LBA4404 harboring pBI121 to obtain transgenic apple with enhanced Ca level. The CAX1 gene playing the role of $H^+/Ca^{2+}$ transporter from Arabidopsis thaliana increases Ca concentration in several plants. Regenerated transgenic lines were confirmed by polymerase chain reaction (PCR) analysis and Southern blot analysis of genomic DNA for the existence of CAX1 gene. Southern blot analysis of 'Hongro' transformants showed that two putative transgenic lines were integrated with CAX1 gene in genomic DNA. The CAX1 comparative expression levels of two transgenic lines were higher than that of non-transformant evaluated by comparative quantification analysis using a real-time PCR. These two lines were multiplied in vitro, and micro-grafted on apple rootstocks 'M.9' in the isolated greenhouse. Since two years after micro-grafting, the fruits came into bearing. Compared to Ca level of the non-transgenic 'Hongro', that of the CAX1 transgenic 'Hongro' in the flesh and leaves was higher.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.19 no.6
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• pp.163-179
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• 2020

With the expansion of platform-based taxi service, mobility and convenience of users are getting better. However, due to profitability problem, marginalized areas in the supply of the service are expected to appear. As such, this study analyzed spatial marginalization of taxi service caused by imbalance in supply and demand during the night-time when public transportation service is suspended. According to hot-spot analysis of taxi, outskirt of a city and residential areas showed high vacancy and greater number of drop-offs compared to the number of pick-ups. On the contrary, they were confirmed low in the center and sub-centers of a city. Centrality analysis also showed a similar pattern with hot-spot analysis. Due to this, drivers may refuse to pick up a customer bound for an area with lower out-degree centrality compared to in-degree centrality as it might be difficult for the drivers to pick up another customer after dropping off the current customer. Thus, customers may need to wait for a taxi for a longer time. For this reason, improvement in spatial marginalization caused by mismatch of supply and demand is required. Also, the outcome of this study is expected to be utilized as a basic data.

• Journal of Korean Society on Water Environment
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• v.38 no.2
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• pp.103-112
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• 2022

A gold amalgam voltammetric microelectrode (GAVM) system was developed for the quantification of dissolved biogeochemical species, such as O₂, Fe²⁺, Mn²⁺, and HS^- in sediment porewater. Commercially available Ag/AgCl and platinum electrodes were used as the reference and counter electrode, respectively, and a gold amalgam microelectrode was fabricated in the laboratory using 150-um diameter gold wire and a borosilicate capillary tube with a 1.6-mm diameter. A portable potentiostat (Metrohm, DropSens) was used for the application of voltage sweeping and to acquire the electric current. For sediment profiling, a commercially available actuator was customized and modified. The analysis method used in the system used the most widely used analysis method among the electrochemical analysis currently used The GAVM system was successively calibrated with the species and applied to estuarine sediments. The porewater analysis showed that the oxygen concentration was decreased to zero at a depth of 0.6 mm, and maximum Mn²⁺ and Fe²⁺ concentrations of 50 uM and 20 uM were detected at 2 and 3-cm depths, respectively. Maximum HS^- concentrations of 10 uM were detected at 4 cm in the deeper sediments. The GAVM system was successfully developed and applied to the sediment and can be used to better understand biogeochemical reactions.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.197-198
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• 2008

The forging process produces complicated and designed components in a die at high productivity for mass production and minimizes the machining amount for favorable material utilization; the forging products used at highly stressed sections are well accepted at a wide range of industry such as automobile, aerospace, electric appliance and et cetera. Accordingly, recent R&D activities have been emphasized on improvement of forging die-life and near net shaping technology for cost effectiveness and better performance. Usually closing and consolidation of internal void defects in a ingot is a vital matter when utilized as large forged products. It is important to develop cogging process for improvement of internal soundness without a void defect and cost reduction by solid forging alone with limited press capacity. For experiments of cogging process, hydraulic press with a capacity of 800 ton was used together with a small manipulator which was made for rotation and overlapping of a billet. Size of a void was categorized into two types; ${\phi}$ 6.0 mm and ${\phi}$ 9.0 mm to investigate the change of closing and consolidation of void defects existed in the large ingot during the cogging process. In addition for forming experiment of piston grown air drop hammer with a capacity of 16 ton was used. The experiment with piston crown was carried out to show the formability and void closing status. In this paper systematic configuration for closing process of void defects were expressed based on this experiment results in the cogging process. Also forging defects through forming process for piston crown was improved using the experiment results and FE analysis. Consequently this paper deals with the effect of radial parameters in cogging process on a void closure far large forged products and formability of piston crown.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.4
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• pp.344-349
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• 2009

To improve performance of the main landing gear for helicopters, a semi-active control landing gear is introduced in this paper. An MR damper based on commercial finite element electromagnetic field analysis of an electromagnet has been adapted the shock absorber. Force control algorithm (which maintains constantly the sum of air spring force and damping force as internal forces) which keep the sum of air spring force and damping force constant during landing, has been used for the controller, applied to control the semi-active landing gear. A series of drop simulations using ADAMS has been done with the passive, sky-hook control type, and force control type landing gears. The result of each simulation has been compared to evaluate the landing performance of the proposed force control type landing gear.

• Journal of the Korean Society of Clothing and Textiles
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• v.36 no.4
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• pp.391-399
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• 2012

This study helps out-size consumers purchase swimsuits and improves fitness by classifying the torso of middle-aged obese women; in addition, it creates a size system based on each size interval for obese types. The criteria for subjects in this study were over 25kg/$m^2$ of the BMI, over 85cm of waist, and over 95cm of bust; 199 females were surveyed. Three torso types were categorized by a cluster analysis into X type (the vertical size of hip girth was the biggest of the three and the waist was slender), H-O type (larger than other groups in bust girth with more fat above the circumstance of the abdomen), and Y type (the upper half of body development type and lower body fatness were between those of type X and those of type H-O). As a consequence of size system establishment according to obesity types, the basic body sizes and reference body sizes were different according to types even in commonly-appeared size names at sections of respective types. The research findings show the necessity to understand obesity types according to bust girth and hip girth sizes that represent basic sizes as well as to design patterns in consideration of the characteristics of obese body shapes when swimsuits are designed for obese groups. The findings can be used as basic data to decide the desirable output of production according to respective body types.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38B no.2
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• pp.97-104
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• 2013

This paper introduces waiting time based periodic packet discard policy for frame based scheduler. This policy can be used with conventional packet discard policy or buffer management schemes, such as drop-tail or random early detection. Proposed discard policy discards packets, which are stayed in the buffer longer than threshold, at every period of scheduling. This decision of discard is based on waiting time of packet. In this paper, mathematical analysis is performed with situation of network congestion. Also, the simulation is performed to evaluate the performance of proposed discard policy. In the result, proposed discard policy can limit queuing delay by threshold. Also, if the packet discard is performed before scheduling and threshold is set with smaller value than frame length, it can limit the throughput of traffic.