• Title/Summary/Keyword: Driver of TEC

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A Study on SOA Driver with Capability to Control Current and Temperature Transient Response (온도 및 전류의 과도응답 제어가 가능한 SOA Driver에 관한 연구)

  • Eom, Jinseob
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.2
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    • pp.1-8
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    • 2014
  • In this paper, SOA Current and Temperature Driver which consisted of LabVIEW programming part capable of current and temperature transient response pattern design, DAQ module for analog voltage in&out, and voltage to current converting chips has realized. The output current(possible to 3A) from the Driver to SOA was clearly constant without ripple and also showed no variance until 1mA unit for a long time operation. The temperature of TEC took several seconds to reach a set temperature, and were maintained stably within ${\pm}^0.1{\circ}C$ for several hours. The proposed Driver can replace the previous high cost SOA Drivers for wavelength swept lasers fully and provides the convenience of transient response design capability for current and temperature.

A Design of Thin Film Thermoelectric Cooler for Chip-on-Board(COB) Assembly (박막형 열전 소자를 이용한 Chip-on-Board(COB) 냉각 장치의 설계)

  • Yoo, Jung-Ho;Lee, Hyun-Ju;Kim, Nam-Jae;Kim, Shi-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.9
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    • pp.1615-1620
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    • 2010
  • A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

Design of High Power Laser Diode Driver (고출력 레이저 다이오드 드라이버 설계)

  • Kim, Young-Keun;Yeom, Jin-Su;Hwang, Dae-Seok;Ryu, Kwang-Ryol;Hur, Chang-Wu
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.10a
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    • pp.104-107
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    • 2008
  • 고출력 레이저 다이오드는 소형화되면서 생산 단가가 낮아지는 것에 비해 출력은 점점 더 커지고 있기 때문에 많은 산업 응용 분야에 확대되고 있다. 본 논문에서는 고출력 레이저 다이오드의 안정성과 고정된 출력 파워의 광원을 제공하기 위한 설계의 목적이 있다. 안정된 정전류를 위하여 온도와 전류의 안정성이 중요하다. 이를 위하여 본 연구에서는 레이저 다이오드 내부의 온도센서와 TEC(Thermo Electric Cooler)를 이용한 온도제어 회로를 구성하였다. 이들을 제어하기 위하여 A/D, D/A 컨버터와 마이크로프로세서를 사용하였으며, 정전류 50A일 때 35W 출력과 온도 범위는 ${\pm}0.5^{\circ}$로 설계를 하였다.

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